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1.
报道了利用LP-MOVPE技术生长高质量的InGaAs/InGaAsP分别限制应变量子阱激光器结构材料、激光器制作和结果.宽而激光器实现了室温脉冲受激发射.激射波长为1.49μm,在腔长为2000μm时,最低阈值电流密度为0.30kAcm-2.最大脉冲光输出峰值功率达500mW以上.同时,从理论和实验上研究了阙值电流及阙值电流密度随激光器腔长的变化关系,并与LP-MOVPE生长制作的宽面双异质结构激光器进行了比较.  相似文献   

2.
利用金属蒸汽真空弧(MEVVA)离子源引出强流Ti离子注入单晶硅,当MEVVA源引出电压为40kV,束流密度达到100μA/cm2,Ti离子剂量为5×1017/cm2,Ti离子注入单晶硅可得到C54-TiSi2的注入层,且薄层电阻低于3.0Ω/□.本文用束流热效应讨论了形成硅化物的机理.  相似文献   

3.
0.2μmCMOS门阵列日本NTT公司采用SIMOX(SiliconIsolationbyImplantedOxygen)工艺研制成功0.2μmCMOS门阵列。产品特点是低功耗和高集成度,其功耗是0.5μmCMOS门阵列的10倍。产品的电路元件由波长...  相似文献   

4.
LP-MOCVD制备AlGaInP高亮度橙黄色发光二极管   总被引:6,自引:3,他引:3  
利用LP-MOCVD外延生长AlGaInPDH结构橙黄色发光二极管.引入厚层Al0.7Ga0.3As电流扩展层和Al0.5Ga0.5As-AlAs分布布拉格反射器(DBR).20mA工作条件下,工作电压1.9V,发光波长峰值在605nm,峰值半宽为18.3nm,管芯平均亮度达到20mcd,最大29.4mcd,透明封装成视角(2θ1/2)15°的LED灯亮度达到1cd.  相似文献   

5.
本文着重研究了0.6μmTiSi2PolycideLDDNMOS器件工艺技术.用RIE刻蚀获得了0.6μm严格各向异性的精细结构2分析研究表明TEOSSiO2膜厚tf、多晶硅栅的剖面倾角θ是影响侧壁宽度W的重要因素,经优化后可控制W为0.30~0.32μm;在Al与Si之间引入一层TiN/Ti复合层作为Al-Si间的扩散势垒层,获得了良好的热稳定性.上述工艺技术已成功地应用于0.6μmTiSi2PolycideLDDE/DMOS31级环形振荡器的研制,其平均缴延迟为310Ps(0.29mW/级),工作电压  相似文献   

6.
借助一新的工艺模拟与异质器件模型用CAD软件──POSES(Poisson-SchroedingerEquationSolver),对以AlGaAs/InGaAs异质结为基础的多种功率PHEMT异质层结构系统(传统、单层与双层平面掺杂)进行了模拟与比较,确定出优化的双平面掺杂AlGaAs/InGaAs功率PHEMT异质结构参数,并结合器件几何结构参数的设定进行器件直流与微波特性的计算,用于指导材料生长与器件制造。采用常规的HEMT工艺进行AlGaAs/InGaAs功率PHEMT的实验研制。对栅长0.8μm、总栅宽1.6mm单胞器件的初步测试结果为:IDss250~450mA/mm;gm0250~320mS/mm;Vp-2.0-2.5V;BVDS5~12V。7GHz下可获得最大1.62W(功率密度1.0W/mm)的功率输出;最大功率附加效率(PAE)达47%。  相似文献   

7.
硅基GaAs/GaAlAs平面光波导的研究   总被引:1,自引:0,他引:1  
分析了金属有机化合物化学气相淀积(MOCVD)GaAs/GaAsAl/GaAs/Si材料结构的性能,用MOCVD法地硅衬底上生长了GaAs/GaAsAl/GaAs材料,并用这种材料制备了平面光波导样品,测定了1.3μm,单模激光的传输损耗小于0.65dB/cm。  相似文献   

8.
合成了一种新型的Eu^3+配合物-Eu(BA)2(MAA)(Phen),并将其作为红光发射材料制备了结构为Glass/ITO/Eu(BA)2(MAA)(Phen)/A1r的有机电致发光薄膜器件。这种材料具有很强的荧光和很好的单色性且比较强的电致发光。器件的开戾电压为12V。在电压为26V的正向驱动下,器件的亮度为15cd/m^2,发光效率为0.251m/W。结合测量粉末、薄膜状态下的荧光光谱、激发  相似文献   

9.
高效AlxGa_(1—x)As/GaAs太阳电池的研制及辐照效应   总被引:2,自引:0,他引:2  
用液相外延(LPE)技术制备了全面积转换效率为18.65%(1.08cm2,AM0,1sun)及17.33%(2×2cm2,AM0,1sun)的AlxGa1-xAs/GaAs(x>0.8)太阳电池,1MeV电子辐照实验表明,浅结电池的抗辐照能力比深结的强,退火可以恢复辐照损伤.  相似文献   

10.
用ATEM室准确测试电子设备的电磁辐射敏感度   总被引:1,自引:0,他引:1  
本文介绍用非对称横电磁波室(AsymmetricTransverseElectromagneticTransmissionCell,简称ATEM室)准确测试电子设备的电磁辐射敏感度。ATEM室为封闭式,总长2.4m,主段横截面呈正方形,尺寸为1.2m×1.2m。上半空间高0.3m,下半空间高0.9m,置有导轨、转台及吸波材料。工作频率范围DC~5000MHz。以ATEM为中心构成的标准场装置能产生10μV/m~60V/m的标准场强。下半空间能放入个人电脑、22寸彩电或其它电子设备,进行电磁辐射敏感度试验。试验过程用一计算机控制。辐射敏感度测试系统具有工作频率范围宽,无电磁辐射污染,容易操作和准确度较高等一系列优点。  相似文献   

11.
DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.  相似文献   

12.
High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET > PDMAT > TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.  相似文献   

13.
In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal (200) (2d = 0.4027 nm) is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line(w), the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line(x), the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines(y), the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line(z) in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line(q) in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution(λ/△ 2) is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.  相似文献   

14.
From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.  相似文献   

15.
The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.  相似文献   

16.
The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.  相似文献   

17.
Today, micro-system technology and the development of new MEMS (Micro-Electro-Mechanical Systems) are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.  相似文献   

18.
This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.  相似文献   

19.
This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel's.  相似文献   

20.
An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.  相似文献   

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