磁控溅射ITO薄膜结构和性能的研究

利用中频脉冲磁控溅射工艺制备ITO薄膜,研究了在衬靶间距为60 mm、衬底温度为350℃、溅射功率为120 W、溅射气压为0.2 Pa的条件下,氧氩比(O2/Ar)、溅射时间对ITO薄膜表面形貌、膜厚、沉积速率及光电性能的影响。通过实验和分析,最终确定了在玻璃衬底上制备ITO薄膜的最佳氧氩比和溅射时间:氧氩比为0.4:40,溅射时间为45 min,获得了方阻为2.55Ω/□,电阻率为1.46×10-4Ω·cm,可见光范围内平均透过率为81.2%的薄膜。     

直流磁控溅射ITO薄膜的正交试验分析

利用直流磁控溅射系统制备ITO薄膜,采用正交试验表格L32(48)安排试验.测试了薄膜的方阻和透过率,分析了8个工艺参数对薄膜电光特性的影响,其中沉积气压、氩氧流量比和退火温度的影响最大.分析得到优化工艺参数为:沉积气压2×133.322 4 mPa、氩氧流量比16∶0.5、退火温度427 ℃、靶基间距15、退火时间1 h、溅射功率300 W、退火氛围为真空、沉积温度227 ℃.在此工艺参数下制备的ITO薄膜方阻为17 Ω/□,电阻率为1.87×10-4Ω·cm,在可见光区域平均透过率为85.13%.     

用直流磁控溅射法制备的ＩＴＯ薄膜的光电性能研究

用直流磁控溅射法将ＩＴＯ薄膜制备在玻璃基片上以作为太阳电池的透明电极。通过改变溅射功率、基片温度和工作气压来研究它们对所沉积的ITO薄膜的透过率和电导率的影响。实验结果表明：当溅射功率从30W增加到90W时,薄膜的透过率和电阻率都将减小;当基片温度从25℃ 增加到 150℃时,透过率稍微有点增大但电阻率减小;当工作气压从0.4Pa 增大到2.0Pa时,透过率减小,但电阻率增大。因此,在溅射功率为30W、基片温度为150℃、工作气压为0.4Pa 时,ITO薄膜有比较好的光电性能,其电阻率小于10-4 Ω•cm ,在可见光波段的透过率大于80%,适合于作为太阳电池的透明电极。     

射频磁控溅射法制备液晶光阀光导层的研究

采用射频磁控溅射的方法制备了用于液晶光阀光导层的氢化非晶硅薄膜,研究了工艺参数对氢化非晶硅薄膜透过率及光电导性能的影响。结果表明,薄膜的沉积速率随着溅射功率和衬底温度的升高呈先增加后减小的趋势,在衬底温度为300℃,溅射功率为300W左右沉积速率达到最大,在溅射2h后沉积速率随着溅射时间的增加而下降;薄膜的光吸收系数随衬底温度的升高而增大,随溅射功率的增加而减小;交流电导率随衬底温度和溅射功率的升高而下降;薄膜在可见光范围内透过率随着H分压的增大而增大,且吸收边发生蓝移。     

工艺条件对柔性衬底ITO薄膜光电性能的影响

采用直流磁控溅射法在柔性衬底上镀制ITO透明导电薄膜,全面研究了薄膜厚度、氧气流量、溅射速率、溅射气压和镀膜温度等工艺条件对ITO薄膜光电性能的影响。结果表明,当膜厚大于80nm、氧氩体积比为1∶40、溅射速率为5nm/min、溅射气压在0.5Pa左右、镀膜温度为80～160℃时,ITO薄膜的光电性能较好,其电阻率小于5×10–4?·cm、可见光透光率大于80%。     

溅射参数对Ge_2Sb_2Te_5薄膜光学常数的影响

研究了溅射参数对 Ge2 Sb2 Te5 薄膜的光学常数随波长变化关系的影响 ,结果表明 :(1)当溅射功率一定时 ,随溅射氩气气压的增加 Ge2 Sb2 Te5 薄膜的折射率先增大后减小 ,而消光系数先减小后增大 .(2 )当溅射氩气气压一定时 ,对于非晶态薄膜样品 ,在 5 0 0 nm波长以下 ,折射率随溅射功率的增加先增加后减小 ,消光系数则逐渐减小 ;在 5 0 0 nm以上 ,折射率随溅射功率的增加逐渐减少 ,消光系数先减小后增加 .对于晶态薄膜样品 ,在整个波长范围折射率随溅射功率的增加先减小后增加 ,消光系数则逐渐减少 .(3)薄膜样品的光学常数都随波长的变化而变化 ,在长波     

磁控溅射低阻ITO薄膜的气体参数优化

用直流磁控溅射系统在不同气压和氩氧流量比(V(Ar):V(O2),体积比)下制备铟锡氧化物(ITO)薄膜。测试了薄膜的方阻和透过率,得到不同沉积气压和V(Ar):V(O2)对薄膜电光特性的影响大小和趋势。X-射线衍射(XRD)测试表明ITO薄膜的晶粒尺寸随膜内氧的摩尔分数增加而增大,随氧气比例增加薄膜(400)晶向消失。优化参数为气压266.664 mPa,V(Ar):V(O2)=15:0,制备的ITO薄膜方阻为22Ω/□,在可见光区域平均透过率为85%。     

溅射参数对Ge2Sb2Te5薄膜光学常数的影响

研究了溅射参数对Ge2Sb2Te5薄膜的光学常数随波长变化关系的影响,结果表明：(1)当溅射功率一定时,随溅射氩气气压的增加Ge2Sb2Te5薄膜的折射率先增大后减小,而消光系数先减小后增大.(2)当溅射氩气气压一定时,对于非晶态薄膜样品,在500nm波长以下,折射率随溅射功率的增加先增加后减小,消光系数则逐渐减小;在500nm以上,折射率随溅射功率的增加逐渐减少,消光系数先减小后增加.对于晶态薄膜样品,在整个波长范围折射率随溅射功率的增加先减小后增加,消光系数则逐渐减少.(3)薄膜样品的光学常数都随波长的变化而变化,在长波长范围变化较大,短波长范围变化较小.探讨了影响Ge2Sb2Te5薄膜光学常数的机理.     

工艺对磁控溅射ZAO薄膜光电特性的影响

在玻璃衬底上用直流磁控溅射的方法镀制ZAO透明导电膜,研究了温度、氧压比、溅射气压、溅射速率等工艺条件对ZAO膜电阻率和可见光透过率等光电特性的影响。实验结果表明,当温度470℃、氧氩比0.5/40、溅射气压0.5Pa和镀膜速率3.6nm/min左右时,可获得薄膜电阻率7.2×10–4?·cm、可见光透过率85%以上的最佳光电特性参数。     

射频磁控溅射ITO薄膜中沉积温度对膜特性影响

采用射频磁控溅射的方法,在溅射过程中改变沉积温度以提高铟锡氧化物(ITO)薄膜的电学和光学特性。采用扫描电镜(SEM)分析了ITO薄膜的表面形貌,发现ITO薄膜的晶粒尺寸随着衬底温度的升高而增大。经过后续退火,ITO薄膜的电学特性得到了较大的提高。在溅射条件为工作气压1 Pa、衬底温度200℃和输入功率200 W沉积的样品经过300℃真空退火2 h获得了12.8×10-4Ω.cm的低电阻率和800 nm波段94%的高透过率。     

Photoelectric properties of ITO thin films deposited by DC magnetron sputtering

As anti-reflecting thin films and transparent electrodes of solar cells,indium tin oxide（ITO） thin films were prepared on glass substrates by DC magnetron sputtering process.The main sputtering conditions were sputtering power,substrate temperature and work pressure.The influence of the above sputtering conditions on the transmittance and conductivity of the deposited ITO films was investigated.The experimental results show that, the transmittance and the resistivity decrease as the sputtering power increases from 30 to 90 W.When the substrate temperature increases from 25 to 150℃,the transmittance increases slightly whereas the resistivity decreases.As the work pressure increases from 0.4 to 2.0 Pa,the transmittance decreases and the resistivity increases.When the sputtering power,substrate temperature and work pressure are 30 W,150℃,0.4 Pa respectively,the ITO thin films exhibit good electrical and optical properties,with resistivity below 10^-4Ω·cm and the transmittance in the visible wave band beyond 80%.Therefore,the ITO thin films are suitable as transparent electrodes of solar cells.     

ZAO膜磁控溅射变参数制备技术

采用射频磁控溅射技术生长ZnO:Al(ZAO)薄膜,用X射线衍射仪检测薄膜的结晶质量。为了提高薄膜的生长效率,进行了在生长过程中调整生长参数的试验。结果发现,生长过程中适当地改变参数,不仅可以提高薄膜的生长效率,还可以获得结晶质量更好的薄膜。在工作压强0.35Pa、溅射功率120W条件下粗生长后,改变工作压强为0.2Pa、溅射功率80W进行细生长,制得的薄膜平均可见光透射率为88%,电阻率为7.8×10–4Ω·cm。     

Effect of annealing on the structural, optical and electrical properties of ITO films by RF sputtering under low vacuum level

Indium tin oxide (ITO) thin films were prepared by RF sputtering of ceramic ITO target in pure argon atmosphere at a high base pressure of 3×10⁻⁴ mbar without substrate heating and oxygen admittance. The use of pure argon during deposition resulted in films with high transparency (80-85%) in the visible and IR wavelength region. The films were subsequently annealed in air in the temperature range 100-400 °C. The annealed films show decreased transmittance in the IR region and decreased resistivity. The films were characterized by electron microscopy, spectrophotometry and XRD. The predominant orientation of the films is (2 2 2) instead of (4 0 0). The transmission and reflection spectra in the wavelength range 300-2500 nm are used to study the optical behaviour of the films. The optical transmittance and reflectance spectra of the films were simultaneously simulated with different dielectric function models. The best fit of the spectrophotometric data was obtained using the frequency-dependent damping constant in the Drude model coupled with the Bruggeman effective medium theory for the surface roughness. It has been found that the sputtering power and the chamber residual pressure play a key role in the resulting optical properties. This paper presents the refractive index profile, the structure determined from the XRD and the electrical properties of ITO films. It has been found from the electrical measurement that films sputtered at 200 W power and subsequently annealed at 400 °C have a sheet resistance of 80 Ω/□ and resistivity of 1.9×10⁻³ Ωcm.     

ITO薄膜的制备及其光电特性研究

采用直流磁控溅射法,分别用ITO陶瓷靶、In-Sn合金靶,在玻璃基片上镀膜。研究ITO透明导电膜其膜厚、靶材、溅射气压和溅射速率等工艺对光电特性的影响。结果表明,采用陶瓷靶镀膜要比合金靶效果好,膜厚70nm以上、溅射气压0.45Pa和溅射速率23nm/min左右为最佳工艺条件,并得到了ITO薄膜电阻率1.8×10–4Ω.cm、可见光透过率80%以上。     

PECVD制备非晶硅薄膜的研究

实验采用等离子体增强化学气相沉积(PECVD)法在Si衬底上制备了非晶硅薄膜。研究了射频功率、PH3掺杂浓度等因素对薄膜电阻率以及应力的影响。实验结果表明,对于非掺杂非晶硅薄膜,当射频功率从15W增加到45W时,薄膜应力从张应力变化到压应力,在射频功率为35W时,应力几乎为零,应力绝对值先降低后增加,淀积速率随着射频功率的增加而增加;对于掺杂非晶硅薄膜,电阻率随着PH3掺杂浓度的增加而降低,当PH3流量从0cm3/min增加到12cm3/min时,薄膜掺杂效果明显,电阻率降低3个数量级,继续增加PH3流量,电阻率变化较小,而应力随着PH3掺杂浓度的增加而降低,当PH3流量超过12cm3/min时,应力有增加的趋势。     

Influence of the sputtering pressure on the properties of transparent conducting zirconium-doped zinc oxide films prepared by RF magnetron sputtering

Transparent conducting zirconium-doped zinc oxide films with high transparency and relatively low re-sistivity have been successfully prepared on water-cooled glass substrate by radio frequency magnetron sputtering at room temperature. The Ar sputtering pressure was varied from 0.5 to 3 Pa. The crystallinity increases and the electri-cal resistivity decreases when the sputtering pressure increases from 0.5 to 2.5 Pa. The cystallinity decreases and the electrical resistivity increases when the sputtering pressure increases from 2.5 to 3 Pa. When the sputtering pressure The deposited films are polycrystalline with a hexagonal structure and a preferred orientation perpendicular to the substrate.     

射频溅射功率对非晶Zn-Sn-O薄膜性能的影响

使用射频磁控溅射法,基于不同溅射功率(58、79、116、148和171W)条件在玻璃基底上室温制备了Zn-Sn-O(ZTO)薄膜,并探讨了溅射功率对薄膜的结构、电学性能和光学性能的影响。结果表明,提高溅射功率有助于提升薄膜的沉积速率;XRD分析表明不同溅射功率条件下制备的ZTO薄膜均具备稳定的非晶结构;随着溅射功率的增加,薄膜的电阻率下降,光学吸收边“红移”(光学禁带宽度从3.77eV减小到3.62eV);整体来看,在58~148W溅射功率范围内制备的ZTO薄膜具备较好的可见光透明性,其在380~780nm可见光范围内的平均透过率均超过85%。     

溅射功率对PET衬底上ZnO:Zr薄膜性能的影响

采用直流磁控溅射法在室温下柔性PET衬底上制备出了高质量的掺锆氧化锌(ZnO:Zr)透明导电薄膜。研究了溅射功率对ZnO:Zr薄膜表面形貌、结构、电学和光学性能的影响。溅射功率对ZnO:Zr薄膜的电阻率影响显著:当溅射功率从60W增加到90W时,薄膜的电阻率先减小后增大,在最佳功率80W时,电阻率具有最小值3.67×10-3Ω·cm。所制备的ZnO:Zr薄膜具有良好的附着性能,在可见光区平均透射率高达90%。     

Al-Zr共掺杂ZnO透明导电薄膜制备及光电性能研究

采用直流磁控溅射法,在室温水冷玻璃衬底上制备出Al-Zr共掺杂的ZnO透明导电薄膜。研究结果表明,Ar气压强对Al-Zr共掺杂ZnO透明导电薄膜的结构和电阻率有显著影响。X射线衍射(XRD)表明,Al-Zr共掺杂ZnO透明导电薄膜为六角纤锌矿结构的多晶薄膜,且具有C轴择优取向。扫描电镜(SEM)观察表明,Ar气压强对Al-Zr共掺杂ZnO透明导电薄膜的微观结构影响较大。薄膜的厚度随Ar气压强的增加而变薄,在Ar气压强为2.5Pa时,制备的Al-Zr共掺杂ZnO薄膜电阻率具有最小值1.01×10-3Ω.cm,在可见光区(500～800nm)平均透过率超过93%。