GaAs衬底层选择性腐蚀技术

本文在ＧａＡｓＧａＡｌＡｓ选择性腐蚀的基础上进行了腐蚀ＧａＡｓ衬底层获得ＧａＡ／ＧａＡｌＡｓ外延层薄膜的二次腐蚀技术。最终选用了Ｃ３Ｈ４（ＯＨ）（ＣＯＯＨ）３．Ｈ２Ｏ－Ｈ２Ｏ２系选择性腐蚀液和Ｈ２ＳＯ４－Ｈ２Ｏ２系腐蚀液，获得了快速，可控制，重复性好的可全部可局部去除衬底的腐蚀方法。     

低阈值0．98μm无铝应变量子阱InGaAs／InGaAsP／InGaP激光器

本文首次报道了在ＧａＡｓ衬底上采用新的双层ＩｎＧａＡｓＰ限制层和ＩｎＧａＰ光限制层工艺制作无铝应变云子阱Ｉｎ０．２Ｇａ０．８Ａｓ激光器。得到的宽条激光器的阈值电流密度低至５８Ａ／ｃｍ２，就作者所知，对用ＭＯＣＶＤ生长的０．９８μｍ激光器来说，该阈值电流密度是已有报道的最低值。     

Al0.85Ga0.15As/GaAs太阳能电池器件工艺优化研究

报道了优化的ｐ－ｎ型Ａｌ０．８５Ｇａ０．１５Ａｓ／ＧａＡｓ太阳能电池器件工艺。分别采用真空蒸发Ｃｒ／Ａｕ和ＡｕＧｅＮｉ／Ａｕ制作下面栅线和背面电极,并分别在４５０℃和３５０℃下快速合金化形成欧姆接触。采用ＮＨ４ＯＨ：Ｈ２Ｏ２：Ｈ３ＰＯ４：Ｈ２Ｏ体系的选择性腐蚀液去除高掺杂的ＧａＡｓ接触层。采用真空蒸发技术制备ＺｎＳ／ＭｇＦ２双层复合减反射层。测试结果表明,采用优化工艺制备的器件的光电转换效率得到了     

InP系列异质材料中的宽带隙夹层和它对材料特性的影响

ＩｎＧａＡｓ／ＩｎＧａＡｓＰ／ＩｎＰ等异质材料在室温和低温下的光荧光测试中的工为３￣３０ｎｍ宽带隙夹层峰。夹层的化学成分主要是ＩｎＧａＰ,它与ＭＯＣＶＤ生长时开关程序和ＰＨ２或ＡｓＨ３气流空流时间及气体存储时间等上关,实验表明,对ＩｎＰ／ＩｎＧａＡｓＰ／ＩｎＰ异质材料生长,ＡｓＨ３气流空流时间为０．５秒左右时,宽带隙夹层峰基本消失,还指出宽带隙夹层将相引起较大的晶格失配,增另异质界面缺陷,从而使材     

两次MOVPE生长的大功率InGaAs－GaAs－InGaP掩埋异质结应变量子阱激光器

本文给出了带有Ｉｎ０．４９Ｇａ０．５１ｉ包层的ＩｎＧａＡｓ－ＧａＡｓ应变量子阱激光器实验结果。镀有ＡＲ－ＨＲ膜、并有ｐ－ｎＩｎＧａＰ电流阻挡结的掩埋异质结激光器，在连续波（ＣＷ）和室温（ＲＴ）下，给出３．１ｍＡ的低阈值电流和９５ｍＷ的高功率输出。这是首次以两次ＭＯＶＰＥ方法生长制作的ＩｎＧａＡｓ－ＧａＡｓ－ＩｎＧａＰ掩埋异质结激光器。     

气态源分子束外延InP和InAs基Ⅲ－Ⅴ族化合物材料

本文简要报告我们气态源分子束外延实验结果．材料是ＧａＡｓ（１００）衬底上外延的晶格匹配的Ｉｎｙ（Ｇａ１－ｘＡｌｘ）１－ｙＰ（ｘ＝０～１，ｙ＝０．５），ＩｎＧａＰ／ＩｎＡｌＰ多量子阱；在ＩｎＰ（１００）衬底上外延的ＩｎＰ，晶格匹配的ＩｎＧａＡｓ、ＩｎＡｌＡｓ以及ＩｎＰ／ＩｎＧａＡｓ、ＩｎＰ／ＩｎＡｓＰ多量子阱，ＩｎＧａＡｓ／ＩｎＡｌＡＳＨＥＭＴ等．外延实验是用国产第一台化学束外延（ＣＢＥ）系统做的．     

Al0.3Ga0.22In0.48P/GaAs HBT高温特性的研究

本文研制了Ａｌ０．３Ｇａ０．２２Ｉｎ０．４８Ｐ／ＧａＡｓ高温ＨＢＴ器件,详细地研究了器件在３００Ｋ～６２３Ｋ范围内ＨＢＴ的直流电学特性。结果表明Ａｌ０．３Ｇａ０．２２Ｉｎ０．４８Ｐ／ＧａＡｓＨＢＴ器件具有良好的高温特性,在３００Ｋ～６２３Ｋ温度内,动态电流增益变化小于１０％,Ａｌ０．３Ｇａ０．２２Ｉｎ０．４８Ｐ／ＧａＡｓＨＢＴ可工作至６２３Ｋ,工作温度超过６２３Ｋ后,器件就不能正常工作,经分析发现     

低压MOCVD外延生长InGaAsP／InP应变量子阱材料与器件应用

本文报道用低压有机金属化合物化学气相淀积（ＬＰ－ＭＯＣＶＤ）外延生长ＩｎＧａＡｓＰ／ＩｎＰ应变量子阶材料，材料参数与外延条件的关系，量子阱器件的结构设计及其器件应用．用所生长的材料研制出宽接触阈值电流密度小于４００Ａ／ｃｍ２（腔长４００μｍ），ＤＣ－ＰＢＨ结构阈值７～１２ｍＡ的１．３μｍ量子阱激光器和宽接触阈值电流密度小于６００Ａ／ｃｍ２（腔长４００μｍ），ＤＣ－ＰＢＨ结构阈值９～１５ｍＡ的１．５５μｍ量子阶激光器以及高功率１．３μｍ量子阱发光二极管和ＩｎＧａＡｓＰＩＮ光电探测器．     

台湾电信用光电器件的研究现状

本文介绍了台湾用一塌信的光电器件近期的开发两头及研究成果。其中包括高性能１．５５μｍ复耦合ＩｎＧａＡｓＰ－ＩｎＰ分布反馈和１．３μｍ无致冷ＡｌＩｎＧａＡｓ－ＩｎＰ激光器，半绝缘衬底的ＩｎＧａＡｓ－ＩｎＰｐ－ｉ－ｎ光探测器，０．９８μｍＩｎＧａＡｓ－ＧｓＡｓ－ＩｎＧａＰ泵浦激光器以及１２信道的激光器和探测阵列。     

AlGaAs－InGaP／GaAs HBT，f_T高达245GHz

ＡｌＧａＡｓ－ＩｎＧａＰ／ＧａＡｓ　ＨＢＴ，ｆ_Ｔ高达２４５ＧＨｚ《ＩＥＥＤＩＪ》１９９３年第１２期报道了一种新的ＨＢＴ，采用ＡＩＧａＡｓ－ＩｎＧａＰ发射区结构。该结构在发射极形成一个电子发射器，产生速度过冲效应。它一方面增强了发射极输运，同时减少了?..     

薄GaAs层化学腐蚀及它的表面结构

用pH=7±O.05的H_2O_2-NH_4OH溶液,在5±1℃,对晶句是(100)的高阻或浓度为2×10~(13)cm~(-3)的n型GaAs衬底进行腐蚀试验.发现腐蚀速率不但与搅拌有关,且在最初半分钟左右或开始250～500(?)的GaAs腐蚀,其腐蚀速率比更长时问或更深腐蚀时要快得多.分析表明,NH_4OH向GaAs与溶体界面的扩散很可能是腐蚀过程的限制步骤.对腐蚀后的残余氧化层进行测试分析,认为化学腐蚀后在表面有一层极薄的氧化物层,接着是过渡层.用HCI或NH_4OH水溶液清洗则可去除氧化物层并缩小过渡层.     

微碟激光器的单模低阈值激射

简单分析了碟型微腔激光器中的激射模式及自发发射系数。采用反应离子刻蚀和选择性刻蚀方法蚀刻出InGaAs InGaAsP多量子阱 (MQW)碟型激光器 ,碟直径 3 μm ,在液氮温度下进行光抽运实验 ,观察其模式特性。实现了单模激射 ,波长 1 5 μm ,抽运阈值 18μW。     

Selective wet etch of a TaN metal gate with an amorphous-silicon hard mask

The appropriate wet etch process for the selective removal of TaN on the HfSiON dielectric with an amorphous-silicon(a-Si) hardmask is presented.SCI(NH_4OH:H_2O_2:H_2O),which can achieve reasonable etch rates for metal gates and very high selectivity to high-k dielectrics and hardmask materials,is chosen as the TaN etchant. Compared with the photoresist mask and the tetraethyl orthosilicate(TEOS) hardmask,the a-Si hardmask is a better choice to achieve selective removal of TaN on the HfSiON dielectric be...     

GaAs/AlGaAs多层膜刻蚀的陡直度

GaAs/AlGaAs多层膜的陡直度较大程度地关系到其实际应用效果,但在实际加工中较难控制,因此有必要研究刻蚀过程中一些主要因素对其陡直度的影响。结合具体工作情况,用AZ1500光刻胶作为掩模,GaAs/Al0.15Ga0.85As多层膜为刻蚀材料,分别使用湿法和干法对其进行刻蚀。湿法刻蚀的刻蚀剂为H3PO4+H2O2溶液,干法刻蚀采用感应耦合等离子体(ICP)刻蚀法,等离子体由Cl2+BCl3(蒸汽)混合气体电离形成。通过控制变量方法,发现湿法刻蚀中刻蚀剂配比和温度以及干法刻蚀中BCl3(蒸汽)流量对刻蚀陡直度的影响规律。由此得出,提高H3PO4所占比例和降低刻蚀温度虽然会降低刻蚀速率,但可以提高多层膜的陡直度;ICP刻蚀的陡直度优于湿法刻蚀,BCl3(蒸汽)的流量在一定范围内对刻蚀陡直度的影响较小。     

Development of an etchant for selectively etching TiWNxin the presence of electroplated 95%Pb-5%Sn solder

Shrinking die sizes and increasing I/O density is motivating the push toward flip chip packages. A flip chip interconnection system with a under bump metallurgy stack containing sputtered TiWN_X/sputtered Cu/electroplated Cu stud/electroplated 95%Pb-5%Sn was developed. An important step in the above process is the selective etching of the sputtered Cu bus layer and the TiWN_X barrier layer, in the presence of the Pb-Sn solder. The Cu bus layer was selectively etched using commercial etchants. However, no commercial etchants were available for selectively etching the TiWN_X layer, H₂O₂-NH₄OH based etching systems, popularly known as Standard Clean-1 cleaning solutions, have been extensively used to clean silicon wafers in front end wafer fabrication where only trace metal contamination exists. Since metals like lead, copper, titanium, tin and tungsten catalyze the heterogeneous decomposition of the peroxide, the unstable H₂O₂-NH₄OH based etching systems are rarely used to etch metal films. In this paper the development of a H ₂O₂-NH₄OH based etchant to selectively etch the sputtered TiWN_X films in the presence of electroplated 95%Pb-5%Sn solder bumps is discussed. A 2³ full factorial experiment with mid point was conducted to establish the etchant composition, as well as process temperature, that give satisfactory responses with respect to etch time, permissable undercut of the Cu stud (caused by the NH₄OH), and acceptable bump shape after reflow. Statistical analysis was used to understand the significant factors influencing the etch rate and undercut. An etchant containing 6% by volume of 30%-H₂O₂ and 0.75% by volume of 30%-NH₄OH operated at a temperature of 37°C was found to give satisfactory results     

Silicon raised strip waveguides based on silicon and silicon dioxide thermal bonding

Si raised strip waveguides on SiO/sub 2/ have been proposed and fabricated, which are based on silicon-on-insulator (SOI) material. In the waveguides, the SOI technique utilizes silicon and silicon dioxide thermal bonding and back-polishing. An anisotropic etchant is used to produce the trapezoidal Si raised strip waveguides by etching the Si film down to the SiO/sub 2/ etch-stop buried layer. The transmission losses of the Si waveguides are measured to be less than 0.2 dB/cm at the 1.3 /spl mu/m wavelength for the lowest mode TE-like mode.     

Analysis of the propagation losses of InP/InGaAsP trench waveguides fabricated by focused ion beam

Focused ion beam was used to fabricate 2 mm-long, 4 μm-wide and 4 μm-deep multimode trench waveguides in InP/InGaAsP. An automated stitching method was developed to fabricate mm-long structures using alignment marks. The waveguides were sputtered or etched using I₂ at room temperature and 150 °C stage temperature. The propagation losses induced by the different fabrication techniques were measured and ranged between 50 and 82 dB/cm. A damaged layer with implanted Ga and the sidewall roughness are identified to be the most important causes for the losses. FIB is shown to be a single-step fabrication technique for rapid-prototyping of photonic structures in InP/InGaAsP.     

新型长波长InP基谐振腔增强型光探测器

介绍了一种新型长波长InP基谐振腔增强型(RCE)光探测器。通过V(FeCl3):V(H2O)溶液对InGaAs牺牲层的选择性湿法腐蚀,制备出具有InP/空气隙的高反射率分布布拉格反射镜(DBR),并将该选择性湿法腐蚀技术成功地应用到长波长InP基谐振腔增强型光探测器的制备中去,从而彻底解决了InP/InGaAsP高反射率分布布拉格反射镜难以外延生长的问题。所制备出的谐振腔增强型光探测器,其台面面积为50μm×50μm,底部反射镜为1.5对的InP/空气隙分布布拉格反射镜,顶部反射镜靠InGaAsP与空气的界面反射来实现。测试结果表明,该谐振腔增强型光探测器在波长1.510μm处获得了约59％的峰值量子效率,在3V反偏压下暗电流为2nA,3dB响应带宽达到8GHz。     

酸性CuCl2蚀刻液动态蚀刻均匀性与蚀刻速率研究

对酸性CuCl2蚀刻液在HCl/H2O2和HCl/NH4Cl两种体系下进行了水平动态蚀刻研究,分别对蚀刻均匀性和蚀刻速率进行了分析,结果表明面铜粗糙度和上下喷淋对蚀刻均匀性有很大影响,HCl/NH4Cl系统相对于HCl/H2O2系统具有更高的蚀刻速率,为工业生产提供相关的数据参考。     

1.5-μm InGaAs/InAlGaAs quantum-well microdisk lasers

Microdisk lasers with three InGaAs/InAlGaAs quantum wells were demonstrated for the first time. The selective etching method used to fabricate the laser structure is discussed. Lasers 20 μm in diameter lased with single mode at 1.5-μm wavelength when optically pumped by a pulsed argon-ion laser at 80 K