一种低电压恒定跨导轨到轨运算放大器的设计

设计了一种低电压恒定跨导的轨到轨运算放大器,作为误差放大器用在BUCK型DC-DC上实现对输出电压的调节。该运算放大器采用两级结构,输入级采用互补差分对的结构,实现了轨到轨电压的输入,并且利用2倍电流镜技术实现了跨导的恒定;输出级采用AB类放大器的结构,提高了输出电压摆幅和效率,实现了轨到轨电压的输出。该电路基于CSMC 0.25μm EN BCDMOS工艺进行设计,仿真结果表明:电源电压为2.8 V时,在输出端负载电容为160 pF、负载电阻为10 kΩ的情况下,增益为124 dB,单位增益带宽积为5.76 MHz,相位裕度为59.9℃,输入跨导为5.2 mΩ~(-1),共模抑制比为123 dB,输入共模信号范围为0～2.8V,输出电压摆幅为0～2.8 V。     

高增益低功耗恒跨导轨到轨CMOS运放设计

基于CSMC的0.5μmCMOS工艺,设计了一个高增益、低功耗、恒跨导轨到轨CMOS运算放大器,采用最大电流选择电路作为输入级,AB类结构作为输出级。通过cadence仿真,其输入输出均能达到轨到轨,整个电路工作在3 V电源电压下,静态功耗仅为0.206 mW,驱动10pF的容性负载时,增益高达100.4 dB,单位增益带宽约为4.2MHz,相位裕度为63°。     

一种恒跨导轨对轨输入/输出CMOS运算放大器

设计了一种CMOS恒跨导轨对轨输入/输出运算放大器,输入级采用负反馈技术控制尾电流,能自调整gm并使之保持恒定;输出级采用前向偏置AB类输出结构,实现轨对轨输出的同时减小了静态功耗。整个电路在5 V电源电压下,电压增益达到136 dB(1 MΩ电阻和1 pF电容并联负载),单位增益带宽为9.7 MHz,相位裕度62.4°。     

一种高共模抑制比轨到轨全差分运算放大器

针对传统全差分运算放大器电路存在输入输出摆幅小和共模抑制比低的问题,提出了一种高共模抑制比轨到轨全差分运算放大器电路。电路的输入级采用基于电流补偿技术的互补差分输入对,实现较大的输入信号摆幅;中间级采用折叠式共源共栅结构,获得较大的增益和输出摆幅;输出级采用共模反馈环路控制的A类输出结构,同时对共模反馈环路进行密勒补偿,提高电路的共模抑制比和环路稳定性。提出的全差分运算放大器电路基于中芯国际(SMIC) 0.13μm CMOS工艺设计,结果表明,该电路在3.3 V供电电压下,负载电容为5 pF时,可实现轨到轨的输入输出信号摆幅;当输入共模电平为1.65 V时,直流增益为108.9 dB,相位裕度为77.5°,单位增益带宽为12.71 MHz;共模反馈环路增益为97.7 dB,相位裕度为71.3°;共模抑制比为237.7 dB,电源抑制比为209.6 dB,等效输入参考噪声为37.9 nV/Hz^1/2@100 kHz。     

一种基于0.6μm BCD工艺的40V高压输出自稳零运算放大器北大核心

设计实现了一种基于0.6μm BCD工艺的40 V高压输出自稳零运算放大器。该运算放大器采用了时间交织自稳零结构，实现了对输入失调电压的连续校准，同时使用40 V耐压PDMOS管和NDMOS管，实现了ClassAB结构的高压输出。运算放大器的输入级和自稳零校准电路采用0.6μm普通MOS管实现，均工作在5 V电源电压下；放大级和输出级中部分晶体管采用非对称结构的40 V DMOS管，实现了高压输出。整体电路中只有DMOS管的漏源电压承受40 V的耐压，其余MOS管的各端电压均在正常的工作范围内，没有耐压超限风险。前仿真结果表明，该运算放大器在5 V和40 V双电源电压下工作正常，输入失调电压为0.78μV,输出电压范围为3.0～37.7 V,等效直流增益为142.7 dB,单位增益带宽为1.9 MHz,共模抑制比为154.8 dB,40 V电源抑制比为152.3 dB,5 V电源抑制比为134.9 dB。     

基于单一PMOS差分对的轨到轨输入运算放大器设计

基于国内某CMOS工艺设计了一种单一PMOS差分对的轨到轨输入、恒跨导CMOS运算放大器。输入级电路采用折叠共源共栅结构,通过体效应动态调节输入管的阈值电压扩展共模输入范围到正负电源轨,恒定共模输入范围内的跨导,自级联电流镜有源负载将差分输入转换为单端输出;输出级电路采用AB类结构实现轨到轨输出,线性跨导环确定输出管的静态偏置电流。在5 V电源电压,2.5 V共模电压,1 MΩ负载条件下,经Spectre仿真验证,该运算放大器开环增益为119 dB,相位裕度为58°,共模输入范围为0.0027～4.995 V,共模范围内跨导变化小于3%,实现了轨到轨输入共模范围内的跨导恒定。     

恒跨导轨对轨CMOS运算放大器的设计

为了提高运算放大器对电源电压的利用率,基于GSMC 0.18 μm CMOS工艺模型,设计了一种高增益恒跨导轨对轨CMOS运算放大器。该运算放大器的输入级采用了互补差分对,并通过3倍电流镜法保证输入级总跨导在整个共模输入范围内恒定;为了获得较大的增益和输出摆幅,中间级采用了折叠式共源共栅结构;输出级采用了AB类输出控制电路,使输出摆幅基本实现了轨对轨。在3.3 V供电电压以及1.6 V输入电压下,该放大器的直流增益为126 dB,单位增益带宽为50 MHz,相位裕度为65°。电路结构简单,易于调试,可大大缩减设计周期和成本。     

一种恒跨导高增益轨到轨运算放大器

基于TSMC 0.18 μm CMOS工艺,设计了一种新颖的恒跨导高增益轨到轨运算放大器。输入级仅由NMOS管差分对构成,采用电平移位及两路复用选择器控制技术,在轨到轨共模输入范围内实现了输入级恒跨导。中间级采用折叠式共源共栅放大器结构,运算放大器能获得高增益。输出级采用前馈型AB类推挽放大器,实现轨到轨全摆幅输出。利用密勒补偿技术进行频率补偿,运算放大器工作稳定。仿真结果表明,在1.8 V电源电压下,该运算放大器的直流开环增益为129.3 dB,单位增益带宽为7.22 MHz,相位裕度为60.1°,整个轨到轨共模输入范围内跨导的变化率为1.44%。     

低功耗轨至轨CMOS运算放大器设计

设计了一个1.5 V低功耗轨至轨CMOS运算放大器。电路设计中为了使输入共模电压范围达到轨至轨性能,采用了NMOS管和PMOS管并联的互补差动对输入结构,并采用成比例的电流镜技术实现了输入级跨导的恒定。在中间增益级设计中,采用了适合在低压工作的低压宽摆幅共源共栅结构;在输出级设计时,为了提高效率,采用了简单的推挽共源级放大器作为输出级,使得输出电压摆幅基本上达到了轨至轨。当接100 pF电容负载和1 kΩ电阻负载时,运放的静态功耗只有290μW,直流开环增益约为76 dB,相位裕度约为69°,单位增益带宽约为1 MHz。     

基于高性能升压转换器的跨导误差放大器

在分析峰值电流模式升压转换器原理的基础上,设计了一种结构新颖,高精度高性能跨导误差放大器。提出了将具有动态电流自补偿功能的基准电压电路复用为误差放大器输入级的新方法,克服了传统外接基准电压时误差放大器易受干扰和基准电路设计复杂的缺点,提高了误差信号精度和放大器跨导。设计了输出电阻可调电路,简化了补偿网络设计。电路用0.6μmBiCMOS工艺实现,测试表明:3V输入电压,1.2MHz工作频率下,误差放大器开环电压增益57dB,跨导322μS,输入偏置电流小于50nA;升压转换器输出电压15V,输出纹波小于5mV。     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.     

GaAsSb/InAlAs PA DHBTs Grown by Production MBE

The epi material growth of GaAsSb based DHBTs with InAlAs emitters are investigated using a 4 × 100mm multi-wafer production Riber 49 MBE reactor fully equipped with real-time in-situ sensors including an absorption band edge spectroscope and an optical-based flux monitor. The state-of-the-art hole mobilities are obtained from 100nm thick carbon-doped GaAsSb. A Sb composition variation of less than ± 0.1 atomic percent across a 4 × 100mm platen configuration has been achieved. The large area InAlAs/GaAsSb/InP DHBT device demonstrates excellent DC characteristics,such as BVCEO＞6V and a DC current gain of 45 at 1kA/cm2 for an emitter size of 50μm × 50μm. The devices have a 40nm thick GaAsSb base with p-doping of 4. 5 × 1019cm-3 . Devices with an emitter size of 4μm × 30μm have a current gain variation less than 2% across the fully processed 100mm wafer. ft and fmax are over 50GHz,with a power efficiency of 50% ,which are comparable to standard power GaAs HBT results. These results demonstrate the potential application of GaAsSb/InP DHBT for power amplifiers and the feasibility of multi-wafer MBE for mass production of GaAsSb-based HBTs.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.