Electron mobility in a AlGaAs/GaAs/AlGaAs quantum well

An oscillatory dependence of the electron mobility on the quantum well (QW) thickness in a AlGaAs/GaAs/AlGaAs heterostructure with double-sided modulation doping has been observed experimentally. A steep decrease in mobility with increasing electron concentration in the QW is established. The conditions for an increase in mobility on introducing a thin barrier into the QW are determined. The first experimental observation of an increase in mobility by a factor of 1.3 in a QW of thickness L=26 nm upon introducing a thin (1–1.5 nm) AlAs barrier is reported.     

Low ballistic mobility in submicron HEMTs

Ballistic effects in short channel high electron mobility transistors (HEMTs) greatly reduce the field effect mobility compared to that in long gate structures. This reduction is related to a finite electron acceleration time in the channel under the device gate. As an example, the field effect mobility at room temperature in 0.15-μm gate AlGaAs/GaAs HEMTs cannot exceed 3000 cm²/V-s. These predictions are consistent with the values of the field effect mobility extracted from the measured AlGaAs/GaAs HEMT current-voltage characteristics     

The effect of spacer-layer growth temperature on mobility in a two-dimensional electron gas in PHEMT structures

The effect of growth temperature of the AlGaAs spacer layer on mobility in a two-dimensional electron gas μ _e in single-side δ-doped pseudomorphic AlGaAs/InGaAs/GaAs transistor structures with a high electron mobility is studied experimentally. The energy-band diagram is analyzed using a self-consistent calculation. In order to study the electronic transport properties, an optimized structure in which there is no parallel conduction over the doped layer was chosen. It is shown that, in optimized structures, the mobility μ _e increases by 53% at T = 300 K and by 69% at T = 77 K as the growth temperature increases from 590 to 610°C, with the other parameters and the growth conditions remaining the same. It is assumed that this behavior is related to an improvement in the structural quality of the AlGaAs spacer layer and the AlGaAs/InGaAs/GaAs heteroboundary.     

Metal-(n) AlGaAs-GaAs two-dimensional electron gas FET

Theoretical calculations have been developed for a two-dimensional electron gas FET (TEGFET) constituted by a AlGaAs (n)-GaAs (n^-or p^-) heterostructure in which the Schottky gate is deposited on the AlGaAs(n) top layer. The theory takes into account: i) the subband splitting in the two-dimensional electron gas (2-DEG); and ii) the existence of an undoped AlGaAs spacer layer which has been found to enhance the electron mobility. The sheet carrier concentration of the TEGFET has been calculated, and a simple analytical formula has been established for the charge control in large and small gate FET.     

Electron nonelastic scattering by confined and interface polar optical phonons in a modulation-doped AlGaAs/GaAs/AlGaAs quantum well

The calculations of electron scattering rates by polar optical (PO) phonons in an AlGaAs/GaAs/AlGaAs quantum well (QW) with a different width and doping level are performed. The electron-and PO-phonon scattering mechanisms which are responsible for the alternate dependence of electron mobility on a QW width, as well as for the decrease of conductivity in the QW with increasing sheet electron concentration, are determined. It is shown that the enhancement of the scattering rate by PO-phonon absorption when the lower subband electron gas is degenerated is responsible for the decrease of QW conductivity with increasing sheet electron concentration. The competition between the decrease of the intrasubband scattering and the increase of the intersubband scattering by PO-phonon absorption is responsible for the alternate changes of the mobility with a QW width.     

Electrons and phonons in quantum wells

The modulation of electron and polar optical phonon states in an AlGaAs/GaAs/AlGaAs quantum well (QW) with an inserted thin AlAs barrier is considered. The OW width dependence of electron-phonon scattering rates are estimated. The large contribution to the change of the electron subband population, the photovoltaic effect, and the electron mobility in the QW accounts for the resonant intersubband scattering of electrons by interface phonons. The decrease of electron mobility limited by polar optical phonon scattering with increasing carrier concentration in the QW is established. The conditions for the increase of mobility in the QW by inserting the AlAs barrier are found. Fiz. Tekh. Poluprovodn. 33, 1049–1053 (September 1999) This article was published in English in the original Russian journal. Reproduced here with stylistic changes by the Translation Editor.     

An analytical and computer-aided model of the AlGaAs/GaAs high electron mobility transistor

An analytical model for the AlGaAs/GaAs high electron mobility transistor (HEMT) or MODFET has been developed. This model uses a Trofimenkoff-type relation [1] for the electron velocity and electrical field and assumes that the electron velocity saturation inside the two-dimensional electron gas channel cause current saturation. It also takes into account the parasitic conduction in the AlGaAs layer by including a MESFET operation. Based on this model, analytical current-voltage equations suitable for computer simulation have been derived. Calculated results for sub-half-micrometer HEMT's show excellent agreement with measured characteristics.     

Se-doped AlGaAs/GaAs HEMTs for stable low-temperature operation

The fabrication of Se-doped AlGaAs/GaAs high electron mobility transistors (HEMTs) is discussed. Because the DX center concentration in Se-doped AlGaAs layers is lower than in Si-doped layers, the drain-current collapses much less at 77 K. The Se-doped HEMTs are therefore suitable for application in low-temperature LSI     

Hot-electron velocity characteristics at AlGaAs/GaAs heterostructures

Two dimensional electron gas velocity characteristics under stationary and nonstationary conditions at a modulation-doped AlGaAs/GaAs heterostructures are investigated based on Monte Carlo simulation. In contrast to three-dimensional electron gas, a steeper increase in velocity is expected for two-dimensional electron gas closely dependent on the low-field high mobility. These calculations suggest that the high mobility can be effectively utilized in a high-speed logic application of such heterostructure devices.     

Analysis of the Effect of Spacer Layers on Nonlinear Distortions of the Current–Voltage Characteristics of GaAlAs/InGaAs pHEMTs

Semiconductors - The paper presents the results of modeling the electrophysical parameters of AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor (pHEMT) structures via...     

An analytical model for high electron mobility transistors

In this paper we present a new model for HEMT's which is based on a single analytical function that describes the electron concentrations in the two dimensional electron gas and in the AlGaAs layer. Besides accounting for the AlGaAs conduction, the model includes the effect of mobility degradation, channel length modulation in the saturation region and the series resistances R_S and R_D. The model results in closed form expressions for the current, transconductance, output conductance and gate capacitance. Finally, the theoretical predictions of the model are compared with the experimental data and shown to be in good agreement over a wide range of bias conditions     

Mobility of the Two-Dimensional Electron Gas in DA-<Emphasis Type="Italic">p</Emphasis>HEMT Heterostructures with Various δ–<Emphasis Type="Italic">n</Emphasis>-Layer Profile Widths

The effect of the silicon-atom distribution profile in donor δ-layers of AlGaAs/InGaAs/AlGaAs heterostructures with donor–acceptor doping on the mobility of the two-dimensional electron gas is studied. The parameters of the δ-layer profiles are determined using the normal approximation of the spatial distributions of silicon atoms, measured by secondary-ion mass spectroscopy. It is shown that the standard deviation σ of the δ-layer profile can be reduced from 3.4 to 2.5 nm by the proper selection of growth conditions. Measurements of the magnetic-field dependences of the Hall effect and conductivity show that such a decrease in σ allowed an increase in the mobility of the two-dimensional electron gas in heterostructures by 4000 cm²/(V s) at 77 K and 600 cm²/(V s) at 300 K. The mobility calculation taking into account filling of the first two size-quantization subbands shows that an increase in the mobility is well explained by a reduction in the Coulomb scattering at ionized donors due to an increase in the effective thickness of the spacer layer with decreasing σ of the δ-layer profile.     

Comparative Studies of AlGaAs/InGaAs Enhancement/Depletion-Mode High Electron Mobility Transistors with Virtual Channel Layers by Hybrid Gate Recesses Approaches

Semiconductors - Unlike the conventional GaAs- and InP-based enhancement/depletion-mode (E/D-mode) transistors, the improved gate characteristics of the AlGaAs/InGaAs E-mode high electron mobility...     

Degradation and recovery of AlGaAs/GaAs p-HEMT irradiated by high-energy particle

Results of an extensive study on the irradiation damage and its recovery behavior resulting from thermal annealing in AlGaAs/GaAs pseudomorphic high electron mobility transistors (HEMTs) subjected to a 220-MeV carbon, 1-MeV electrons and 1-MeV fast neutrons are presented. The drain current and effective mobility decrease after irradiation, while the threshold voltage increases in positive direction. The decrease of the drain current and mobility is thought to be due to the scattering of channel electrons with the induced lattice defects and also to the decrease of the electron density in the two dimensional electron gas region. Isochronal thermal annealing shows that the device performance degraded by the irradiation recovers. The decreased drain current for output characteristics recovers by 75% of pre-rad value after 300°C thermal annealing for AlGaAs HEMTs irradiated by carbon particles with a fluence of 1×10¹² cm⁻². The influence of the materials and radiation source on the degradation is also discussed with respect to the nonionizing energy loss. Those are mainly attributed to the difference of particle mass and the probability of nuclear collision for the formation of lattice defect in Si-doped AlGaAs donor layer. A comparison is also made with results obtained on irradiated InGaP/InGaAs p-HEMTs in order to investigate the effect of the constituent atom. The damage coefficient of AlGaAs HEMTs is also about one order greater than that of InGaP HEMTs for the same radiation source. The materials and radiation source dependence of performance degradation is mainly thought to be attributed to the difference of mass and the possibility of nuclear collision for the formation of lattice defects in Si-doped donor layer.     

Effect of traps on low-temperature high electron mobility transistor characteristics

The I-V characteristics of MBE-grown AlGaAs/GaAs high electron mobility transistors (HEMT's) are studied using a bias and temperature sequence between 77 and 300 K to control trap occupancy. Low-temperature threshold voltage, transconductance, and saturation current are found to be either increased or decreased significantly relative to their 300 K values depending on the gate bias condition during cool down. This behavior is shown to be caused by variations in trap occupancy in the highly doped AlGaAs layer.     

AlGaAs defect characterization in high electron mobility transistors by thermally stimulated drain conductance

A method based on monitoring the thermally stimulated drain conductance (TSDC) under trap filling and emptying bias-temperature sequences is developed for directly characterizing high defect density AlGaAs layers in high electron mobility transistors (HEMT's). The rate equation for trapped electron emission is solved for the conditions pertinent to the TSDC method. Measured results on HEMT's are in excellent agreement with this solution and compare favorably with values reported by others. TSDC is as convenient to implement but more applicable than deep-level transient spectroscopy (DLTS) for the high concentration of AlGaAs defects normally encountered in HEMT's.     

气态源分子束外延AlxGa1-xAs(x=0～1)材料中Si的掺杂行为研究

研究了Si在AlxGa1-xAs(0≤x≤1)中的掺杂行为.为比较Al組份对Si掺杂浓度的影响,在用气态源分子束外延生长(GSMBE)掺Si n型AlxGa1-xAs(0≤x≤1)的所有样品时,n型掺杂剂Si炉的温度恒定不变.用Hall效应测量外延层的自由载流子浓度和迁移率,用X射线双晶衍射迴摆曲线测量外延层的组份.测试结果表明,当AlxGa1-xAs中Al组份从0增至0.38时,Si的掺杂浓度从4×1018cm-3降至7.8×1016cm-3,电子迁移率从1900 cm2/Vs降至100 cm2/Vs.这与AlxGa1-xAs材料的Γ-X直接—间接带隙的转换点十分吻合.在AlxGa1-xAs全组份范囲内,自由载流子浓度隨Al组份从0至1呈“V”形变化,在X=0.38处呈最低点.在x>0.4之后,AlxGa1-xAs的电子迁移随Al组分的增加,一直维持较低值且波动幅度很小.     

Design and process development of a novel multi-wafer OMVPE reactor for growing very uniform GaAs and AlGaAs epitaxial layers

A unique multi-wafer OMVPE reactor with capability to produce atomic-layer abrupt-ness is demonstrated. Uniform GaAs and AlGaAs epitaxial layers were grown on four two-inch wafers or one three- or four-inch wafer. Thickness variation across a three-inch wafer was less than ±2%, while the variation of Al solid composition was less than ±1%. Multiple AlGaAs/GaAs quantum wells ranging in size from 10Å to 140Å were grown with heterointerface roughness less than one monolayer. The electrical properties of HEMT device were studied. Variations of sheet carrier concentration and electron mobility were ±6% and ±5% respectively across a three-inch wafer. The carrier con-centration profile, mobility spectrum and device characteristics of DH-HEMT are also presented. These results indicate that this OMVPE reactor can grow good device struc-tures for microwave and millimeter-wave power device applications.     

Recessed-gate AlGaAs-InGaAs-GaAs pseudomorphic HEMT withSi-planar-doped etch stop layer

An improved slot etch technique based on an Si planar doped layer has been applied to gate recessing in the fabrication of AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistors (HEMTs). The devices exhibited comparable g_m with much better breakdown and leakage behaviour than conventional pseudomorphic HEMT devices     

94 GHz low-noise HEMT

A high-performance 0.1 mu m gate-length, AlGaAs/GaInAs/GaAs pseudomorphic high electron mobility transistor has been successfully developed. The device exhibits a minimum noise figure as low as 3.0 dB with an associated gain of 5.1 dB at 94 GHz. This is the first low-noise operation of transistors at 94 GHz.<>