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1.
MOCVD生长GaAs/AlxGa1—xAs多量子阱子带间红外吸收特性   总被引:1,自引:1,他引:0  
对MOCVD生长的GaAs(40A)/AlxGa1-xAs(300A)多量子阱结构观察到阱内电子从基态到第一激态跃迁引起的红外吸收。用Bruker红外光谱仪测量,发现了一个峰值在986cm^-1(10.1μm)带宽为237cm^-1(9~11.5μm)的强吸收峰,该峰位置与阱内电子从基态到第一激发态跃迁所计算的吸收峰位置基本一致。  相似文献   

2.
在室温下测量了GaAs/AlGaAs多量子阱结构的红外吸收,观察到在706、770、1046、1282和1653cm-1处的几个吸收峰.认为这些吸收峰与处于势垒以上电子干涉有关,理论计算的吸收峰位置与实验结果很一致.  相似文献   

3.
我们研究了掺杂耦合GaAs/AlAs超晶格的级联隧穿,在这种结构中,AlAs层X能谷中的基态能级位于GaAs层中Γ能谷的基态(E(Γ1);)和第一激发态(E(Γ2))能级之间.实验结果证明,这种超晶格中的高电场畴是由Γ-X级联共振隧穿所形成的,而不是通常的相邻量子阱子带的级联共振隧穿所形成的.在这种高场畴中,电子从GaAs量子阱的基态隧穿到邻近的AlAs层的X能谷的基态,然后通过实空间电子转移从AlAs层的X能谷弛豫到下一个GaAs量子阱的Γ能谷的基态.  相似文献   

4.
对n型电子有效质量各向异性半导体量子阱,给出了子带间正入射吸收的振子强度解析表达式.这种子带间的跃迁有束缚基态到束缚的激发态的,有束缚基态到扩展的激发态的.以AlAs/GaAlAs为例研究了量子阱生长方向、阱宽对量子阱吸收波长和振子强度的影响  相似文献   

5.
本文报道我们率先研制出的3~5.3μmInxGa1-xAs/AlyGa1-yAs/AlzGa1-zAs非对称台阶量子阱红外探测器的制备和性能.该探测器具有光伏特征,77K温度、±7V外偏压下的500K黑体探测率达到约1.0×1010cm·Hz1/2/W,并且,与1→2子带间跃迁相对应的光电流峰值响应波长可随外偏压在中红外(3~5.3μm)波段作适当调谐.运用平面波展开法,依据样品的阱、垒结构参数,计算了InxGa1-xAs/AlyGa1-yAs/AlzGa1-zAs非对称台阶量子阱1→2子带间跃迁的Sta  相似文献   

6.
用金刚石对顶砧压力装置在液氮温度下和0~4GPa的压力范围内测量了不同阱宽(1.7~11.0nm)的InxGa(1-x)As/Al(1-y)Ga(1-y)As(x,y=0.15,0;0.15,0.33;0,0.33)多量子阱的静压光致发光谱,发现在In0.15Ga0.85As/GaAs多量子阱中导带第一子带到重空穴第一子带间激子跃迁产生的光致发光峰能量的压力系数随阱宽的增加而减小,在In0.15Ga0.85As/Al0.33Ga0.67As和GaAs/Al0.33Ga0.67As多量子阱中相应发光峰的压力系数随附宽的增加而增加.根据Kroniy-Penney模型计算了发光峰能量的压力系数随阱宽的变化关系,结果表明导带不连续性随压力的增加(减小)及电子有效质量随压力的增加是压力系数随阱宽增加而减小(增加)的主要原因.  相似文献   

7.
我们研究了掺杂耦合GaAs/AlAs超晶格的级联隧穿,在这种结构中,AlAs层X能谷中的基态能级位于GaAs层中Г能谷的基态(EГ1)和第一激发态(EГ2)能级之间,实验结果证明,这种超晶格中的高电场畴是由Г-X级联共振隧穿所形成的,而不是通常的相邻量子阱子带的级联共振隧穿所形成的,在这种高场畴中,电子从GaAs量子阱的基态隧穿到邻近的AlAs层的X能谷的基态,然后通过实空间电子转移从AlAs层的  相似文献   

8.
本文报道用低压有机金属化合物化学气相淀积(LP-MOCVD)外延生长InGaAsP/InP应变量子阶材料,材料参数与外延条件的关系,量子阱器件的结构设计及其器件应用.用所生长的材料研制出宽接触阈值电流密度小于400A/cm2(腔长400μm),DC-PBH结构阈值7~12mA的1.3μm量子阱激光器和宽接触阈值电流密度小于600A/cm2(腔长400μm),DC-PBH结构阈值9~15mA的1.55μm量子阶激光器以及高功率1.3μm量子阱发光二极管和InGaAsPIN光电探测器.  相似文献   

9.
InxGa1—xAs/AlyGa1—yAs多量子阱的高压光致发光研究   总被引:1,自引:1,他引:0  
用金刚石对顶砧压力装置在浓氮温度下和0~4GPa的压力范围内测量了不同阱宽(1.7~11.0nm)的InxGa1-xAs/AlyGa1-yAs(x,y=0.15,0;0.15,0.33;0,0.33)多量子阱的静压光致发光谱,发现在In0.15Ga0.85As/GaAs多量子阱中导带第一子带到重空穴第一子带间激子跃迁产生的光致发光峰能量的压力系数随阱宽的增加而减小,在In0.15Ga0.85As/  相似文献   

10.
在Ⅲ-Ⅴ族半导体GaAs外延层上共注入Er和O离子(GaAs:Er,O).经面对面优化退火后,光致发光(photoluminescence-PL)谱中观测到对应Er3+第一激发态到基态4I13/2-4I15/2跃迁,其相对强度较单注入Er的GaAs(GaAs:Er)增强10倍,且谱线变窄.从二次离子质谱(SecondaryIonMasSpectrometry-SIMS)和卢瑟福背散射实验给出退火前后Er在GaAs:Er样品中的剖面分布.SIMS测量分别给出O注入前后Er和O在GaAs:Er,O中的深度剖面分布,分析表明Er和O共注入后形成光学激活有效的发光中心.  相似文献   

11.
Waveguide multilayer optical card (WMOC) is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling & processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic (VB) language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.  相似文献   

12.
IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…  相似文献   

13.
The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.  相似文献   

14.
Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.  相似文献   

15.
A doping system consisting of NPB and PVK is employed as a composite hole transporting layer (CHTL). By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK : NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK : NPB at 1:3.  相似文献   

16.
An insert layer structure organic electroluminescent device(OLED) based on a new luminescent material (Zn(salen)) is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn(salen)/Liq/LiF/A1/CuPc/NPD/Zn(salen)/Liq/LiF/A1. Effective insert electrode layers comprising LiF(1nm)/Al(5 nm) are used as a single semitransparent mirror, and bilayer cathode LiF(1 nm)/A1(100 nm) is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.  相似文献   

17.
Due to variable symbol length of digital pulse interval modulation(DPIM), it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation(FDPIM) method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.  相似文献   

18.
It is a key problem to accurately calculate beam spots' center of measuring the warp by using a collimated laser. A new method, named double geometrical center method (DGCM), is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device (CCD) is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What's more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.  相似文献   

19.
DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.  相似文献   

20.
From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.  相似文献   

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