二维MEMS风速风向传感器的设计与测试

给出一种基于MEMS工艺的二维风速风向传感器的设计、制造以及测试结果。该传感器加热电阻采用圆形结构,四个测温电阻对称分布在芯片四周。传感器芯片在玻璃衬底上采用两步MEMS剥离工艺加工,加工工艺简单可靠。该传感器采用恒功率工作方式,利用热温差原理测量风速和风向。经过风洞测试,传感器可以完成360°风向检测,误差不超过10°。     

一种基于CMOS工艺的二维风速传感器的设计和测试

给出了一种完全基于CM O S工艺的、能同时测量风速和风向的二维测风传感器的结构、工作原理及其测试结果。该传感器采用恒温差工作模式,热堆输出电压平均值反映芯片温度和环境温度的差,省去了测温二极管。风速测量采用热损失型原理,因此不存在速度量程问题;同时通过四周对称分布热堆的相对差分输出得到风向,风向的测试和风速无关。测试电路是由普通运放电路组成的控制和测试系统。经过风洞测试,风速的测量可以达到23m/s,风速分辨率达到0.5 m/s,风速的最大误差为0.5 m/s。传感器的反应时间为3~5秒,整个功率损耗约为500 mW。     

针对基于陶瓷衬底的风速传感器的热不对称特性补偿研究

提出一种基于陶瓷衬底制备的风速风向传感器的设计,芯片结构中设置了1个中心加热电阻,1个中心测温电阻和4个温度分布检测电阻,并引入了4个辅助加热电阻,用于对芯片的功率分布进行再分配.在传感器制备过程中,对于封装造成的芯片表面热分布的不对称特性,能够利用辅助加热元件对芯片进行功率再分布以补偿,进而抵消掉由于热不对称造成的芯...     

会议文章 针对基于陶瓷衬底的风速传感器的热不对称特性补偿研究

本文提出一种基于陶瓷衬底制备的风速风向传感器的设计,芯片结构中设置了1个中心加热电阻,1个中心测温电阻和4个温度分布检测电阻,并引入了4个辅助加热电阻,用于对芯片的功率分布进行再分配。在传感器制备过程中,由于封装造成的芯片热分布的不对称特性,能够利用辅助加热元件对芯片进行功率再分布以补偿,进而抵消掉由于热不对称造成的芯片输出信号的偏移。通过功率再分布补偿技术,可使芯片输出信号的波动低于10mV,风向检测误差低于2度。     

二维MEMS风速风向传感器的设计与测试

给出一种基于MEMS工艺的二维风速风向传感器的设计、制造以及测试结果。该传感器加热电阻采用圆形结构，四个测温电阻对称分布在芯片四周。传感器芯片在玻璃衬底上采用两步MEMS剥离工艺加工，加工工艺简单可靠。该传感器采用恒功率工作方式，利用热温差原理测量风速和风向。经过风洞测试，传感器可以完成360°风向检测，误差不超过10°。     

一种基于MEMS工艺的二维风速传感器的设计

给出了一种基于MEMS工艺的二维热风速传感器的设计、制造以及测试结果.该传感器采用恒功率工作方式,利用热温差的方法测量风速和风向.本传感器采用MEMS剥离工艺在玻璃衬底上同时加工出加热电阻和测温电阻,利用简单可靠的加工工艺实现了热隔离和高灵敏度.经过风洞风速风向测试,得知传感器的风速量程超过10m/s,360°范围内风向测量误差不超过8°.传感器的响应时间不超过1s,功耗为10mW.     

一种基于MEMS工艺的二维风速传感器的设计

给出了一种基于MEMS工艺的二维热风速传感器的设计、制造以及测试结果.该传感器采用恒功率工作方式,利用热温差的方法测量风速和风向.本传感器采用MEMS剥离工艺在玻璃衬底上同时加工出加热电阻和测温电阻,利用简单可靠的加工工艺实现了热隔离和高灵敏度.经过风洞风速风向测试,得知传感器的风速量程超过10m/s,360°范围内风向测量误差不超过8°.传感器的响应时间不超过1s,功耗为10mW.     

热薄膜温差型CMOS风速风向传感器的研究和实现

介绍了一种基于 CMOS,能同时测量风速风向的硅集成传感器。通过保持芯片和环境温差恒定在设定值 ,测量芯片上对称区域由于风强迫对流而引起的温差 ,利用二维结构同时获得风速风向信息。本文首先介绍热薄膜温差型风速风向传感器原理 ,给出了具体结构和工艺 ,最后对样品进行了风洞测试 ,传感器能够测量风速 0～ 2 3 m/ s且 3 60°方向敏感     

一种电流型温度传感芯片设计

设计并实现了一种电流型温度传感芯片。分析了测温原理和厄利效应对测温精度的影响,提出了一种集电极-发射极电压补偿电路,利用一组电流镜和匹配电阻将输出电流和温度之间的传递函数线性化,提高了芯片的线性度和测温精度。设计了反向偏置保护电路,增大芯片可承受的反向电压。芯片采用40 V互补双极工艺设计并流片。测试结果表明,芯片在-55～150 ℃温度区间内的非线性误差为±0.2 ℃,测温精度小于±0.3 ℃。     

一种多功能低空气象探测仪的设计与实现

研究了一种基于MSP430单片机的低空气象探测仪器。系统硬件包括主控制模块、传感器模块、通信模块和存储模块等。风向测量系统通过由平面电子罗盘XW3200和风标组成的磁方位风向传感器实现;压力测量电路采用绝压传感器ASDX015,将其模拟电压传入主芯片;利用叶轮式风速传感器,由主芯片接受霍尔传感器产生的电磁脉冲实现风速的测量。该仪器可实现气温、气压、湿度、风等参量的实时测量和存储,野外测试结果表明,系统性能可靠、使用方便、能够满足精度和战技指标要求。     

Monolithic pressure-flow sensor

A new silicon-based monolithic pressure-flow sensor has been developed. Its operation is based on the piezoresistive effect for pressure sensing and heat transfer for flow sensing. The sensor chip has a thermal isolation structure that is made of an oxidized porous silicon membrane. This structure thermally isolates the heating element located on the membrane from the rim of the chip. The sensor, in which the chip was mounted on a wall of an acrylate plastic pipe, was designed for biomedical applications. Measurements were made at pressures of 0-300 mmHg, water flow rates of 0-7 1/min, and fluid temperatures of 25-45°C. The temperature difference between the heating element and the fluid temperature sensing element was kept at 5°C. The sensor showed a pressure sensitivity of 1.32 µV/mmHg for 1-mA current supplied, a nonlinearity of 0.5 %F.S. for pressure sensing, an accuracy of ±10 %F.S. for flow sensing, and 90-percent response time of below 100 ms for flow sensing. The sensor was applied to the simultaneous measurements of pressure and flow rate in pulsedflow experimental systems.     

基于新型DCA封装的陶瓷风速风向传感器

An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attaching （DCA） packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics （CFD） model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor.     

Fast-response silicon flow sensor with an on-chip fluid temperature sensing element

A new silicon flow sensor with a robust thermal isolation structure has been developed. The thermal isolation structure is mainly made of a 20-µm-thick oxidized porous silicon membrane. This thermal isolation structure makes it possible for the sensor to have a fast-response characteristic and an on-chip fluid temperature sensing element design. The sensor can be used in liquid flow as well as gas flow. Its operation is based on heat transfer from the heated sensor to a moving fluid. It has two platinum thin-film resistors, a heating element, and a fluid temperature sensing element on the chip. The sensing element is thermally isolated from the heating element. The external circuit of the sensor maintains a constant temperature difference between the heating element and the fluid. The sensor chip characteristics were evaluated theoretically by heat transfer analysis during the chip design. Measurements were made for oil flow velocity of 0-30 cm/s and air flow velocity of 0-14 m/s. Response time was below 100 ms, and a compensated output for fluid temperature change was obtained.     

A 1024-element linear CCD photo sensor with unique photodiode structure

The development of a novel 1024-element linear CCD sensor is reported. The device incorporates a unique photodiode structure which includes a p-n junction diode for photo sensing and a surface MOS diode for charge storing. Only two power supplies are required to drive this device. The following good results are obtained with this device: 1.0-lx . s saturation exposure, 0.5-V saturation output, ±2.5-percent signal nonuniformity, and a dark-current saturation time of 5 s at room temperature. The device is expected to find broad application in the facsimile reader field.     

CPU热柱散热器实验研究与温度场数值模拟

对CPU热柱散热器的散热性能进行了实验研究,测试加热功率、风速等主要工况不同时发热电子元件表面的温度,比较并分析了测试结果。运用有限元分析软件ANSYS对该散热器进行了温度场数值模拟分析。研究在风冷条件下,同等尺寸的普通铜柱CPU散热器和热柱散热器的温度分布。结果表明,热柱散热器具有良好的散热性能,在较低风速下也能有效地降低CPU的温度。     

光纤布拉格光栅热式流量传感技术研究

光纤布拉格光栅(Fiber Bragg Grating, FBG)热式流量传感技术具有测量阈值低、灵敏度高等优点,是近年来流量测量领域的研究热点。概述了FBG热式流量传感原理,总结了当前该技术研究的重点和难点问题(主要分为传感器加热、结构设计、温度补偿和封装增敏四个方面),旨在发现问题、展望未来。从近年来的典型研究成果入手,分析了电加热、光加热两种传感器加热方式和热线式传感结构。温度补偿和封装增敏部分则作为专题来研究,其中温度补偿旨在解决传感器加热换热与环境温度交叉敏感问题。最后归纳分析了该技术在大流量时的低灵敏度特性,并讨论了提升传感器灵敏度未来可能的研究方向和相关方法。