聚合物发光器件中输运特性的模拟分析

对聚合物发光二极管I-V特性的测量发现,被测器件内存在着类似于某些无机器件中的负阻现象和"迟滞回线”状场致漂移的伏安特性.模拟分析表明,一种反向势垒的存在及其击穿,应是引起负阻现象的原因.缺陷态的存在及其电荷填充的变化,是导致I-V特性曲线随偏压扫描方向变化的主要原因.而低场下的接触性能决定着发光二级管载流子的输运性质:若为非欧姆接触,则I-V曲线可用F-N隧穿模型来描述;若为欧姆接触,则应用陷阱电荷限制电流(TCL)模型来描述.     

聚合物发光二极管中可逆的不稳定行为

研究了存在于聚合物发光二极管(PLED)中的一种可逆的"负阻"现象及短期衰退行为.当加在PLED上的正向偏压大于10V之后,其电流和发光强度将在某偏压下出现突然的转折,即电流或光强骤增而器件上压降减小."负阻"现象将随测量次数的增加而逐渐消失.采用CCD摄像头摄取发光象素上发光的变化情况的图像,发现光强的突变与电流的突变是相对应的.对以不同极性脉冲偏置观察发光光强的短期衰退情况时发现,反向偏置有助于抑制正向的发光衰退行为.我们初步认为这些现象可能与PLED中存在的缺陷态及其上电荷的填充状况有关.     

聚合物发光二极管中可逆的不稳定行为

研究了存在于聚合物发光二极管 ( PL ED)中的一种可逆的“负阻”现象及短期衰退行为 .当加在 PLED上的正向偏压大于 1 0 V之后 ,其电流和发光强度将在某偏压下出现突然的转折 ,即电流或光强骤增而器件上压降减小 .“负阻”现象将随测量次数的增加而逐渐消失 .采用 CCD摄像头摄取发光象素上发光的变化情况的图像 ,发现光强的突变与电流的突变是相对应的 .对以不同极性脉冲偏置观察发光光强的短期衰退情况时发现 ,反向偏置有助于抑制正向的发光衰退行为 .我们初步认为这些现象可能与 PLED中存在的缺陷态及其上电荷的填充状况有关     

有机发光器件中缺陷态行为表现

对有机发光二极管（OLED）的I-V特性曲线,用有内建电场Ei的修正F-N模型,或陷阱电荷限制电流（TCL）模型进行了模拟分析,均观察到缺陷态对器件特性的影响。对修正F-N模型拟合,Ei不是常数而是随电场变化的,对满足TCL模型的OLED器件,其I-V特性呈现类似于无机半导本器件中的“迟滞回线”状,而且随测试次数的变化呈现可恢复的变化。这些均说明OLED中存在着缺陷态,用缺陷态上电荷填充状态的变化对上述现象进行了解释。     

AlGaN基p-i-n光电探测器负响应现象研究

对AlGaN基p-i-n光电探测器的负光电响应特性进行研究,从实验上证实了器件中p型接触电极的肖特基特性是导致该现象的主导因素.不同偏压下的响应光谱表明,这些AlGaN光伏器件中存在较为明显的光导响应特性.光照和暗背景条件下的C-f曲线验证了器件中的持续光电导特性,而高铝组分铝镓氮材料内存在的大量缺陷被认为是该现象的起因.系统地研究了AlGaN基p-i-n光电探测器存在的负响应现象及其微观机理,为铝镓氮基日盲器件光电性能的优化提供了重要参考依据.     

固相反应制备的多晶和外延CoSi_2/n-Si(111)接触的肖特基特性

通过硅 (111)衬底淀积的单层 Co或 Co/ Ti双金属层在不同退火温度的固相反应 ,在硅上形成制备了多晶和外延 Co Si2 薄膜 .用电流 -电压和电容 -电压 (I- V/ C- V)技术在 90 K到室温的温度范围内测量了 Co Si2 / Si肖特基接触特性。用肖特基势垒不均匀模型分析了所测得的 I- V特性 ,在较高温度下 (≥～ 2 0 0 K)或较低温度的较大偏压区域 ,I- V曲线能用热激发和在整个结面积上势垒高度的高斯分布模型描述 .而在较低温度的较小偏压区域 ,电流由流过一些小势垒高度微区的电流决定 ,从而在低温 I- V曲线上在约 10 - 7A处有一个“曲折”.     

一种新的AlGaN/GaN HEMT半经验直流特性模型

在EEHEMT1模型的基础上给出一种新的A1GaN/GaN HEMT半经验直流特性模型,考虑了栅源电压对膝点电压的影响,得到描述AlGaN/GaN HEMT器件I-Ⅴ特性的方程.此模型可以应用于蓝宝石和SiC两种不同衬底AlGaN/GaN HEMT器件的I-Ⅴ特性模拟.仿真结果和实验测量结果拟合误差小于3%.     

一种新的AlGaN/GaN HEMT半经验直流特性模型

在EEHEMT1模型的基础上给出一种新的A1GaN/GaN HEMT半经验直流特性模型,考虑了栅源电压对膝点电压的影响,得到描述AlGaN/GaN HEMT器件I-Ⅴ特性的方程.此模型可以应用于蓝宝石和SiC两种不同衬底AlGaN/GaN HEMT器件的I-Ⅴ特性模拟.仿真结果和实验测量结果拟合误差小于3%.     

金属结单电子晶体管的模型建立及实验验证

在正统理论的基础上,使用主方程法建立了金属结单电子晶体管的器件模型和算法流程.将电容、电阻和温度等参数代入器件模型得到的I-Ⅴ特性曲线与实验结果吻合较好,从而验证了模型、算法以及程序流程的正确性.此外,通过详细讨论模拟与实验的三组曲线差别,得到模型使用主方程的稳态解是导致模拟与实验之间结果存在差别的主要原因,即求解含有时间的主方程将增加模拟精度;而且,指出镜像电荷引起的电势使电流随电压呈现指数增加的主要影响因素,明显偏离理论模拟的线性增加趋势.     

基于MEMS技术新型硅磁敏三极管负阻-振荡特性

介绍了-种新型硅磁电负阻-振荡器件--S型负阻-振荡硅磁敏三极管.该器件是基于MEMS技术在p型高阻单晶硅片上制作的具有立体结构的新型磁电转换器件,采用KOH各向异性腐蚀技术实现发射区及引线的制作.实验结果表明,集电极电流随外加磁场的变化而变化;在基极注入电流一定时,出现集电极电流受外加偏压VCE调制的负阻-振荡特性,且集电极电流振荡随外加磁场而变化.对该器件负阻-振荡特性的形成机理进行了讨论,结果表明,在集电区n+π结和基区与π区形成的p+π结均处于反偏条件下,当π区满足雪崩倍增效应产生的条件时,该磁敏三极管伏-安特性曲线中的Vp+x偏压相对应的基极注入条件下的集电极电流出现S型负阻-振荡特性.在发射极和基极间的n+π结和p+π结附近存在的大量深能级杂质将对负阻-振荡特性进行调制.     

Numerical Analysis on Current Transport Characteristics in Single Layer Organic Electroluminescent Devices

A new model to describe I-V characteristics of organic light-emitting devices (OLEDs) is developed based on experimental results. The dependence of I-V characteristics on energy barrier, trap density and carrier mobility is analyzed. The result shows that this model combines the Fowler-Nordheim tunnel theory and the trap charge limited current theory with exponential trap distribution (TCL), and it describes the current transport characteristics of OLEDs more comprehensively. The I-V characteristics follow Fowler-Nordheim theory when the energy barrier is high, the trap density is small and the carrier mobility is large.In other cases they follow the TCL theory.     

Characterization of shallow silicided junctions for sub-quartermicron ULSI technology. Extraction of silicidation induced Schottkycontact area

The current-voltage (I-V) characteristics of shallow silicided p ⁺-n and n⁺-p junctions are presented. In the former the diode behavior was same as in nonsilicided junction, while drastic change in diode I-V was observed in the latter. The formation of Schottky contact was conclusively shown to be the root cause of the modified I-V behavior of n⁺-p junction in the forward bias region. Poole-Frenkel barrier lowering predominantly influenced the reverse leakage current, masking thereby the effect of Schottky contact. The leakage current in n⁺-p diodes was higher than in nonsilicided diodes by two orders of magnitude and this is consistent with the formation of Schottky contact via titanium or titanium-silicide penetrating into the p-substrate and generating trap sites. There is no increase in the leakage current and no formation of Schottky contact in case of the p⁺-n junction. The Schottky contact amounting to less than 0.01% of the total junction area and not amenable for SEM or TEM observation was extracted for the first time by simultaneous characterization of forward and reverse characteristics of silicided n ⁺-p diode     

Investigation of Al Schottky junction on n-type CdS film deposited on polymer substrate

A systematic study has been made on the behavior of Al/n-CdS thin film junction on flexible polymer substrate (polyethylene terephthalate, PET) grown using thermal evaporation method. Temperature dependence of I-V measurements for this junction has been done which closely follow the equations of Schottky barrier junction dominated by thermionic emission mechanism. Intrinsic and contact properties such as barrier height, ideality factor and series resistance have been calculated from I-V characteristics. The barrier height of Al/n-CdS junction is found to increase with increase in temperature whereas ideality factor and series resistance decrease with increase in temperature.     

/sup 60/Co gamma irradiation effects on n-GaN Schottky diodes

The effect of /spl gamma/-ray exposure on the electrical characteristics of nickel/n-GaN Schottky barrier diodes has been investigated using current-voltage (I-V), capacitance-voltage (C-V), and deep-level transient spectroscopy (DLTS) measurements. The results indicate that /spl gamma/-irradiation induces an increase in the effective Schottky barrier height extracted from C-V measurements. Increasing radiation dose was found to degrade the reverse leakage current, whereas its effect on the forward I-V characteristics was negligible. Low temperature (/spl les/50) post-irradiation annealing after a cumulative irradiation dose of 21 Mrad(Si) was found to restore the reverse I-V characteristics to pre-irradiation levels without significantly affecting the radiation-induced changes in C-V and forward I-V characteristics. Three shallow radiation-induced defect centers with thermal activation energies of 88 104 and 144 meV were detected by DLTS with a combined production rate of 2.12 /spl times/ 10/sup -3/ cm/sup -1/. These centers are likely to be related to nitrogen-vacancies. The effect of high-energy radiation exposure on device characteristics is discussed taking into account possible contact inhomogeneities arising from dislocations and interfacial defects. The DLTS results indicate that GaN has an intrinsically low susceptibility to radiation-induced material degradation, yet the effects observed in the Schottky diode I-V and C-V characteristics indicate that the total-dose radiation hardness of GaN devices may be limited by susceptibility of the metal-GaN interface to radiation-induced damage.     

基于聚乙烯咔唑的非挥发型阻变存储特性分析

采用聚乙烯咔唑作为活性层构建了ITO/PVK/Al的三明治结构阻变存储元件,并对其阻变特性进行了测量。结果表明其具有明显的非挥发型双稳态阻变特性, 具有WORM存储特性。该元件具有良好的数据保持能力和耐久能力,开关态电流比可达103,且具有较低的阈值转换电压。分别对低阻态和高阻态的载流子传输机制进行了拟合, 低阻态为欧姆传导机制,高阻态为空间电荷限制电流发射机制。根据载流子传输机制, 对阻变特性进行了解释。     

a-Si:H TFT亚阈值区SPICE模型的研究

研究了将非晶硅薄膜晶体管（a-Si：H TFT）在电路模拟程序（SPICE）中使用的亚阈值区模型,将亚阈值区分为亚阈值前区和亚阈值后区并建立了模型,对比了不同模型下的模拟结果,发现亚阈值区的TFT特性依赖于材料性质,而且亚阈值前区和亚阈值后区的特性受栅源电压Vcs和漏源电压V DS的影响,呈指数变化。提出的新模型考虑了前界面态、后界面态、局域态、材料及制作工艺等因素,体现了该区域电流对漏源电压Vvs强烈的依赖关系。使用新模型对实验数据的拟合结果优于以往的模型,能够比较精确地模拟亚阈值区的特性,可用来预测a-Si：H TFT的性能．对TFT阵列的模拟设计具有重要价值。     

Origin of low-frequency noise in pentacene field-effect transistors

Measurements of power spectral density (PSD) of low-frequency noise (LFN) in pentacene field-effect transistors reveal the preponderance of a 1/f-type PSD behavior with the amplitude varying as the squared transistor gain and increasing as the inverse of the gate surface area. Such features impose an interpretation of LFN by carrier number fluctuations model involving capture/release of charges on traps uniformly distributed over the gate surface. The surface slow trap density extracted by the noise analysis is close to the surface states density deduced independently from static I(V) data, which confirms the validity of the proposed LFN interpretation. Further, we found that the trap densities in bottom-contact (BC) devices were higher than in their top-contact (TC) counterparts, in agreement with observations of a poorer crystal structure of BC devices, in the contact regions in particular. At the highest bias the noise originating from the contact resistance is also shown to be a dominant component in the PSD, and it is well explained by the noise originating from a gate-voltage dependent contact resistance. A gate area scaling was also performed, and the good scaling and the dispersion at the highest bias confirm the validity of the applied carrier number fluctuations model and the predominant contact noise at high current intensities.     

Effect of KOH treatment on the schottky barrier height and reverse leakage current in Pt/n-GaN

The effect of potassium hydroxide (KOH) treatment was investigated for Pt/n-GaN Schottky diodes using current-voltage (I-V) and capacitance-voltage (C-V) characteristics. Atomic force microscopy (AFM) showed that the surface profile did not change significantly as a result of KOH treatment. The Schottky barrier height increased for both I-V and C-V measurements. The reverse leakage current was also reduced by KOH treatment. By fitting these data to the reverse current based on the thermionic field emission (TFE) model, it was shown that the experimental results are consistent with the presence of high densities of surface states, which were reduced appreciably by KOH treatment. The similar behavior of Pt/n-GaN samples grown by hydride vapor phase epitaxy (HVPE) suggests that the KOH treatment is effective in improving the rectifying characteristics of Schottky barriers to n-GaN grown by both organometallic vapor phase epitaxy (OMVPE) and HVPE.