线形拟合在X射线衍射研究GaN薄膜材料结构时的必要性

利用高分辨X射线衍射仪(XRD)分析了长时间退火前后的GaN样品.通过对各个样品的(0002)面摇摆曲线进行线形拟合及分析,发现虽然退火后摇摆曲线的半峰宽变大,但面外倾斜角(tilt)的值却变小,从而螺型穿透位错(TD)密度变小,这与化学腐蚀实验的结果一致.我们的结果表明,线形拟合在利用XRD研究GaN薄膜材料结构的过程中是十分必要的,而不能用摇摆曲线的展宽直接表征TD密度.     

原位退火对HVPE生长的GaN外延层光学性质和结构的影响

研究了原位退火对用氢化物外延方法在(0001)面蓝宝石衬底上生长的氮化镓(GaN)外延薄膜的结构和光学性能的影响.测试表明,氨气气氛下在生长温度进行的原位退火,明显提高了GaN外延膜的质量.X射线衍射(XRD)分析表明,随着原位退火时间的增加,(0002)面和(1012)面摇摆曲线的半峰宽逐渐变窄.喇曼散射谱显示样品退火后E2(high)峰位向低频区移动;随着退火时间的延长,趋向于块状GaN的峰位.可见,原位退火使GaN外延膜中的双轴应力明显减少.光致发光的测试结果与XRD和喇曼散射谱的结论一致.表明原位退火能有效提高GaN外延膜的结构和光学性能.     

原位退火对HVPE生长的GaN外延层光学性质和结构的影响

研究了原位退火对用氢化物外延方法在(0001)面蓝宝石衬底上生长的氮化镓(GaN)外延薄膜的结构和光学性能的影响.测试表明,氨气气氛下在生长温度进行的原位退火,明显提高了GaN外延膜的质量.X射线衍射(XRD)分析表明,随着原位退火时间的增加,(0002)面和(1012)面摇摆曲线的半峰宽逐渐变窄.喇曼散射谱显示样品退火后E2(high)峰位向低频区移动;随着退火时间的延长,趋向于块状GaN的峰位.可见,原位退火使GaN外延膜中的双轴应力明显减少.光致发光的测试结果与XRD和喇曼散射谱的结论一致.表明原位退火能有效提高GaN外延膜的结构和光学性能.     

利用X射线衍射研究Mg掺杂的InN的快速退火特性

研究了不同的快速退火(RTA)温度对Mg掺杂的InN材料的影响。根据马赛克微晶模型,利用X射线衍射(XRD)技术,对样品的对称面和非对称面做ω扫描,并且通过倒异空间图(RSM)扫描,拟合得到了刃位错与螺位错密度,并且根据在不同快速退火温度条件下位错密度的比较,同时结合迁移率的测量结果,发现快速退火温度采用400℃能有效地提高晶体的质量。原因在于快速退火能有效地激活Mg原子活性,降低材料中的载流子浓度,同时快速退火采用的氮气气氛能补偿部分起施主作用的氮空位,降低材料中载流子浓度的同时也降低了缺陷。同时,(002)面的摇摆曲线半峰全宽(FWHM)也很好地验证了所得结果。     

射频溅射ZnO作缓冲层的HVPE法生长GaN厚膜

在低温HVPE-GaN/c-Al2O3模板上射频溅射ZnO作为缓冲层,采用氢化物气相外延(HVPE,hydridevapoarphaseepitaxy)法外延生长了高质量的GaN320μm厚膜。用高分辨率双晶X射线衍射仪(DCXRD)、原子力显微镜(AFM)和扫描电子显微镜(SEM)分析了制备的GaN厚膜特性。结果表明,GaN(0002)面的X射线摇摆曲线衍射峰半高宽(FWHM)为336.15arcsec,穿透位错密度(TDD)为107cm-2,外延生长的GaN厚膜晶体质量较好,可以作为自支撑GaN衬底。     

不同厚度未掺杂GaN薄膜的特性分析

对厚度不同的样品进行了XRD和PL谱测量,由(0002)面、(30—32)面的摇摆曲线的半峰宽值和GaN(0002)衍射峰位置计算了样品的刃位错、螺旋位错的密度以及C轴应变,实验结果表明厚度增加后Gain薄膜中的刃位错、螺旋位错密度及C轴薄膜应力均得到减小,而PL谱带边峰和蓝带强度显著增强。分析认为：厚度增加后,位错减少是由材料生长过程中位错的合并和湮灭作用造成的;样品PL谱的带边峰和蓝带强度显著增强是因为位错引入的非辐射性复合中心数目减少。     

异质外延GaN中穿透位错对材料发光效率的影响

用阴极射线致发光(CL)法、透射电子显微镜(TEM)和X射线衍射(XRD)法研究了异质外延GaN材料的发光性质与结构特性的关系.结果表明,GaN外延层中的穿透位错是材料有效的非辐射复合中心,但GaN的CL带边峰强度并不随位错密度的增加而减少.两步法生长GaN形成的马赛克结构的亚晶粒尺寸和晶粒间合并产生的位错的弯曲程度是影响材料发光效率的关键.     

异质外延GaN中穿透位错对材料发光效率的影响

用阴极射线致发光(CL)法、透射电子显微镜(TEM)和X射线衍射(XRD)法研究了异质外延GaN材料的发光性质与结构特性的关系.结果表明,GaN外延层中的穿透位错是材料有效的非辐射复合中心,但GaN的CL带边峰强度并不随位错密度的增加而减少.两步法生长GaN形成的马赛克结构的亚晶粒尺寸和晶粒间合并产生的位错的弯曲程度是影响材料发光效率的关键.     

成核层退火压力对形成高阻GaN的作用

采用了MOCVD生长技术来获得高阻GaN,发现GaN的方块电阻会随着成核层退火压力的降低而迅速升高.当成核层退火压力降到75torr时,形成了高阻GaN,方块电阻达到1011Ω/□以上.原子力显微镜结果显示高阻GaN的表面非常平整,表面粗糙度只有0.15nm.在位激光检测发现高阻样品的成核层经过退火后会形成密度较高的成核岛.样品的X射线分析结果表明,随着退火压力的改变,刃型位错相对于螺型位错会有较大变化.说明刃型位错是GaN电阻变化的主要原因.     

成核层退火压力对形成高阻GaN的作用

采用了MOCVD生长技术来获得高阻GaN,发现GaN的方块电阻会随着成核层退火压力的降低而迅速升高.当成核层退火压力降到75torr时,形成了高阻GaN,方块电阻达到1011Ω/□以上.原子力显微镜结果显示高阻GaN的表面非常平整,表面粗糙度只有0.15nm.在位激光检测发现高阻样品的成核层经过退火后会形成密度较高的成核岛.样品的X射线分析结果表明,随着退火压力的改变,刃型位错相对于螺型位错会有较大变化.说明刃型位错是GaN电阻变化的主要原因.     

Investigation of Ga oxide films directly grown on n-type GaN by photoelectrochemical oxidation using He-Cd laser

By using a He-Cd laser in a chemical solution of H₃PO₄ with a pH value of 3.5, Ga oxide films were directly grown on n-type GaN. From the energy-dispersive spectrometer (EDS) measurement and x-ray diffraction (XRD) measurement, the grown Ga oxide film was identified as (104) α-Ga₂O₃ structure. A small amount of phosphors existed and bonded with oxygen on the grown films. The as-grown films were amorphous. From the XRD analysis, it is evident that annealing of the α-Ga₂O₃ films led to a change in the microstructure from an amorphous to a polycrystalline phase. In addition, the as-grown low-density films gradually became dense films during the annealing process. Furthermore, the surface roughness of the annealed films also gradually decreased. Hexagonal pinholes on the grown films were observed. The density of the hexagonal pinholes was similar to the defect density of the n-type GaN. From the cross-sectional transmission electron microscopy (TEM) micrographs, it is evident that the hexagonal pinholes originated from defects in the n-type GaN.     

Growth and Characterization of GaN Nanowires for Hydrogen Sensors

We report on the growth and characterization of high-quality GaN nanowires for hydrogen sensors. We grew the GaN nanowires by catalytic chemical vapor deposition (CVD) using gold thin films as a catalyst on a Si wafer with an insulating SiO₂ layer. Structural characterization of the as-grown nanowires by several methods shows that the nanowires are single-crystal wurtzite GaN.␣Photoluminescence measurements under 325 nm excitation show a near-band-edge emission peak around ∼3.4 eV. The hydrogen sensors are fabricated by contacting the as-grown GaN nanowires by source and drain electrodes and coating them with a thin layer of Pd. Hydrogen sensing experiments using the fabricated devices show high sensitivity response (ppm detection limit at room temperature) and excellent recovery. This work opens up the possibility of using high-quality GaN nanowire networks for hydrogen sensing applications.     

硅基镓浓度对GaN晶体膜质量的影响

采用射频磁控溅射工艺在扩镓硅基上溅射Ga2O3薄膜，再氮化反应组装GaN晶体膜，并对其生长条件进行了研究。用傅里叶红外谱仪(FTIR)、X射线衍射(XRD)、扫描电镜(SEM)、选区电子衍射(SAED)和光致发光(PL)谱对样品进行结构、形貌和发光特性的分析。测试结果表明，采用此方法可得到六方纤锌矿结构的GaN晶体膜。镓浓度在影响膜层质量方面起着不可忽视的作用，随着扩镓浓度的增加，薄膜的晶化程度和发光特性明显提高。     

Epitaxial growth of (11\bar 20) ZnO on (01\bar 12) Al2O3 by metalorganic chemical vapor deposition2) Al2O3 by metalorganic chemical vapor deposition

There has been increased interest in high quality ZnO films for use in a diverse range of applications such as in high frequency surface acoustic wave filters, buffer layers for GaN growth, transparent and conductive electrodes, and solid state lasers. In the present paper, ZnO films were epitaxially grown on R-plane sapphire substrates by metalorganic chemical vapor deposition at temperatures in the range 350–450°C. X-ray diffraction and electron microscopy results indicate that the ZnO films are epitaxially grown on ( $01\bar 12$ ) Al₂O₃ surface with the ( $11\bar 20$ ) plane parallel to the surface. Cross-sectional high resolution-transmission electron microscopy imaging of the as-grown film shows that the interface is semi-coherent and atomically sharp, with misfit dislocations relieving the misfit strain between ZnO and sapphire. In order to check the thermal stability of the as-grown ZnO films, annealing in an O₂+N₂ ambience at 850°C for 30 min was performed. The annealed films showed improved crystallinity. At the same time, limited reaction between ZnO and sapphire occurred, resulting in the formation of a 15–20 nm thick spinel layer at the interface.     

ZnO缓冲层和退火处理对MgO薄膜结构的影响

采用直流反应磁控溅射法在Si衬底上引入ZnO缓冲层制备了沿(200)晶面择优取向生长的MgO薄膜,然后分别采用快速退火和常规退火两种不同的方式对MgO薄膜进行晶化处理。利用X射线衍射仪(XRD)以及原子力显微镜(AFM)研究了ZnO缓冲层以及两种不同的退火方式对MgO薄膜的结构和形貌的影响。结果表明:具有合适厚度的ZnO缓冲层可以显著地提高MgO薄膜的结晶质量。另外,与快速退火相比,常规退火处理后得到的MgO晶粒均匀圆润,有着较大的(200)衍射峰强度以及较小的表面粗糙度。     

Low-temperature ECR-PEMOCVD deposition of high-quality crystalline gallium nitride films: A comparative study of intermediate layers for growth on amorphous glass substrates

A low temperature growth method based on an electron cyclotron resonance plasma-enhanced metal organic chemical vapor deposition system (ECR-PEMOCVD) was proposed for the growth of GaN (Gallium nitride) films on ordinary amorphous soda-lime glass substrates. To alleviate the large lattice mismatch between GaN film and glass substrate and improve the heat dissipation performance for potential optoelctrical device application, five intermediate layers (Cu, Ni, Ti, Ag, and ITO) were deposited on the glass substrate before the growth of GaN. A comparative study was performed through structural analysis of the as-grown GaN films with various intermediate layers investigated by means of in-situ reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), and atomic force microscopy (AFM). The results indicate that the Ti intermediate layer has a great advantage over other intermediate layers in view of crystalline quality and smooth surface, therefore is more suitable and preferred for the potential application in optoelectronic devices.     

Fabrication by Coaxial-Type Vacuum Arc Evaporation Method and Characterization of Bismuth Telluride Thin Films

We prepared both n- and p-type bismuth telluride thin films by using a coaxial-type vacuum arc evaporation method. The atomic compositions of the as-grown thin films and several annealed thin films were comparable to that of bulk bismuth telluride. Their thermoelectric properties were measured and found to be comparable to those of bulk materials. The Seebeck coefficient and electrical conductivity of the as-grown thin films were improved by the annealing process. The measured figures of merit (ZT) of the films were 0.86 for the n-type and 0.41 for the p-type at 300 K for annealing temperatures of 573 K and 523 K, respectively.     

溅射AlN技术对GaN基LED性能的影响

研究了在图形蓝宝石衬底(PSS)上利用磁控溅射制备AlN薄膜的相关技术,随后通过采用金属有机化学气相沉积(MOCVD)在相关AlN薄膜上生了长GaN基LED.通过一系列对比实验,分析了AlN薄膜的制备条件对GaN外延层晶体质量的影响,研究了AlN薄膜溅射前N2预处理功率和溅射后热处理温度对GaN基LED性能的作用机制.实验结果表明:AlN薄膜厚度的增加,导致GaN缓冲层成核密度逐渐升高和GaN外延膜螺位错密度降低刃位错密度升高;N2处理功率的提升会加剧衬底表面晶格损伤,在GaN外延膜引入更多的螺位错;AlN热处理温度的升高粗化了表面并提高了GaN成核密度,使得GaN外延膜螺位错密度降低刃位错密度升高;而这些GaN外延膜位错密度的变化又进一步影响到LED的光电特性.     

Photoassisted Chemically Deposited Tin Sulfide Thin Films Based on Two Different Chemical Formulations

Photoassisted chemical deposition is a customized form of chemical bath deposition where the reaction is carried out in the presence of ultraviolet light. Deposition of tin sulfide films was carried out by this method using two different chemical baths. The as-prepared samples from the acetone bath were crystalline, exhibiting the orthorhombic structure of the Sn₂S₃ phase, but those from the glacial acetic acid bath were amorphous. The crystallinity of the films was improved on annealing. The deposition rate was found to depend on the pH of the bath and the chemical formulation. Distinct morphology was obtained for as-grown films. The films from the acetone bath were compact with uniform morphology of needle-shaped grains having equal diameters and lengths. The films from the glacial acetic acid bath were similar, with smaller needles. The high absorption coefficients of as-grown and annealed films show their potential application as absorber layers in photovoltaic devices. The refractive index was estimated from the reflectance of the films. The estimated activation energies of the as-prepared films from the acetone and glacial acetic acid baths were 0.4 eV and 0.46 eV, whereas those of the annealed samples were 0.2 eV and 0.44 eV, respectively. The activation energy was found to decrease for annealed films due to a decrease in trap sites.     

退火温度对硅基GaN薄膜质量的影响

采用电泳沉积法在Si(111)衬底上制备GaN薄膜,并研究退火温度对GaN薄膜晶体质量、表面形貌和发光特性的影响。傅立叶红外吸收谱(FTIR)、X射线衍射(XRD)和扫描电镜(SEM)的测试结果表明所得样品为六方纤锌矿结构的GaN多晶薄膜,随退火温度的升高,晶粒尺寸增大,结晶化程度提高。室温下光致发光谱的测试发现了位于367 nm处的强发光峰和437 nm处的弱发光峰,其发光强度随退火温度的升高而增强,但发光峰的位置并不发生移动。