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p-Si TFT栅绝缘层用SiNx薄膜界面特性的研究 总被引:1,自引:1,他引:0
以NH3和SiH4为反应源气体,在低温下采用射频等离子体增强化学气相沉积(RF-PECVD)法在多晶硅(p-Si)衬底上沉积了SiNx薄膜.系统地分析讨论了沉积温度、射频功率、反应源气体流量比对SiNx薄膜界面特性的影响.分析表明,沉积温度和射频功率主要是通过影响SiNx薄膜中的si/N比和H含量影响薄膜的界面特性,而NH3/SiH4流量比则主要通过影响薄膜中的H含量影响薄膜界面特性.实验制备的SiNx薄膜层中的固定电荷密度、可动离子密度、SiNx与p-si之间的界面态密度分别达到了1.7×1012/cm2、1.4×1012/cm2、3.5×1012/(eV·cm2),其界面特性达到了制备高质量p-si TFT栅绝缘层的性能要求. 相似文献
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射频功率对a-C:F薄膜沉积速率和结构的影响 总被引:1,自引:1,他引:0
用射频等离子体增强型化学气相沉积法制备了a-C:F薄膜,并研究了射频功率对a-C:F薄膜沉积速率和结构的影响。用椭偏仪测量了薄膜的厚度,并用红外谱(FITR)结合Raman谱研究了其结构的变化。结果表明:薄膜沉积速率在10~14 nm/min之间,主要含有CFx和C=C键。随射频功率的升高,沉积速率先增大后减小,CF3的含量迅速减小,CF和CF2的含量略有增加,薄膜中r(F/C)呈下降的趋势。在较高功率下沉积的薄膜中出现了由sp2和sp3混合微晶结构。 相似文献
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采用ITO靶和Zr靶共溅射在玻璃衬底上沉积了ITO:Zr薄膜,研究了衬底温度、氧流量对ITO:Zr薄膜性能的影响.表征和对比了ITO:Zr薄膜晶体结构和表面粗糙度的变化ITO:Zr薄膜在低温生长时就可以得到良好的光电性能,衬底温度的提高显著改善了薄膜光电性能;一定范围的氧流量也可以改善薄膜的性能,但过量的氧却使得ITO:Zr薄膜的光性能变差.透射谱表明各参数的变化引起了明显的"Burstin Moss"效应.当优化溅射条件为工作气压0.5Pa、氧流量0.3 sccm、直流溅射功率45 W(ITO靶)和射频功率10 W(Z靶)、沉积速率8 nm/min和一定的衬底温度时,可以获得方阻10~20 Ω/sq和可见光透过率85%(含基底)以上的ITO:Zr薄膜. 相似文献
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In the present work, we report silicon nitride films deposited by a radio- frequency (RF) sputtering process at relatively
low temperatures (<260°C) for microelectromechanical system (MEMS) applications. The films were prepared by RF diode sputtering
using a 3-inch-diameter Si3N4 target in an argon ambient at 5 mTorr to 20 mTorr pressure and an RF power of 100 W to 300 W. The influence of the film deposition
parameters, such as RF power and sputtering pressure, on deposition rate, Si-N bonding, surface roughness, etch rate, and
stress in the films was investigated. The films were deposited on single/double-side polished silicon wafers and transparent
fused-quartz substrates. To explore the RF-sputtered silicon nitride film as a structural material in MEMS, microcantilever
beams of silicon nitride were fabricated by bulk, surface, and surface-bulk micromachining technology. An RF-sputtered phosphosilicate
glass film was used as a sacrificial layer with RF-sputtered silicon nitride. Other applications of sputtered silicon nitride
films, such as in the local oxidation of silicon (LOCOS) process, were also investigated. 相似文献
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等离子增强化学气相淀积(PECVD)法制备的氮化硅薄膜具有沉积温度低、生长速率高和残余应力可调节等特点,研究其力学特性对研制MEMS器件和系统具有重要意义。采用HQ-2型PECVD淀积台,在沉积温度为350℃,NH3流量为30cm3/min的条件下,通过改变氩气稀释至5%的SiH4流量和射频功率大小,制备了具有压应力、微应力和张应力的多种氮化硅薄膜样品。采用纳米压痕仪Nanoidenter-G200对淀积薄膜的杨氏模量和硬度进行测试,结果表明,在较小的SiH4流量和较高的射频功率条件下,淀积的氮化硅薄膜具有更高的杨氏模量和硬度。 相似文献
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采用等离子体增强化学气相沉积法(PECVD),在单晶硅衬底(100)上成功制备了不同生长工艺条件下的氮化硅薄膜。分别采用XP-2台阶仪、椭圆偏振仪等手段测试了薄膜的厚度、折射率、生长速率等参数。并采用原子力显微镜(AFM)研究了薄膜的表面形貌。结果表明,温度和射频功率是影响薄膜生长速率的主要因素,生长速率变化幅度可以达到230nm/min甚至更高。对于薄膜折射率和成分影响最大的是NH3流量,折射率变化范围可以达到2.7~1.86。分析得出受工艺参数调控的薄膜生长速率对薄膜的性质有重要影响。 相似文献
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用射频(RF)溅射法在镀LaNiO3(LNO)底电极的Si片上沉积PbZr0.52 Ti0.48 O3(PZT)铁电薄膜,沉积过程中基底温度为370℃,然后在大气环境中对沉积的PZT薄膜样品进行快速热退火处理(650℃,5min).用电感耦合等离子体发射光谱(ICP-AES)测量其组分,X射线衍射(XRD)分析PZT薄膜的结晶结构和取向,扫描电子显微镜(SEM)分析薄膜的表面形貌和微结果,RT66A标准铁电综合测试系统分析Pt/PZT/LNO电容器的铁电与介电特性,结果表明,PZT薄膜的组分、结构和性能都与溅射沉积功率有关. 相似文献
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Seung-Soo Han Li Cai May G.S. Rohatgi A. 《Semiconductor Manufacturing, IEEE Transactions on》1996,9(3):303-311
Silicon nitride films grown by plasma-enhanced chemical vapor deposition (PECVD) are useful for a variety of applications, including anti-reflection coatings in solar cells, passivation layers, dielectric layers in metal/insulator structures, and diffusion masks, PECVD nitride films are known to contain hydrogen, and defect passivation by hydrogenation enhances efficiency in polycrystalline silicon solar cells. PECVD systems are controlled by many operating variables, including RF power, pressure, gas flow rate, reactant composition, and substrate temperature. The wide variety of processing conditions, as well as the complex nature of particle dynamics within a plasma, makes tailoring Si3N4 film properties very challenging, since it is difficult to determine the exact relationship between desired film properties and controllable deposition conditions. In this study, silicon nitride PECVD modeling using neural networks has been investigated. The deposition of Si3N4 was characterized via a central composite experimental design, and data from this experiment was used to train optimized feed-forward neural networks using the back-propagation algorithm. From these neural process models, the effect of deposition conditions on film properties has been studied. It was found that the process parameters critical to increasing hydrogenation and therefore enhancing carrier lifetime in polysilicon solar cells are temperature, silane, and ammonia flow rate. The deposition experiments were carried out in a Plasma Therm 700 series PECVD system 相似文献
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In this study, oxide and nitride films were deposited at room temperature through the reaction of silicon sputtered by argon and oxygen ions or argon and nitrogen ions at 250 and 350 W with 0.67 Pa pressure. It was observed that for both thin films the deposition rates increase with the applied RF power and decrease with the increase of the gas concentration. The Si/O and Si/N ratio were obtained through RBS analyses and for silicon oxide the values changed from 0.42 to 0.57 and for silicon nitride the values changed from 0.4 to 1.03. The dielectric constants were calculated through capacitance-voltage curves with the silicon oxide values varying from 2.4 to 5.5, and silicon nitride values varying from 6.2 to 6.7, which are good options for microelectronic dielectrics. 相似文献
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纳米硅镶嵌氮化硅薄膜的制备与光致发光特性 总被引:1,自引:0,他引:1
为研究氮化硅薄膜发光材料的制备工艺及其光致发光机制,实验采用射频磁控反应溅射技术与热退火处理制备了纳米硅镶嵌氮化硅薄膜材料.利用红外光谱(IR)、X射线衍射谱(XRD)、能谱(EDS)和光致发光谱(PL),对不同工艺条件下薄膜样品的成分、结构和发光特性进行研究,发现在制备的富硅氮化硅薄膜材料中形成了纳米硅颗粒,并计算出其平均尺寸.在510 nm光激发下,观察到纳米硅发光峰,对样品发光机制进行了讨论,认为其较强的发光起因于缺陷态和纳米硅发光. 相似文献
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文章用RF—PECVD设备制备了G—SiNx薄膜,研究了TFT器件击穿电压的测定与分析方法,并对成膜条件中的SiH4流量以及G-SiNx膜厚进行浮动变化,以及研究TFT器件击穿电压的变化方式。结果表明:随着SiH4/NH3流量增大,其耐压性降低;增大绝缘膜厚度,耐压性随之增大。文章对TFT耐压性测量方法的探讨以及PECVD工艺条件与耐压性的相关关系的研究。对于制备合格的氮化硅薄膜提供了借鉴与指导。 相似文献
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以低压化学气相沉积(LPCVD)热壁立式炉为实验平台,由二氯硅烷和氨通过LPCVD工艺合成氮化硅薄膜,利用降温成膜提高氮化硅薄膜的膜厚均匀度。基于气体碰撞理论建立了氮化硅薄膜沉积速率与反应气体浓度的关系式。分析比较了LPCVD炉内不同升温速率沉积氮化硅薄膜的表面性能。发现在变温沉积阶段,选择合适的降温速率是实现薄膜沉积过程中预设温度变化的关键。在保证各温度区平均膜厚和晶圆片之间膜厚均匀度基本不变的前提下,通过实验找到沉积阶段的最佳变温速率,将晶圆片内(WIW)均匀度优化到1%以下,比恒温沉积薄膜的均匀度提高了约70%。这将有助于设备工艺能力的提升,更好地适应IC芯片工艺关键尺寸的缩小趋势。 相似文献