孪晶片层尺寸对孪晶形变行为的影响

通常多晶铜中会含有一定数量的生长孪晶或退火孪晶。但是，由于一般生长孪晶的尺寸和分布很不均匀，数量也较少，很难研究它们在材料力学行为中的作用，因此孪晶对铜的力学行为的影响还不清楚。最新研究发现，可以利用电解沉积法，通过引入大量的生长孪晶和降低孪晶尺寸来制备纳米结构铜。纳米量级的孪晶结构对力学行为的影响十分明显，但对其作用机理的研究十分有限。本工作对一种由电解沉积法制备的含有独特的高密度纳米孪晶片层结构的多晶纯铜进行室温轧制，通过观察其微观结构，探讨了孪晶结构特别是纳米量级的孪晶片层结构的形变行为以及孪晶片层尺寸对其形变行为的影响。     

原位观察Shockley不全位错的发射

纳米晶体材料与传统的多晶材料相比，具有较高的强度和硬度，其优越的力学性能归因于它们独特的变形机制。在纳米材料中，随着晶粒尺寸的不同，其形变方式主要有晶界转动、晶界扩散、不全位错发射形成层错、孪晶等，这些形变机制已被分子动力学模拟计算所预测。     

脉冲磁场处理的粗晶铝基体中形变孪晶与层错

铝为层错能高的面心立方结构金属材料，在通常的塑性变形情况下，不易形成形变孪晶。最近分子动力学的模拟计算表明，在高应力应变速率条件下纳米晶铝可以出现形变孪晶。随后在物理气相沉积方法制备的纳米铝膜中和低温球磨制备的纳米铝中分别观察到了铝的形变孪晶。但迄今为止，在粗     

激光冲击强化和时效处理对AZ80镁合金形变孪晶及析出相的影响

采用固溶+激光冲击强化(LSP)+时效方法,研究了AZ80镁合金轧板和铸态组织参数(形变孪晶和析出相)和残余应力演变,以及时效处理对其影响。结果表明,固溶+LSP处理后轧板强化层内形成高密度孪晶的形变带,铸态合金高密度形变孪晶产生于晶界附近,均产生于应力集中和高能区域,产生一次或多次孪晶,呈平行或交叉孪晶。时效后连续析出大量的颗粒状β相,其优先于形变带内、孪晶界面或片状孪晶内析出,与晶粒尺寸相关。时效后轧板和铸态冲击表面残余压应力分别为由-100.8 MPa和-68.9 MPa转变为-67.8 MPa和-35.9 MPa,即应力松弛为32.7%和48.7%。LSP次表层硬化效果明显,其时效强化效果较弱。残余压应力及其热稳定性是影响高密度形变孪晶的形成主要因素之一。     

ZnO纳米棒中结的透射电镜研究

本文采用化学气相沉积法制得大量ZnO纳米棒,利用会聚束电子衍射(CBED)研究了纳米棒的生长方向,验证了纳米棒在生长过程中产生碰撞.通过TEM研究发现,纳米棒沿c轴生长,碰撞形成的晶界并不是一个随机取向的大角晶界,为了降低能量,晶界具有孪晶关系.晶界的存在导致晶体产生缺陷生长,使纳米棒的结的附近区域长粗.     

Si和GaAs中的(112)孪晶界

在形变的半导体外延薄膜中经常观察到微孪晶。这种微孪晶的HREM像中往往出现一种三倍于晶格周期性的条纹。本文利用HREM和图像模拟计算技术研究这种条纹的本领。材料有两种:①激光再结晶多晶Si/Si层和②MB EGaAs/Si层。图(1)是Si中的微孪晶的HREM像。图中a和b处是具有敏锐边界的晶界,a处的大白点呈明显的三倍周期性。C处是一个模糊的边界区域。三倍周期条纹的图样特征随着离晶界C的距离而逐渐改变。我们认为这种三倍周期的条纹是两个成孪晶关系的区域重叠而形成的。这种微孪晶片的主晶界是[111]面,而其侧面的晶界应为[112]面。晶界的原子模型如图(2)。按晶界与膜面的取向关系可分成两类,如图(3)。     

ZnSe复合孪晶纳米带的TEM表征

通过热蒸发的方法在镀金的硅衬底上得到了硒化锌(ZnSe)复合孪晶纳米带.利用透射电镜选区电子衍射(SAED)方法并结合明场像确定了ZnSe复合孪晶纳米带的结构及生长方向,发现ZnSe复合孪晶纳米带由取向互为{113}镜面孪晶的两个纳米子带组成,单个纳米子带又由纳米量级的<111>旋转孪晶片层构成.采用会聚束电子衍射(CBED)技术确定了ZnSe复合孪晶纳米带沿<111>方向的极性.根据CBED结果并结合实验过程的设定,对ZnSe复合孪晶纳米带的形成机制进行了讨论.     

半导体陶瓷中孪晶的HREM和TEM研究

Oppolpzer曾用TEM这观察到BaTiO_3半导体陶瓷的孪晶,认为它会伴生异常晶粒长大。但是有关孪晶和孪晶界的结构细节以及形成机制尚不清楚。本文用高分辩电镜(HREM)和透射电镜(TEM)进一步研究了它们的孪晶,得到如下四点结果。1.BaTiO_3的大部分孪晶均为{111)孪晶,其晶界为共格倾斜(70°)孪晶界。图1是[110]方向孪晶的晶格像,图中用粗黑线示意镜面对称的(001)晶格(3.9A),与之垂直的为(110)晶格(2.8A),它相应于左右(指标化示意)上角的衍射结     

奥氏体不锈钢焊缝中形变孪晶的电镜研究

利用电子显微镜对不同材料组合和焊接条件下，奥氏体不锈钢焊缝中形变孪晶的形态进行了现察。实验发现焊缝中形变孪晶的数量和形态与接头的拘束条件有关。在全拘束接头中，孪晶的数量最多，还会出现多次孪晶。随拘束程度的下降，孪晶数量减少。在无拘束接头中，几乎看不到孪晶。这些形变孪晶是由于在奥氏体钢焊缝冷却过程中，结晶凝固和δ－铁素体向奥氏体的相转变，导致焊缝体积缩小而快速引入的拉伸切应力产生的。     

Ti-25 Nb-25 Ta合金拉伸变形过程中｛332｝〈113〉变形孪晶的EBSD研究

本文利用EBSD技术对亚稳β型Ti?25Nb?25Ta合金室温拉伸变形过程中｛332｝〈113〉变形孪晶的演变趋势及交叉现象进行了研究。结果表明：随着变形量的增大，孪晶宽度不断增加，孪晶形态由变形初期的平直细条带状逐渐变为宽窄不一的条带状，至变形末期部分孪晶呈破碎状，孪晶界严重扭曲变形。多数晶粒内产生两种以上｛332｝〈113〉孪晶变体，部分孪晶能穿越晶界继续生长，某些初次孪晶内部有二次｛332｝〈113〉孪晶产生。不同变体孪晶间易发生交叉现象。不同｛332｝〈113〉孪晶变体的交叉作用导致交叉区域出现较大的局部晶格畸变，晶格畸变主要集中于孪晶内部，且交叉界面处的晶格畸变程度最为严重。交叉作用的结果是交叉区域的晶体相对于不同孪晶变体和基体的取向都发生一定程度的改变。     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Nanoimprint Lithography -A Next Generation High Volume Lithography Technique

IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

Influence of PVK ： NPB hole transporting layer on the characteristics of organic light-emitting devices

A doping system consisting of NPB and PVK is employed as a composite hole transporting layer （CHTL）. By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK ： NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK ： NPB at 1：3.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.     

Analysis of error performance on Turbo coded FDPIM

Due to variable symbol length of digital pulse interval modulation（DPIM）, it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation（FDPIM） method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.