铌酸盐无铅压电薄膜的脉冲激光沉积制备研究

采用脉冲激光沉积(PLD)在Pt/Ti/SiO2/Si基片上制备了新型Li0.04(Na0.5K0.5)0.96(Nb0.775Ta0.225)O3无铅压电陶瓷薄膜,分别利用X-射线衍射仪(XRD)和扫描电镜(SEM)研究了该薄膜的晶体结构及表面形貌,分析研究了制备技术和工艺对薄膜晶体结构及表面形貌的影响.研究结果表明:薄膜的热处理温度和氧气压力对所生长的薄膜影响较大;制备Li0.04(Na0.5K0.5)0.96(Nb0.775Ta0.225)O3薄膜的最佳退火温度和氧气压力分别为650℃和30 Pa;利用脉冲激光沉积的Li0.04(Na0.5K0.5)0.96(Nb0.775Ta0.225)O3无铅压电陶瓷薄膜具有精细的表面结构.     

脉冲激光沉积羟基磷灰石薄膜的研究现状

羟基磷灰石(HA)具有优良的生物相容性,被用作植入体涂层材料广泛应用于整形外科、神经外科和牙科方面,利用脉冲激光沉积(PLD)技术制备的HA薄膜具有高的结晶度和结合强度,受到人们的关注。综述了PLD技术制备HA薄膜的研究现状,系统地阐述了沉积过程中工艺参数对薄膜性质的影响,包括靶材的性质、气氛、衬底温度、激光波长和能量密度、缓冲膜等,分析了薄膜的力学特性和生物活性,展望了该项技术的应用前景。     

脉冲激光沉积β-FeSi2/Si(111)薄膜的工艺条件

用FeSi2合金靶作为靶材,采用准分子激光沉积法在Si(111)单晶基片上制备了单相的-βFeSi2薄膜,并将飞秒脉冲激光沉积法(PLD)引入到-βFeSi2薄膜的制备工艺中;用X射线衍射仪(XRD),场扫描电镜(FSEM),能谱仪(EDS),紫外可见光光谱仪研究了薄膜的结构、组分、表面形貌和光学性能。基片温度为500℃,采用KrF准分子脉冲激光沉积法可获得单相的-βFeSi2薄膜。衬底温度为550℃时,-βFeSi2出现迷津状薄层。采用飞秒脉冲激光法-βFeSi2薄膜的合成温度比准分子脉冲激光沉积法制备温度低50~100℃;薄膜的晶粒分布均匀连续,没有微米级的微滴;飞秒脉冲激光沉积效率比准分子激光的高1000倍以上,是一种快速高效的-βFeSi2薄膜沉积技术。     

沉积速率对硅基LiNbO3光波导薄膜特性的影响

利用脉冲激光沉积技术(PLD)在硅衬底上生长高c轴取向LiNbO3晶体薄膜,研究了激光脉冲频率即薄膜沉积速率对薄膜结晶质量及取向性的影响,发现激光脉冲频率对薄膜的c轴取向性基本没有影响,但对薄膜的结品质量影响较大,激光脉冲频率为3 Hz时获得了高结品质量的c轴取向LiNbO3晶体薄膜.XPS测试表明制得薄膜的组分符合等化学计量比,AFM测试显示制备的薄膜表面光滑,表面粗糙度为4.3 nm.棱镜耦合法测试表明制备的LiNbO3薄膜具有优异的光波导性能,光传输损耗为1.14 dB/cm.     

热处理对离子束溅射SiO2薄膜结构特性的影响分析

采用离子束溅射沉积技术,在熔融石英基底上制备了SiO2薄膜,研究了热处理对离子束溅射SiO2薄膜结构特性的影响。热处理温度对表面粗糙度影响较大,低温热处理可降低表面粗糙度,高温热处理则增大表面粗糙度,选择合适的热处理温度,可以使表面粗糙度几乎不变。采用X射线衍射仪（XRD）物相分析方法,分析了热处理对离子束溅射SiO2薄膜的无定形结构特性的影响,当退火温度为550 ℃,离子束溅射SiO2薄膜的短程有序范围最大、最近邻原子平均距离最小,与熔融石英基底很接近,结构稳定。实验结果表明,采用合适的热处理温度,能大大改善离子束溅射SiO2薄膜的结构特性。     

激光辐照对LCMO薄膜结构和电输运特性的影响

利用脉冲激光溅射沉积技术,在SrTiO3(001)单晶衬底上外延生长了La0.67 Ca0.33 MnO3(LCMO)薄膜.采用CO2激光对制备的薄膜辐照10～60 s.利用X射线衍射(XRD)、原子力显微镜(AFM)和电阻-温度测试系统对激光辐照前后的薄膜进行了对比分析.结果显示,CO2激光辐照增强了LCMO薄膜的结晶性,使薄膜呈现出类似"平原"的表面结构并降低了表面粗糙度.与传统的高温退火类似,经CO2激光辐照后,样品的电阻率从1.3 mΩ·cm下降到0.5 mΩ·cm,绝缘态-金属转变温度(Tp)和温度电阻系数(TCR)分别从255 K和7.9%·K-1提高到263 K和18.7%·K-1.研究结果表明,CO2激光辐照能够在极短的时间内改善LCMO薄膜的O含量和晶粒间的连通性,从而优化和提高了薄膜的电输运特性.     

准分子脉冲激光沉积法制备的ZrO2薄膜结构和电学性能的研究

采用准分子脉冲激光沉积法 (PLD)分别在Pt/Ti/SiO2 /Si和SiO2 /Si衬底上制备了ZrO2 薄膜 ,采用扩展电阻法 (SRP)研究了薄膜纵向电阻分布 ;采用X射线衍射法 (XRD)研究了衬底温度对ZrO2 薄膜结晶性能的影响 ;精确测试了薄膜的表面粗糙度 ;讨论了薄膜结晶性能与其电学I V特性之间的关系。     

脉冲激光沉积Al/Ag掺杂功能梯度薄膜

为了寻找制备梯度金属薄膜的新方法和新工艺,采用脉冲准分子激光扫描沉积技术,在Si(100)单晶衬底上沉积了Al/Ag掺杂功能梯度薄膜,并采用SEM和XPS对制备的薄膜进行了微观分析。分析结果表明,运用合适的激光参数和辅助放电,在沉积温度300℃时,制备出了Al/Ag组分比近似为5:1的掺杂梯度薄膜。该实验方法说明,利用脉冲激光与金属掺杂靶相互作用沉积梯度金属薄膜是可行的。     

脉冲激光沉积技术沉积温度对PZT/LSAT薄膜生长取向的影响

采用固相法分别制备了标准摩尔配比和铅过垦10%的两种靶材.并利用脉冲激光沉积技术(PLD)在镧锶铝钽(LaSrAlTaO3,LSAT)单晶衬底上成功制备了锆钛酸铅(Pb(Zr0.3Ti0.7)O3,PZT)铁电薄膜,在550～750℃沉积温度范围内研究了PZT薄膜的生长取向和铅含最对薄膜生长取向的影响.利用X射线衍射(XRD)仪和原子力显微镜(AFM)表征了薄膜生长取向和表面形貌.XRD测量表明在标准摩尔配比情况下薄膜牛长从550 C近似c轴取向逐渐过渡到750℃近似a轴取向,而在铅过量情况下薄膜生长取向无明显过渡性变化;AFM测量表明PZT薄膜在近似C轴和a轴生长情况下,表面均方根(RMS)粗糙度分别为16.9 nm和13.7 nm,而在混合生长无择优取向的情况下,薄膜表面均方根粗糙度达到68 nm,这可能是两种取向竞争生长的结果.     

NiO薄膜的脉冲激光沉积及其结构和光学特性研究

利用脉冲激光沉积法在ITO玻璃衬底上制备了NiO薄膜,利用XRD、AFM对样品的晶体结构和表面形貌进行了表征,并对其透射光谱进行了测试,研究了衬底温度及脉冲激光能量对所制NiO薄膜的结构、形貌和光学特性的影响。结果表明:在脉冲激光能量为180 mJ、衬底温度为600~700℃条件下所制备的样品为沿(111)晶面择优取向生长的多晶NiO薄膜,薄膜结晶质量良好,表面颗粒排列均匀,可见光透射率较高,禁带宽度为3.40~3.47 eV。     

营养治疗对门诊血液透析患者的作用

利用中频磁控反应溅射技术在玻璃衬底上制备氮化铝(AlN)薄膜,并经退火处理.利用X-衍射和原子力显微镜分析了AlN薄膜的结构及表面形貌.结果表明,衬底温度和退火工艺对AlN薄膜的结构和表面形貌有重要影响.研究表明,衬底温度为230 ℃时,AlN薄膜的表面粗糙度最小,退火能减小AlN薄膜表面粗糙度.     

Microstructures of parylene-N thin films and the effect on copper diffusion

Using scanning electron microscopy, the microstructure of annealed N-type parylene films on silicon substrate was observed and compared to the asdeposited film. The diffusion of copper through the parylene-N film was studied and correlated to the microstructure. A web-like microstructure was observed on annealing parylene-N to a temperature of 300°C and higher. This microstructure differed from the as-deposited homogeneous and continuous structure at room temperature. The web-like structure observed is proposed to be a fibrillar crystalline structure embedded in an amorphous matrix. X-ray diffraction studies supported this view and showed that the crystalline structure was theß phase. Also, when the film was annealed at 300 and 350°C, a thin continuous layer was formed at the surface of the web-like parylene-N film. In contrast, no such thin layer was observed when the annealing was performed with a copper overlayer. Based on this observation, a two-stage annealing process was carried out to reduce the copper diffusion into parylene-N, preannealing, before copper deposition and post-annealing after copper deposition. The results, as judged from Rutherford backscattering spectroscopy indicate that the thermal stability for copper diffusion into parylene-N films can be increased by 50°C (from 300 to 350°C) using pre-annealing. Experimental data shows that a minimum pre-anneal temperature of 250°C for 1 h is required for this purpose.     

The properties of annealed AlN films deposited by pulsed laser deposition

AlN films deposited on SiC or sapphire substrates by pulsed laser deposition were annealed at 1200°C, 1400°C, and 1600°C for 30 min in an inert atmosphere to examine how their structure, surface morphology, and substrate-film interface are altered during high temperature thermal processing. Shifts in the x-ray rocking curve peaks suggest that annealing increases the film density or relaxes the films and reduces the c-axis Poisson compression. Scanning electron micrographs show that the AlN begins to noticeably evaporate at 1600°C, and the evaporation rate is higher for the films grown on sapphire because the as-deposited film contained more pinholes. Rutherford backscattering spectroscopy shows that the interface between the film and substrate improves with annealing temperature for SiC substrates, but the interface quality for the 1600°C anneal is poorer than it is for the 1400°C anneal when the substrate is sapphire. Transmission electron micrographs show that the as-deposited films on SiC contain many stacking faults, while those annealed at 1600°C have a columnar structure with slightly misoriented grains. The as-deposited films on sapphire have an incoherent interface, and voids are formed at the interface when the samples are annealed at 1600°C. Auger electron spectroscopy shows that virtually no intermixing occurs across the interface, and that the annealed films contain less oxygen than the as-grown films.     

Annealing effects on the formation of semiconducting Mg2Si film using magnetron sputtering deposition

Semiconducting Mg2Si films were synthesized on silicon (11 1) substrates by magnetron sputtering deposition and subsequent annealing in an annealing furnace filled with argon gas,and the effects of heat treatment on the formation and microstructure of Mg2Si films were investigated.The structural and morphological properties were investigated by X-ray diffraction (XRD) and scanning electron microscopy (SEM),respectively.The results show that the crystal quality of Mg2Si films depends strongly on the annealing temperature,the annealing time and the deposited magnesium film thickness.Annealing at 400 ℃ for 5 h is optimal for the preparation of Mg2Si film.XRD and SEM results show that magnesium silicide film with various orientations is formed on the silicon surface because of the interdiffusion and reaction of magnesium with substrate silicon atoms,and the evolution of surface features on growing films is very dependent on the annealing temperature and time.     

溅射法制备高取向Pt薄膜的工艺研究

采用射频磁控溅射工艺在SiO2／Si衬底上成功制备了适用于pZT铁电薄膜底电极的180nm厚、沿(111)晶向强烈取向的Pt薄膜。厚约50nm的Ti膜被用作过渡层，以增强Pt薄膜与衬底之间的黏着性。实验表明，在Pt薄膜的制备过程中，较高的衬底温度有利于薄膜晶化，促使Pt薄膜沿(111)晶向择优取向生长。而在薄膜沉积后加入适当的热处理工艺，能有效地提高Pt薄膜的择优取向性，同样可以得到沿(111)晶向强烈取向的Pt薄膜。原子力显微镜分析表明，制得的薄膜结构相对致密，结晶状况良好，晶粒尺寸约为50nm。     

Analysis of the stress and interfacial reactions in Pt/Ti/SiO2/Si for use with ferroelectric thin films

The microstructure of the Pt/Ti/SiO₂/Si structure has been investigated by scanning and transmission electron microscopy. Pt films of 100 nm thickness deposited by sputtering or evaporation onto unheated substrates gave complete coverage of the underlying Ti layer and showed a granular and faceted structure with grains ∼20 nm in diameter. They did not exhibit hillocks or surface TiO_x formation. X-ray diffraction was used to examine the film stress through use of the sin²ψ method with bulk values for the elastic constants (v=0.39, E=162 GPa). The as-deposited sputtered film had a compressive stress of ∼540 MPa, while the evaporated films had tensile stresses of ∼630 MPa. The films then received a 400°C rapid thermal anneal (RTA) for 90 s and a subsequent RTA of 650°C for 30s. Further investigation of the film stresses and microstructure were made after each annealing step. After the low temperature anneal, the film stress for the sputtered film became tensile. Plan-view sections examined by transmission electron microscopy (TEM) showed that the as-deposited sputtered films were dense but became porous after annealing. Initially, the evaporated films had a less dense microstructure, but were more stable with annealing. Little change in the stress for the evaporated film was observed after this initial low temperature annealing step. Additional annealing of the evaporated and sputtered samples caused complete consumption of the Ti layer including some TiO_x formation from the underlying SiO₂ layer and marked interaction with the Pt; however, little change in the stress was found. The surface of the Pt film revealed larger grains, but otherwise remained unaffected. The underlying phase changes were minimized once the Ti layer had reacted with the Pt. Due to the ratio of the layers, Pt:Ti of 2:1, the surface of the Pt was unaffected.     

退火温度对Cr-Si压阻薄膜电性能的影响

采用射频磁控溅射法在氧化铝陶瓷基底上制备了Cr-Si-Ni-Ti压阻薄膜,研究了不同退火温度对薄膜电性能的影响.结果表明:在溅射态及退火温度低于600℃时,薄膜为非晶态.随着退火温度的升高,薄膜的电阻温度系数(TCR)逐渐增大,应变因子(GF)先增大后减小,室温电阻率(ρ)则逐渐降低.在退火温度为300℃时,Cr-Si...     

Microstructure evolution of amorphous silicon thin films upon annealing studied by positron annihilation

Amorphous silicon (a-Si) thin films were prepared on glass substrates by plasma enhanced chemical vapor deposition (PECVD). Influence of annealing temperature on the microstructure, surface morphology, and defects evolution of the films were studied by X-ray diffraction (XRD), atomic force microscope (AFM) and positron annihilation Doppler broadening spectroscopy (DBS) based on a slow positron beam, respectively. The S parameter of the as-deposited a-Si thin film is high, indicative of amorphous state of Si film with many defects. The a-Si gradually grows into polycrystalline silicon with increasing temperature to 650 °C. For the films annealed below ~450 °C, positron diffusion lengths are rather small because most positrons are trapped in the defects of the a-Si films and annihilated there. With further rising the temperature to 600 °C, the diffusion length of positrons increases significantly due to the removal of vacancy-type defects upon annealing at a high temperature. The results indicate that the coalescence of small vacancy-type defects in a-Si thin film and the crystallization of a-Si occur around 450 °C and 650 °C, respectively.     

Effects of annealing temperature and surface preparation on the formation of cobalt silicide interconnects

Cobalt silicide films have been prepared by rapid thermal annealing of cobalt layers sputter deposited on silicon substrates. We report on the evolution of silicide phases, surface and interface roughness as a function of the annealing temperature and silicon surface preparation. The characterizations are carried out by atomic force microscopy, X-ray diffraction, X-ray reflectivity, Raman spectroscopy, and transmission electron microscopy. The cleaning procedure of the silicon substrate affects the interface roughness and the silicide thickness, whereas little effects are found on the surface. On the other hand, surface roughness increases with annealing temperature.     

低温激光退火多晶硅薄膜的光学常数研究

用分光反射光谱(SR)和分光椭偏光谱(SE)来分析低温激光退火多晶硅薄膜的光学特性。利用多层光学和Braggeman有效介质近似模型(B-EMA),对薄膜光学常数和结构参数(膜厚度,表面粗糙度和非均匀性)的退火功率依存关系进行解析。解析结果表明,有一个临界退火功率存在。退火达到这个功率时,多晶硅薄膜的光学常数非常接近单晶硅。由于受增大晶粒尺寸影响,在这个功率时,薄膜表面粗糙度和非均匀性也显示了一峰值。在整个退火区域,膜厚度有大约8%变化。