A 150-nA 13.4-ppm/℃switched-capacitor CMOS sub-bandgap voltage reference

A nanopower switched-capacitor CMOS sub-bandgap voltage reference has been implemented using a Chartered 035-μm 3.3-V/5-V dual gate mixed-signal CMOS process.The proposed circuit generates a precise sub-bandgap voltage of 1 V.The temperature coefficient of the output voltage is 13.4 ppm/℃with the temperature varying from -20 to 80℃.The proposed circuit operates properly with the supply voltage down to 1.3 V,and consumes 150 nA at room temperature.The line regulation is 0.27%/V.The power supply rejection ratio at 100 Hz and 1 MHz is -39 dB and -51 dB,respectively.The chip area is 0.2 mm~2.     

一种光接收机中的高增益宽动态范围跨阻放大器

As the front-end preamplifiers in optical receivers, transimpedance amplifiers （TIAs） are commonly required to have a high gain and low input noise to amplify the weak and susceptible input signal. At the same time, the TIAs should possess a wide dynamic range （DR） to prevent the circuit from becoming saturated by high input currents. Based on the above, this paper presents a CMOS transimpedance amplifier with high gain and a wide DR for 2.5 Gbit/s communications. The TIA proposed consists of a three-stage cascade pull push inverter, an automatic gain control circuit, and a shunt transistor controlled by the resistive divider. The inductive-series peaking technique is used to further extend the bandwidth. The TIA proposed displays a maximum transimpedance gain of 88.3 dBΩ with the -3 dB bandwidth of 1.8 GHz, exhibits an input current dynamic range from 100 nA to 10 mA. The output voltage noise is less than 48.23 nV/√Hz within the -3 dB bandwidth. The circuit is fabricated using an SMIC 0.18 μm 1P6M RFCMOS process and dissipates a dc power of 9.4 mW with 1.8 V supply voltage.     

一种1.8伏带有foldback过流过热保护的低压线性稳压器设计

This paper introduces the design of a l.8 V low dropout voltage regulator （LDO） and a foldback current limit circuit which limits the output current to 3 mA when load over-current occurs. The LDO was implemented in a 0.18 μm CMOS technology. The measured result reveals that the LDO s power supply rejection （PSR） is about -58dB and -54dB at 20Hz and 1kHz respectively,the response time is 4μs and the quiescent currentis 20μA. The designed LDO regulator can work with a supply voltage down to 2.0 V with a drop-out voltage of 200 mV at a maximum load current of 240 mA.     

A sub-1 V high-precision CMOS bandgap voltage reference

A third-order, sub-1 V bandgap voltage reference design for low-power supply, high-precision applications is presented. This design uses a current-mode compensation technique and temperature-dependent resistor ratio to obtain high-order curvature compensation. The circuit was designed and fabricated by SMIC 0.18 μm CMOS technology. It produces an output reference of 713.6 mV. The temperature coefficient is 3.235 ppm/℃ in the temperature range of -40 to 120 ℃, with a line regulation of 0.199 mV/V when the supply voltage varies from 0.95 to 3 V. The average current consumption of the whole circuit is 49 μA at the supply voltage of 1 V.     

基于带隙的具有高稳定性欠压锁存方法

Highly reliable bandgap-based under-voltage-lockout(UVLO) methods are presented in this paper.The proposed under-voltage state to signal conversion methods take full advantages of the high temperature stability characteristics and the enhancement low-voltage protection methods which protect the core circuit from error operation; moreover,a common-source stage amplifier method is introduced to expand the output voltage range.All of these methods are verified in a UVLO circuit fabricated with a 0.5 μm standard BCD process technology.The experimental result shows that the proposed bandgap method exhibits a good temperature coefficient of 20 ppm/℃,which ensures that the UVLO keeps a stable output until the under-voltage state changes.Moreover,at room temperature,the high threshold voltage VTH+ generated by the UVLO is 12.3 V with maximum drift voltage of 80 mV,and the low threshold voltage VTH- is 9.5 V with maximum drift voltage of ±70 mV.Also,the low voltage protection method used in the circuit brings a high reliability when the supply voltage is very low.     

A novel CMOS charge-pump circuit with current mode control 110 mA at 2.7 V for telecommunication systems

This paper presents a novel organization of switch capacitor charge pump circuits based on voltage doubler structures. Each voltage doubler takes a dc input and outputs a doubled dc voltage. By cascading voltage doublers the output voltage increases up to 2 times. A two-phase voltage doubler and a multiphase voltage doubler structures are discussed and design considerations are presented. A simulator working in the Q-V realm was used for simplified circuit level simulation. In order to evaluate the power delivered by a charge pump, a resistive load is attached to the output of the charge pump and an equivalent capacitance is evaluated. To avoid the short circuit during switching, a clock pairs generator is used to achieve multi-phase non-overlapping clock pairs. This paper also identifies optimum loading conditions for different configurations of the charge pumps. The proposed charge-pump circuit is designed and simulated by spice with TSMC 0.35-μm CMOS technology and operates with a 2.7 V to 3.6 V supply voltage. It has an area of 0.4 mm2; it was designed with a frequency regulation of 1 MHz and internal current mode to reduce power consumption.     

一种高可靠性、低功耗单节锂电池保护电路

A single lithium-ion battery protection circuit with high reliability and low power consumption is proposed.The protection circuit has high reliability because the voltage and current of the battery are controlled in a safe range.The protection circuit can immediately activate a protective function when the voltage and current of the battery are beyond the safe range.In order to reduce the circuit’s power consumption,a sleep state control circuit is developed.Additionally,the output frequency of the ring oscillation can be adjusted continuously and precisely by the charging capacitors and the constant-current source.The proposed protection circuit is fabricated in a 0.5 m mixed-signal CMOS process.The measured reference voltage is 1.19 V,the overvoltage is 4.2 V and the undervoltage is 2.2 V.The total power is about 9 W.     

A CMOS low power, process/temperature variation tolerant RSSI with an integrated AGC loop

A low voltage low power CMOS limiter and received signal strength indicator(RSSI) with an integrated automatic gain control(AGC) loop for a short-distance receiver are implemented in SMIC 0.13μm CMOS technology.The RSSI has a dynamic range of more than 60 dB and the RSSI linearity error is within i0.5 dB for an input power from -65 to -8 dBm.The RSSI output voltage is from 0.15 to 1 V and the slope of the curve is 14.17 mV/dB while consuming 1.5 mA(I and Q paths) from a 1.2 V supply.Auto LNA gain mode selection with a combined RSSI function is also presented.Furthermore,with the compensation circuit,the proposed RSSI shows good temperature-independent and good robustness against process variation characteristics.     

An inherent curvature-compensated voltage reference using non-linearity of gate coupling coefficient

A novel current-mode voltage reference circuit which is capable of generating sub-1 V output voltage is presented. The proposed architecture exhibits the inherent curvature compensation ability. The curvature compensation is achieved by utilizing the non-linear behavior of gate coupling coefficient to compensate non-linear temperature dependence of base-emitter voltage. We have also utilized the developments in CMOS process to reduce power and area consumption. The proposed voltage reference is analyzed theoretically and compared with other existing methods. The circuit is designed and simulated in 180 nm mixed-mode CMOS UMC technology which gives a reference level of 246 mV. The minimum required supply voltage is 1 V with maximum current drawn of 9.24 μA. A temperature coefficient of 9 ppm/℃ is achieved over -25 to 125 ℃ temperature range. The reference voltage varies by ±11 mV across process corners. The reference circuit shows the line sensitivity of 0.9 mV/V with area consumption of 100 × 110 μm².     

New Curvature-Compensated CMOS Bandgap Voltage Reference

A novel curvature-compensated CMOS bandgap voltage reference is presented. The reference utilizes two first order temperature compensations generated from the nonlinearity of the finite current gain β of vertical pnp bipolar transistor. The proposed circuit, designed in a standard 0.18 μm CMOS process, achieves a good temperature coefficient of 2.44 ppm/℃ with temperature range from --40℃ to 85 ℃, and about 4 mV supply voltage variation in the range from 1.4 V to 2.4 V. With a 1.8 V supply voltage, the power supply rejection ratio is -56dB at 10MHz.     

Software Radio——Software Radio： A Review of Design Considerations and Digital Hardware Choices

This paper reviews the requirements for Software Defined Radio （SDR） systems for high-speed wireless applications and compares how well the different technology choices available- from ASICs, FPGAs to digital signal processors （DSPs） and general purpose processors （GPPs） - meet them.     

EEFA： Energy Efficiency Frame Aggregation Scheduling Algorithm for IEEE 802.11n Wireless Network

Packet size is restricted due to the error-prone wireless channel which drops the network energy utilization. Furthermore, the frequent packet retransmissions also lead to energy waste. In order to improve the energy efficiency of wireless networks and save the energy of wireless devices, EEFA （Energy Efficiency Frame Aggregation）, a frame aggregation based energy-efficient scheduling algorithm for IEEE 802.11n wireless network, is proposed. EEFA changes the size of aggregated frame dynamically according to the frame error rate, so as to ensure the data transmission and retransmissions completed during the TXOP and reduce energy consumption of channel contention. NS2 simulation results show that EEFA algorithm achieves better performance than the original frame-aggregation algorithm.     

SDN-Based Data Offioading for 5G Mobile Networks

The rapid growth of 3G/4G enabled devices such as smartphones and tablets in large numbers has created increased demand formobile data services.Wi-Fi offloading helps satisfy the requirements of data-rich applications and terminals with improved multi-media.Wi-Fi is an essential approach to alleviating mobile data traffic load on a cellular network because it provides extra capaci-ty and improves overall performance.In this paper,we propose an integrated LTE/Wi-Fi architecture with software-defined net-working(SDN)abstraction in mobile backhaul and enhanced components that facilitate the move towards next-generation 5G mo-bile networks.Our proposed architecture enables programmable offloading policies that take into account real-time network condi-tions as well as the status of devices and applications.This mechanism improves overall network performance by deriving real-time policies and steering traffic between cellular and Wi-Fi networks more efficiently.     

Large-signal characterizations of DDR IMPATT devices based on group Ⅲ-Ⅴ semiconductors at millimeter-wave and terahertz frequencies

Large-signal （L-S） characterizations of double-drift region （DDR） impact avalanche transit time （IM- PATT） devices based on group III-V semiconductors such as wurtzite （Wz） GaN, GaAs and InP have been carried out at both millimeter-wave （mm-wave） and terahertz （THz） frequency bands. A L-S simulation technique based on a non-sinusoidal voltage excitation （NSVE） model developed by the authors has been used to obtain the high frequency properties of the above mentioned devices. The effect of band-to-band tunneling on the L-S properties of the device at different mm-wave and THz frequencies are also investigated. Similar studies are also carried out for DDR IMPATTs based on the most popular semiconductor material, i.e. Si, for the sake of comparison. A compara- tive study of the devices based on conventional semiconductor materials （i.e. GaAs, InP and Si） with those based on Wz-GaN shows significantly better performance capabilities of the latter at both mm-wave and THz frequencies.     

应力和电阻率可控的适用于高品质因子MEMS器件的原位掺硼LPCVD多晶硅薄膜

The simultaneous control of residual stress and resistivity of polysilicon thin films by adjusting the deposition parameters and annealing conditions is studied. In situ boron doped polysilicon thin films deposited at 520 ℃ by low pressure chemical vapor deposition （LPCVD） are amorphous with relatively large compressive residual stress and high resistivity. Annealing the amorphous films in a temperature range of 600-800 ℃ gives polysilicon films nearly zero-stress and relatively low resistivity. The low residual stress and low resistivity make the polysilicon films attractive for potential applications in micro-electro-mechanical-systems （MEMS） devices, especially in high resonance frequency （high-f） and high quality factor （high-Q） MEMS resonators. In addition, polysilicon thin films deposited at 570 ℃ and those without the post annealing process have low resistivities of 2-5 mΩ·cm. These reported approaches avoid the high temperature annealing process （〉 1000 ℃）, and the promising properties of these films make them suitable for high-Q and high-f MEMS devices.     

Survivable Virtual Network Mapping Using Optimal Backup Topology in Virtualized SDN

Software-Defined Network architecture offers network virtualization through a hypervisor plane to share the same physical substrate among multiple virtual networks. However, for this hypervisor plane, how to map a virtual network to the physical substrate while guaranteeing the survivability in the event of failures, is extremely important. In this paper, we present an efficient virtual network mapping approach using optimal backup topology to survive a single link failure with less resource consumption. Firstly, according to whether the path splitting is supported by virtual networks, we propose the OBT-I and OBT-II algorithms respectively to generate an optimal backup topology which minimizes the total amount of bandwidth constraints. Secondly, we propose a Virtual Network Mapping algorithm with coordinated Primary and Backup Topology （VNM-PBT） to make the best of the substrate network resource. The simulation experiments show that our proposed approach can reduce the average resource consumption and execution time cost, while improving the request acceptance ratio of VNs.     

用于ZigBee的2.4GHz低功耗双增益低噪声放大器

This paper presents a fully differential dual gain low noise amplifier（DGLNA） for low power 2.45-GHz ZigBee/IEEE 802.15.4 applications.The effect of input parasitics on the inductively degenerated cascode LNA is analyzed.Circuit design details within the guidelines of the analysis are presented.The chip was implemented in SMIC 0.18-μm 1P6M RF/mixed signal CMOS process.The DGLNA achieves a maximum gain of 8 dB and a minimum gain of 1 dB with good input return loss.In high gain mode, the measured noise figure（NF） is 2.3-3 dB in the whole 2.45-GHz ISM band.The measured 1-dB compression point, IIP3 and IIP2 is-9, 1 and 33 dBm, respectively.The DGLNA consumes 2 mA of current from a 1.8 V power supply.     

应用于低中频和零中频DVB调谐器中8阶信道滤波器设计

An eighth order active-RC filter for low-IF and zero-IF DVB tuner applications is presented, which is implemented in Butterworth biquad structure. An automatic frequency tuning circuit is introduced to compensate the cut-off frequency variation using a 6-bit switched-capacitor array. Switched-resistor arrays are adopted to cover different cut-off frequencies in low-IF and zero-IF modes. Measurement results show that precise cut-off frequencies at 2.5, 3, 3.5 and 4 MHz in zero-IF mode, 5, 6, 7 and 8 MHz in low-IF mode can be achieved, 60 dB frequency attenuation can be obtained at 20 MHz, and the in-band group delay agrees well with the simulation. Two-tone testing shows the in-band IM3 achieves -52 dB and the out-band IM3 achieves -55 dB with -11 dBm input power. This proposed filter circuit, fabricated in a SMIC 0.18μm CMOS process, consumes 4 mA current with 1.8 V power supply.     

A 3.1-4.8 GHz CMOS receiver for MB-OFDM UWB

An integrated fully differential ultra-wideband CMOS receiver for 3.1-4.8 GHz MB-OFDM systems is presented. A gain controllable low noise amplifier and a merged quadrature mixer are integrated as the RF front-end. Five order Gm-C type low pass filters and VGAs are also integrated for both I and Q IF paths in the receiver. The ESD protected chip is fabricated in a Jazz 0.18μm RF CMOS process and achieves a maximum total voltage gain of 65 dB, an AGC range of 45 dB with about 6 dB/step, an averaged total noise figure of 6.4 to 8.8 dB over 3 bands and an in-band IIP3 of-5.1 dBm. The receiver occupies 2.3 mm2 and consumes 110 mA from a 1.8 V supply including test buffers and a digital module.     

一种适用于“模一”多带OFDM超宽带系统中跳频产生的3.96GHz锁相环

A fully integrated phase-locked loop（PLL） is presented for a single quadrature output frequency of 3.96 GHz.The proposed PLL can be applied to mode-1 MB-OFDM UWB hopping carrier generation.An adaptive frequency calibration loop is incorporated into the PLL.The capacitance area in the loop filter is largely reduced through a capacitor multiplier.Implemented in a CMOS process, this PLL draws 13.0 mA current from a single 1.2 V supply while occupying 0.55 mm2 die area.Measurement results show that the PLL achieves a phase noise of-70 dBc/Hz at 10 kHz offset and-113 dBc/Hz at 1 MHz offset.The integrated RMS jitter from 1 kHz to 10 MHz is 2.2 ps.The reference spur level is less than-68 dBc.