共查询到18条相似文献,搜索用时 218 毫秒
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基于相位控制的硅微机械陀螺驱动控制技术 总被引:2,自引:1,他引:1
全面分析、研究并实现了一种基于相位控制的硅微机械陀螺(Silicon micromechanical gyroscope, SMG)驱动控制技术. 分析了硅微陀螺驱动模态的动力学特性,阐述了相位控制方案的基本原理; 在此基础上建立了控制环路,采用自激振荡理论分析了其稳定性; 建立了环路的相位模型,引入特异因子实现相位控制误差到频率差 (工作频率与驱动模态谐振频率之差)的转换; 建立了对应于相位控制环路的频率模型,当环路滤波器为一阶模型时, 与传递函数为二阶的信号跟踪锁相环(Phase locked loop, PLL)不同,总的闭环模型仅为一阶; 最后基于FPGA平台,采用线性鉴相方式设计了数字化相位控制环路, 并结合幅值控制实现了双闭环驱动控制电路.测试结果表明, 该方案可实现硅微陀螺驱动端的高精度控制. 相似文献
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为更准确辨识三轴硅微谐振加速度计的误差系数,提高加速度计在飞行器上的加速度矢量测量精度,设计基于精密离心机的加速度计标定方法。分析硅微谐振加速度计的工作原理及误差项,在考虑离心机主要误差源的基础上建立包含零位偏移、标度因数、非正交安装误差、二次项误差与横向灵敏度的硅微谐振加速度计误差模型;设计离心机匀角加速度旋转的三姿态标定方法,在径向轴高g输入的同时,增加角加速度激励,可以更好标定加速度计横向灵敏度;对所提出的标定方法进行仿真,通过最小二乘法完成模型参数辨识。仿真结果表明,参数辨识相对误差可控制在2%以内,二次项系数与横向灵敏度辨识精度均小于1μg。 相似文献
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本文提出了基于数字信号处理器TMS320F2810的数字控制、PWM静电力反馈硅微加速度计方案.介绍了该方案的基本工作原理,建立了相应的闭环系统数学模型,并在s域设计了系统校正环节.文章还提出了数字校正环节的设计方法,并分析了其对系统动态特性的影响.该方案可以实现硅微加速度计的数字闭环控制,并可以实现加速度计的PWM数字信号输出. 相似文献
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基于谐振式硅微结构压力传感器幅、相频率特性的分析,利用北京航空航天大学微传感器实验室研制的谐振式硅微结构传感器开环测试系统的测试实验结果和Matlab实验数据处理与拟和分析计算,建立了微传感器的二阶模型.该模型排除了未知相位延迟的影响,从幅值和相位混合的测试数据中精确计算出谐振频率、品质因数以及相位特性,为闭环测试系统的研制提供了依据. 相似文献
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为提高谐振式加速度计灵敏度、稳定性以及减小加速度计体积,本文提出一种结构新颖的谐振式硅微加速度计。采用一级微杠杆机构对质量块惯性力进行放大,通过一对差动布置的双端固支音叉谐振器的固有频率变化检测惯性力,从而实现对加速度的测量。该加速度计可采用体硅加工工艺,给出了总体工艺流程。采用解析和有限元分析方法对加速度计敏感元件进行了分析,有限元分析结果与解析分析结果相吻合,有限元分析可得加速度计灵敏度为57.4 Hz/gn。分析结果表明该加速度计结构具有高灵敏度、高温度稳定性和小体积等优点。 相似文献
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研究了一种主要应用于碰撞测试领域的硅微机械高性能压阻式加速度计,量程范围为2 000 gn.为满足技术性能要求,加速度计采用一种三梁-质量块结合梳齿阻尼器的新颖结构,从而可以同时具有高灵敏度及高动态特性(包括高谐振频率及精确阻尼控制).这种加速度计采用n型(100)普通硅片制作,主要工艺过程包括双面ICP深刻蚀和压阻集成工艺.振动台测试结果表明,加速度计的灵敏度为0.11 mV/gn/5 V,谐振频率为31 kHz,灵敏度±5%变化下平坦带宽大于5 kHz.采用落杆测试法测试了加速度计的冲击响应及0~2 000 gn满量程范围内的非线性度.封装后的加速度计承受15 000 gn的冲击测试后没有受到损坏. 相似文献
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一种新结构硅微机械压阻加速度计 总被引:6,自引:3,他引:3
设计、制造并测试了一种新结构硅微机械压阻加速度计.器件结构是悬臂梁-质量块结构的一种变形.比较硬的主悬臂梁提供了一定的机械强度,并且提供了高谐振频率.微梁很细,检测时微梁沿轴向直拉直压.力敏电阻就扩散在微梁上,质量块很小的挠动就能在微梁上产生很大的应力,输出很大的信号.5 V条件下,灵敏度为14.80 mV/g,谐振频率为994 Hz,分别是传统结构压阻加速度计的2.487倍和2.485倍.加速度计用普通的N型硅片制造,为了刻蚀高深宽比的结构,使用了深反应离子刻蚀(DRIE)工艺. 相似文献
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本文针对硅微机械结构振动幅度由于封装难以计算机视觉测量及电学测量中的精度受接口电路参数影响的问题,在对静电梳齿驱动、平板电容检测的硅微谐振结构进行建模分析后,提出基于单边带电压比的电学测量振动幅度的方法并分析了测量方法的原理。实验表明研制的某硅微机械谐振加速度计在受迫振动下的振动幅度为0.25um,频谱分析还表明存在上电噪声引起的振动幅度,该测试方法还能应用于硅微谐振结构的谐振频率测量,同时为高品质因数的硅微机械谐振结构的可静电自激驱动提供了依据。 相似文献
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Xiaofeng Zhou Lufeng Che Youling Lin Xiaolin Li Jian Wu Yuelin Wang 《Microsystem Technologies》2014,20(7):1365-1372
This paper presents a symmetrical double-sided serpentine beam-mass structure design with a convenient and precise process of manufacturing MEMS accelerometers. The symmetrical double-sided serpentine beam-mass structure is fabricated from a single double-device-layer SOI wafer, which has identical buried oxides and device layers on both sides of a thick handle layer. The fabrication process produced proof mass with though wafer thickness (860 μm) to enable formation of a larger proof mass. Two layers of single crystal silicon serpentine beams with highly controllable dimension suspend the proof mass from both sides. A sandwich differential capacitive accelerometer based on symmetrical double-sided serpentine beams-mass structure is fabricated by three layer silicon/silicon wafer direct bonding. The resonance frequency of the accelerometer is measured in open loop system by a network analyzer. The quality factor and the resonant frequency are 14 and 724 Hz, respectively. The differential capacitance sensitivity of the fabricated accelerometer is 15 pF/g. The sensitivity of the device with close loop interface circuit is 2 V/g, and the nonlinearity is 0.6 % over the range of 0–1 g. The measured input referred noise floor of accelerometer with interface circuit is 2 μg/√Hz (0–250 Hz). 相似文献
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The fabrication and characterization of resonant silicon accelerometers, made in bulk micromachining technology, is presented. The devices consist of a silicon mass, coupled axially to a strain-sensitive vibrating silicon beam. The beam is driven electrothermally and sensed piezoresistively by means of implanted piezoresistors. Two different accelerometer types are shown, differing in the complexity of the respective fabrication processes and in performances. Closed-loop operation of the devices is demonstrated. Also in the closed loop, static and dynamic measurements of prototypes have been performed. The sensor types presented are compared, and the resonant acceleration sensor concept is discussed 相似文献
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Microleverage mechanism which is widely applied in microelectromechanical systems (MEMS) transfers and amplifies force or displacement from input to output. In this work, one-stage microleverage mechanism is integrated into a biaxial micro resonant accelerometer to improve sensitivity. Force amplification factor of the microleverage is analyzed and deduced by integral method. The results from theoretical model match well with the ones from finite element method (FEM) simulation, which proves that the proposed model is relatively accurate and the width of lever beam is a quite important parameter in design. The resonant accelerometer is successfully fabricated by MEMS technology. Preliminary experiments are conducted and demonstrate differential sensitivity of 71 Hz/g for the accelerometer with resonant frequency of 267.726 kHz. 相似文献
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In view of the shortcomings of silicon micro acceleration sensor based on piezoresistive effect and capacitance principle,
such as temperature drift, low resolution and poor anti-interference ability, a fuze acceleration sensor based on dual SAW devices is
proposed. The sensor adopts a dual saw device structure, one is coated with a sensitive film for measurement, the other is an uncoat-
ed reference channel for compensation of environmental temperature, pressure, humidity and other factors. The experimental results
show that the maximum linear error is only 1.6%, the sensitivity is 54.3Hz/g, and the maximum hysteresis error is less than 1%.
Compared with piezoresistive accelerometer and capacitive accelerometer, the linear error of the accelerometer is small, the sensitivi-
ty is high, and it has strong anti-interference ability. 相似文献