一个新型CMOS电流模带隙基准源

介绍了一个新型电流模带隙基准源,该带隙基准源的输出基准可以设计为任意大于硅材料的带隙电压（1.25V）的电压,避免在应用中使用运算放大器进行基准电压放大. 同时该结构消除了传统电流模带隙基准源的系统失调. 该带隙基准源已通过UMC 0.18μm混合信号工艺验证. 在1.6V电源电压下,该带隙基准源输出145V的基准电压,同时消耗27μA的电流. 在不采用曲率补偿的情况下,输出基准的温度系数在30℃ 到150℃的温度范围内可以达到23ppm/℃. 在电源电压从1.6变化到3V的情况下,带隙基准源的输入电压调整率为2.1mV/V. 该带隙基准源在低频（10Hz）的电源电压抑制比为40dB. 芯片面积（不包括Pads）为0.088mm2.     

一个新型CMOS电流模带隙基准源

介绍了一个新型电流模带隙基准源,该带隙基准源的输出基准可以设计为任意大于硅材料的带隙电压(1.25V)的电压,避免在应用中使用运算放大器进行基准电压放大.同时该结构消除了传统电流模带隙基准源的系统失调.该带隙基准源已通过UMC 0.18μm混合信号工艺验证.在1.6V电源电压下,该带隙基准源输出1.45V的基准电压,同时消耗27μA的电流.在不采用曲率补偿的情况下,输出基准的温度系数在30℃到150℃的温度范围内可以达到23ppm/℃.在电源电压从1.6变化到3V的情况下,带隙基准源的输入电压调整率为2.1mV/V.该带隙基准源在低频(10Hz)的电源电压抑制比为40dB.芯片面积(不包括Pads)为0.088mm2.     

一个电压接近1V 10ppm/℃带曲率补偿的CMOS带隙基准源

介绍了一个带曲率补偿的低电压带隙基准源.由于采用电流模结构,带隙基准源的最低电源电压为900mV.通过VEB线性化补偿技术,带隙基准源在0到150℃的温度范围内的温度系数为10ppm/℃.在电源电压为1.1V时,电源电流为43μA,低频的PSRR为55dB.该带隙基准源已通过UMC 0.18μm混合信号工艺验证,芯片面积为0.186mm2.     

一个电压接近1V 10ppm/℃带曲率补偿的CMOS带隙基准源

介绍了一个带曲率补偿的低电压带隙基准源.由于采用电流模结构,带隙基准源的最低电源电压为900mV.通过VEB线性化补偿技术,带隙基准源在0到150℃的温度范围内的温度系数为10ppm/℃.在电源电压为1.1V时,电源电流为43μA,低频的PSRR为55dB.该带隙基准源已通过UMC 0.18μm混合信号工艺验证,芯片面积为0.186mm2.     

高性能带隙基准电压源的设计

本文基于带隙基准电压源的工作原理,实现了一种利用PATA电流产生基准电压的高性能带隙基准源。该带隙基准源温度特性良好,具有较高精度的输出电压,所以使电源管理芯片的工作电压具有更小的温度系数,使芯片工作更稳定。利用Candance仿真器,基于CSMCO．5umCMOSI艺对电路进行仿真,对基准源进行仿真与分析。仿真结果表明,当R2=316时,基准电压有最好的温度特性;并运用cadence软件中的“Calculator”工具计算出在该温度时,带隙基准电压源有最小的温漂系数。     

基于LDO电压调整器的带隙基准电压源设计

设计一款应用于电压调整器（LDO）的带隙基准电压源。电压基准是模拟电路设计必不可缺少的一个单元模块,带隙基准电压源为LDO提供一个精确的参考电压,是LDO系统设计关键模块之一。本文设计的带隙基准电压源采用0.5μm标准的CMOS工艺实现。为了提高电压抑制性,采用了低压共源共栅的电流镜结构,并且在基准内部设计了一个运算放大器,合理的运放设计进一步提高了电源抑制性。基于Cadence的Spectre进行前仿真验证,结果表明该带隙基准电压源具有较低的变化率、较小的温漂系数和较高的电源抑制比,其对抗电源变化和温度变化特性较好。     

一种高精度CMOS带隙基准电压源设计

介绍了带隙基准电压源的基本原理,设计了一种高精度带隙基准电压源电路.该电路采用中芯国际半导体制造公司0.18 μm CMOS工艺.Hspice仿真表明,基准输出电压在温度为-10～120 ℃时,温度系数为6.3×10-6/℃,在电源电压为3.0～3.6 V内,电源抑制比为69 dB.该电压基准在相变存储器芯片电路中,用于运放偏置和读出/写驱动电路中所需的高精度电流源电路.     

CMOS带隙基准源研究现状

带隙基准源是集成电路中的重要单元,输出不随温度、电源电压变化的基准电压或电流.简单介绍了CMOS带隙基准源的基本工作原理;指出了限制其性能的主要因素;分析了低电源电压、低功耗、高精度和高PSRR四种类型的CMOS带隙基准源.     

一种基于LDO稳压器的带隙基准电压源设计

设计了一种结构简单的基于LDO稳压器的带隙基准电压源.由于目前LDO芯片的面积越来越小,所以在传统带隙基准电压源的基础上,对结构做了简化及改进,在简化设计的同时获得了高的性能.该带隙基准使用三极管作为运算放大器的输入,同时省去了多余的等效二极管,并将此结构应用于LDO结构中.对带隙基准的仿真结果表明,在5 V的电源下,产生25×10-6/℃温度系数的带隙基准电压.低频时电源抑制比为138dB.将该带隙基准结合缓冲器应用于LDO稳压器中,对LDO的仿真结果表明,负载特性良好,相位裕度为63.3度.线性负载率也符合要求.此电路简单可行,可适用于各种LDO芯片中.     

LED显示屏的恒流驱动电路的设计

介绍了一种LED显示屏的恒流驱动电路,该电路包括输出控制部分电源电压的低压差线性稳压器、产生多路基准电压的带隙基准电压源、误差放大器、缓冲器、多个大功率MOS管以及取样MOS管五个部分,并且重点介绍了其中的低压差线性稳压器和带隙基准电压源的具体实现电路,能够更好的减少振荡,提高精度。通过上述恒流驱动电路为多路LED提供恒定的0.4V的驱动电流。     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.     

GaAsSb/InAlAs PA DHBTs Grown by Production MBE

The epi material growth of GaAsSb based DHBTs with InAlAs emitters are investigated using a 4 × 100mm multi-wafer production Riber 49 MBE reactor fully equipped with real-time in-situ sensors including an absorption band edge spectroscope and an optical-based flux monitor. The state-of-the-art hole mobilities are obtained from 100nm thick carbon-doped GaAsSb. A Sb composition variation of less than ± 0.1 atomic percent across a 4 × 100mm platen configuration has been achieved. The large area InAlAs/GaAsSb/InP DHBT device demonstrates excellent DC characteristics,such as BVCEO＞6V and a DC current gain of 45 at 1kA/cm2 for an emitter size of 50μm × 50μm. The devices have a 40nm thick GaAsSb base with p-doping of 4. 5 × 1019cm-3 . Devices with an emitter size of 4μm × 30μm have a current gain variation less than 2% across the fully processed 100mm wafer. ft and fmax are over 50GHz,with a power efficiency of 50% ,which are comparable to standard power GaAs HBT results. These results demonstrate the potential application of GaAsSb/InP DHBT for power amplifiers and the feasibility of multi-wafer MBE for mass production of GaAsSb-based HBTs.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.