DY—5型亚微米电子束曝光机

本文介绍了ＤＹ－５型微米电子束曝光机的主要技术性能；最细特征线宽０．４μｍ，图形位置精度及拼接精度优于±０．１５μｍ；扫描场尺寸１×１ｍｍ＾２和２×２ｍｍ＾２；最高扫描速度１ＭＨｚ，可加工１００×１００ｍｍ＾２掩模版或Х７５硅圆片，给出了部分曝光试验结果。     

光纤液位传感器

本文叙述了光纤液位传感器的原理和优点，并解决了易燃易爆液体液位测量的安全问题，仪器的分辨率为±１ｍｍ，其精度为±２ｍｍ．     

C波段单片矢量调制器

报道了Ｃ波段单片矢量调制器的设计和制作。采用双栅场效应晶体管（ＤＧＦＥＴ）放大器作为控制器。偏置电路在芯片内。采用集总薄膜电容、电感、电阻作为匹配元件。采用离子注入、背面通孔接地、空气桥跨接等先进工艺技术。描述了ＤＧＦＥＴ器件Ｓ参数的提取步骤。两路放大器和９０°相移网络制作在３．１５ｍｍ×２．５ｍｍ×０．１ｍｍ的芯片上，同相功分器制作在１．６（１．８）ｍｍ×２．９ｍｍ×０．１ｍｍ的芯片上。电路可获得在０～８７°内连续变化的相移量，输出幅度可控。     

i线相移掩模检查装置

为了采用曝光波长为０．３６５ｍ的光源制作０．３５－０．３０μｍ图形。采用了ｉ线步进方法，并研制了相移掩模。该掩模是由相移法构成图形，同时采用了光的干涉方法进行曝光形成微细图形，最重要的是相移器率和相移，其通过相移器的透过率与玻璃的透过率进行比较而测定，该测定重复性达±０．０５％，测定相移量应用微分干涉显微镜原理，为了获得高精度相移量，采用了条纹扫描干涉法，测定重复性达到±１°，相对应的模厚为±０．     

PECVDSiO_2和SiON薄膜的工艺优化及其应用

在等离子激发条件下，进行了ＳｉＯ＿２，和ＳｉＯＮ介质薄膜生长实验，研究了沉积参数射频功率、反应压力、反应气体流量比及总流量、反应温度对沉积薄膜的生长速率、均匀性和折射率的影响，并优化了工艺条件，得到了生长速率为１５０ｎｍ／ｍｉｎ、均匀性为±０．４４％、折射率ｎ为１．４６３±０．００２的ＳｉＯ＿２和生长速率为１１７ｎｍ／ｍｉｎ、均匀性为±３．０％、折射率ｎ为１．５０６±０．００４的ＳｉＯＮ介质薄膜。还介绍了这两种介质薄膜的应用。     

激光扫描动态测量外径

本文利用激光扫描，在φ５ｍｍ至φ６０ｍｍ的外径上，实现±０．０２ｍｍ动态检测精度的研究结果。对研制原理及精度分析作了简明阐述。     

±5V高频四象限CMOS模拟乘法器

提出了一种新型四象限ＣＭＯＳ模拟乘法器电路,其核心结构为线性化压控源耦对。基于ＭＯＳＩＳ２μｍｐ－阱ＣＭＯＳ工艺参数的ＰＳＰＩＣＥ模拟结果表明：当电源电压为±５Ｖ,输入范围为±４Ｖ时,非线性误差小于０．９％,乘法运算误差小于１．０％;在±３Ｖ的人非线性误差小于０．４％,乘法运算误差小于０．７％;－３ｄＢ带宽一端为１３０ＭＨＺ,另一端为７２０ＭＨＺ;整个电路静态功耗为４．９０ｍＷ。     

S波段单片四位数控移相器

描述了Ｓ波段单片四位数字移相器的电路设计、工艺制作和性能。采用集总元件的高通／低通网络构成移相网络和ＧａＡｓＭＥＳＦＥＴ作为开关控制器件,利用南京电子器件研究所标准的离子注入微波单片集成电路（ＭＭＩＣ）制造工艺,研制出Ｓ波段单片四位数字移相器。该移相器在设计工作频带内１６个移相态具有移相精度高（均方根误差小于１°）、输入输出驻波好（＜１．４）和较低的插入损耗（＜５．５ｄＢ）与插损变化（均方根误差小于０．２ｄＢ）等优良的电特性。芯片尺寸为６．４５ｍｍ×１．４ｍｍ×０．２ｍｍ。     

泉州市火炬电子研究所邮购部供应

泉州市火炬电子研究所邮购部供应（一）ＳＭＤ贴片电容（ＡＶＸ品牌）０８０５、１２０６全系列现货０．５Ｐ～４７０Ｐ±５％０．１６元４７０Ｐ～４７００Ｐ±１０％０．１２元６８００Ｐ～０．１μＦ±２０％０．１３元０４０２、０６０３、１８１２、２２２５系列（规...     

弹簧刚度自动测试及分选系统的研制

介绍一个由８０３１单片机等组成的弹簧刚度自动测试及分选系统的设计原理与特点。该系统具有自动测试、自动落料及分选、记录、显示、打印、串行通讯等功能，可测试外径为１～３０ｍｍ、自由长度为５０ｍｍ的圆柱压缩类弹簧，额定压力小于４９Ｎ；测试精度：位移为±０．０５％，轴向压力为±０．１％。     

Technology innovation and process integrations for sub-100nm gate patterning

This paper presents a brief overview of the Applied Centura(R)DPS(R)system,configured with silicon etch DPS Ⅱ chamber, with emphasis on discussing tuning capability for CD uniformity control. It also presents the studies of etch process chemistry and film integration impact for an overall successful gate patterning development. Discussions will focus on resolutions to key issues, such as CD uniformity, line-edge roughness, and multilayer film etching integration.     

White organic light-emitting devices based on fac tris（2- phenylpyridine） iridium sensitized 5,6,11,12-tetraphenylnap -hthacene

We have fabricated the white organic light-emitting devices （WOLEDs） based on 4,4＇ -bis（2,2 -diphenyl vinyl）-1,1＇ - biphenyl （DPVBi） and phosphorescence sensitized 5,6,11,12,-tetraphenylnaphthacene （rubrene）. The device structure is ITO/2T-NATA （20 nm）/NPBX （20 nm）/CBP： x%Ir（ppy）3：0.5% rubrene （8 nm）/NPBX （5 nm）/DPVBi （30 nm）/Alq（30 nm）/LiF（0.5 nm）/A1. In the devices, DPVBi acts as a blue light-emitting layer, the rubrene is sensitized by a phosphorescent material, fac tris （2-phenylpyridine） iridium [Ir（ppy）3], acts as a yellow light-emitting layer, and N,N＇ -bis- （1-naphthyl）- N,N＇ -diphenyl -1, 1＇ -biphenyl-4,4＇ -diamine （NPBX） acts as a hole transporting and exciton blocker layer, respectively. When the concentration of Ir （PPY）3 is 6wt%, the maximum luminance is 24960 cd/m^2 at an applied voltage of 15 V, and the maximum luminous efficiency is 5.17 cd/A at an applied voltage of 8 V.     

Complete approach to automatic identification and subpixel center location for ellipse feature

To meet the need of automatic image features extraction with high precision in visual inspection, a complete approach to automatic identification and sub-pixel center location for similar-ellipse feature is proposed. In the method, the feature area is identified automatically based on the edge attribute, and the sub-pixel center location is accomplished with the leastsquare algorithm. It shows that the method is valid, practical, and has high precision by experiment. Meanwhile this method can meet the need of instrumentation of visual inspection because of easy realization and without man-machine interaction.     

小角度扩展相关性近似算法分析

本论文提出一种在多天线MIMO信道相关性建模中小角度扩展近似理论算法,并应用于分析MIMO系统性能。分析中分别对三种不同角能量分布情况下的空间相关性研发快速近似计算法,并同时提出双模(Bi-Modal)角能量分布情况下的近似运算。通过分析这些新方法的近似效率,可以得到计算简单、复杂度低、而且符合实际的MIMO相关信道矩阵,对系统级的快速高效计算法的研究和系统级的评估以及误差分析具有重要的意义。     

A Versatile Mixed-Signal Pin Approach for Cost-Effective Test of Automotive ICs

Integrated circuits (ICs) intended for increasingly sophisticated automotive applications bring unique test demands. Advanced ICs for applications such as highly integrated automatic braking system (ABS) and airbag controllers combine high voltage digital channels, significant VI demands and precise timing capability. Along with continued missioncritical reliability concerns, the trend toward higher voltage operation and increased device integration requires specialized test capabilities able to extend across the wide operating ranges found in automotive applications. Among these capabilities, automotive test requirements increasingly dictate a need for a cost-effective versatile mixed-signal pin electronics with very high data rates reaching up to 50MHz with a voltage swing of-2 V to +28 V.     

Optical vibration and deviation measurement of rotating machine parts

It is of interest to get appropriate information about the dynamic behaviour of rotating machinery parts in service. This paper presents an approach of optical vibration and deviation measurement of such parts. Essential of this method is an image derotator combined with a high speed camera or a laser doppler vibrometer （LDV）.     

社长序言（英文）

正Happy New Year!As we step into a new year,we take a look back at the key feature topics covered in China Communications over the past 12 months and set out our expecta-     

Call for Papers

正Introduction Jointly sponsored by the China Institute of Communications(CIC)and the IEEE Communications Society(IEEE ComSoc)since the year 2013,China Communications,currently,is aiming to gradually realise the transition from journal to magazine content and style.     

INTEGRATION OF OPTICAL AND WIRELESS NETWORKS

正For a long time,optical and wireless systems/net-works are developed in separate communities witha few attempts for in-depth convergence.In fact,it prom-ises many advantages to combine the optical and wire-less technologies in the levels of systems and networks.Recently,both academia and industry have made manyefforts to enter a new phase of development to take op-tical and wireless systems as fully integrated networks.To provide high bandwidth and reliable service for bothfixed and mobile users,a well-designed network must     

Call for Papers—Feature Topic,Vol.12,No.3,2015

正Smart Grid Communications The electric power industry is undergoing profound changes as the industry aims to capture the promise of a smart grid for a sustainable energy future.Enabled by the advanced sensing devices such as Phasor Measurement Units(PMUs),increasingly powerful