平板显示器驱动芯片高低电压转换电路

LCD、PDP、VFD等各类平板显示器已越来越受到人们关注与喜爱,但大多数平板显示器需要专用的功率驱动芯片来驱动其发光显示,各类专用功率驱动芯片又离不开高低电压转换电路,高低电压转换电路性能的好坏直接影响到驱动芯片的稳定性和功耗等。通过比较平板显示器驱动芯片的几种典型高低压转换电路,设计出一种带有电流源的CMOS型高低压转换电路,它具有最佳的性能指标,该电路不但可以为平板显示器驱动芯片使用,还可以作为其他各类驱动芯片的高低压转换模块使用,最后给出一种具体的平板显示驱动芯片高压CMOS器件结构。     

使用发射信道模型降低液晶显示屏电磁干扰

本文介绍一种发射通道模型来仿真液晶显示屏所产生的电磁干扰噪声。通道模型包含基于IEC61967-2标准(横电磁波传输室的辐射发射)的封装、印刷电路板以及辐射柔性印刷电路板等模型来仿真电磁发射能量。最后,本文所用的仿真平台已经验证带有不同时序控制驱动器的真实37"液晶显示屏,而实验结果显示降低电磁干扰的效果极佳。配合所提出的发射通道模型,我们能够很容易的设计低发射驱动器,避免因电磁干扰问题所导致的成本增加。     

An EMI Resisting LIN Driver in 0.35-micron High-Voltage CMOS

This paper describes the design of a local interconnect network (LIN) integrated output driver circuit exhibiting a high degree of immunity against conducted electromagnetic interference (EMI). The transmitted signal of this driver is shaped with a predefined slope so as to reduce electromagnetic emission at higher frequencies. The effect of EMI coupling from the data bus into the driver circuit is countered using a new feedback scheme which shields the slope shaping function from the output stage. Although the output signal may be heavily corrupted by EMI, the LIN driver continues to deliver an unaltered duty cycle, which is mandatory to obtain an error-free data transmission. Measurements show that this driver circuit manages to withstand the highest levels of the direct power injection (DPI) measurements independently of the injected EMI level.     

液晶显示模块电磁干扰的防护

液晶显示模块是由ITO玻璃、液晶驱动芯片、背光模块与软性印刷电路板所组成,基于这种设计架构,当处理器通过输入/输出传输接口传送大量显示数据至液晶驱动芯片的过程中,会产生相当程度的电磁波,并通过模块上的软性印刷电路板（FPC）发散出来,进而影响电子产品内部的组件效能,因此文中将针对电磁干扰的问题说明一些防护的方法。     

17.8cm彩色AMOLED驱动模块的研制

利用现场可编程门阵列结合液晶显示器(LCD)的驱动芯片研制了一个17.8cm(7in)彩色AMOLED显示模块。用Verilog硬件描述语言编写了显示驱动控制程序。通过对OLED显示屏的研究,选择了适合该显示屏的LCD驱动芯片。通过研究LCD驱动芯片的特性,结合驱动OLED的实际需求,提出了一种屏幕与IC的连接方案。采用奇偶列像素数据线交错排列、列驱动IC并行工作的方法,克服了LCD驱动芯片点反转导致屏幕亮度损失一半的问题。针对数据驱动IC只能接收6bit/pixel的数据,而丢失了2bit数据的问题,文章在图像处理中引入了数字半调技术,利用Bayer抖动法对输入数据进行处理,提高了输出图像的质量。     

The impact of low-holding-voltage issue in high-voltage CMOS technology and the design of latchup-free power-rail ESD clamp circuit for LCD driver ICs

The holding voltage of the high-voltage devices in snapback breakdown condition has been found to be much smaller than the power supply voltage. Such characteristics will cause the LCD driver ICs to be susceptible to the latchup-like danger in the practical system applications, especially while these devices are used in the power-rail ESD clamp circuit. A new latchup-free design on the power-rail ESD clamp circuit with stacked-field-oxide structure is proposed and successfully verified in a 0.25-/spl mu/m 40-V CMOS process to achieve the desired ESD level. The total holding voltage of the stacked-field-oxide structure in snapback breakdown condition can be larger than the power supply voltage. Therefore, latchup or latchup-like issues can be avoided by stacked-field-oxide structures for the IC applications with power supply of 40 V.     

基于ARM9的液晶驱动设计与μC/GUI移植研究

在嵌入式系统开发设计中,图形用户界面(GUI)是人与计算机进行交互的重要方式,液晶屏作为GUI的重要设备,在智能仪器仪表与高端嵌入式设备中得到广泛运用。文中介绍了基于ARM920T内核的芯片S3C2440内部LCD控制器以及LCD接口电路设计和相应驱动程序开发。并在此基础上移植了一种非常优秀的图形用户接口软件包μC/GUI。经过测试与μC/GUI实例运行,在液晶屏幕上得到了满意的显示效果,证明了液晶显示部分硬件接口、驱动设计以及μC/GUI移植的合理性与稳定性。     

Particle on Bump (POB) technique for ultra-fine pitch chip on glass (COG) applications by conductive particles and adhesives

Chip on glass (COG) technology is widely used in liquid crystal display (LCD) modules for connecting driver ICs to the displays especially for middle and small size panels. The most common COG technology currently used in display applications is based on anisotropic conductive films (ACF). As the increasing demand in higher resolution and cost reduction, the bump pitch of the driver ICs becomes finer and finer. With the reduction of bump pitch, the current ACF based COG technology is confronted with two issues: one is the increase of the chances of open circuit; the other is the increase of the chances of forming shorts. A new approach for ultra-fine pitch chip on glass (COG) bonding, named ”Particle on Bump (POB)”, is proposed in this paper. In this technique, conductive particles are planted on the top surface of bumps of a driver IC through Au–Sn intermetallic connection. The driver IC is then assembled on the glass substrate of a LCD panel with an insulated adhesive by thermal press. The new method ensures that electrical connections are established only between bumps and corresponding pads. The Au–Sn reflow process for particle planting and corresponding COG bonding process were investigated in detail. The results showed that reliable connections were formed between particles and bumps through an Au–Sn intermetallic layer and final COG interconnections thus formed performed well in reliability tests. It is concluded that the POB technique overcomes the shortcomings of current ACF technique and has good potential to provide a viable ultra-fine pitch flip chip on glass solution for display applications.     

基于SN8P2308微控制器的液晶显示接口设计

针对SONIX新型微控制器SN8P2308特点,提出了利用SN8P2308设计具有LCD显示的中小型消费电子产品的一种方案,并介绍了系统的硬件接口电路和软件设计流程。该设计方案不仅能有效地降低系统成本、提高系统稳定性、缩短开发周期;而且可以出色地完成LCD显示驱动及系统控制的双重任务,从而节省了专用LCD驱动电路的硬件开销。     

一种STN LCD驱动芯片的设计研究

介绍了一种超扭曲向列（STN）LCD驱动芯片的总体设计方案,重点讨论分析了其关键模块--接口电路、控制电路和驱动电路以及电源电路的设计,并用Verilog硬件描述语言对所设计的驱动芯片的功能进行了仿真验证。     

一种基于uClinux嵌入式彩色液晶显示的实现

介绍了彩色液晶显示的驱动芯片s1d13504,根据MCF5272、s1d13504的特性和液晶显示的要求设计出液晶显示的硬件电路,绘出了硬件电路的电路图,并对硬件设计中的难点--分频匹配问题和硬件配置问题进行了详细阐述.介绍了基于uClinux操作系统液晶显示驱动程序的结构及实现步骤,给出了液晶显示驱动程序的各个功能模块的设计,重点阐述了内存共享模块mmap( )和I/O控制模块iotcl( )的功能实现.     

一种4灰度级LCD驱动芯片的设计研究

介绍了一种具有4种灰度级的STNLCD驱动芯片的总体设计方案，重点讨论分析了其关键模块一接口电路、控制电路和驱动电路的设计，并用Verilog硬件描述语言对所设计的驱动芯片的功能进行了仿真验证。     

基于Intel PXA255的TFT-LCD驱动设计

介绍了PXA255的LCD控制器以及CJM10C0101LCD模块的信号时序要求,并结合二者的特点,设计了基于PXA255的CJM10C0101液晶模块的硬件驱动电路和Linux下的驱动程序,在LCD上能显示清晰稳定的静态画面。该设计在嵌入式设备中对于驱动LCD模块具有通用性,Linux下的驱动程序具有很强的移植性,可应用于不同的开发系统。     

ACF particle distribution in COG process

The Chip on Glass (COG) process, which bonds the driver IC onto a glass substrate via anisotropic conductive film (ACF), is applied in producing a liquid crystal display (LCD) module package. Both the stability of the ACF conductive particle conductive property and the prevention of short connections are important directions for the development of ACF material and fine pitch COG process. Better connection reliability can be achieved if more conductive particles remain on the bump with particles rarely clustered in the space between the bumps. Several types of driver ICs with different bump area ratios (total input bump area/total output bump area, I/O ratio) and length/width (L/W) ratios are designed in this study to investigate the correlation between IC structure and these characteristics. The results show that the bump design influences the ACF adhesive flow causing varied capture rate effects on the bump and particle density in the space. The results provide guidance in bump design for driver ICs in the COG process.     

光栅测量芯片中显示接口的设计

提出了一种光栅测量芯片中液晶显示接口的电路设计方法,电路主要由四个模块组成:MCU,CDU,I/O 以及一个同步 FIFO.使用 SMGl2864C 这款芯片作为液晶驱动模块,并应用了 Verilog 硬件描述语言来对整个电路结构进行描述,之后使用 Modelsim 工具来进行功能仿真,最后应用 Synplify 工具对所设计的整个电路进行综合.通过在 Xilinx VirtexⅡ FPGA 平台上进行的后仿真及验证,得到的时序分析结果显示出所设计的电路满足显示接口的设计要求.此外,本电路还有着很好的灵活性及可移植性,通过修改 MCU 模块中的时序约束参数,就可以达到在其他的液晶驱动电路下工作的目的.     

荧光灯电子镇流器的EMI滤波器设计

本文主要以基于恩智浦半桥驱动ICUBA2211设计的荧光灯电子镇流器为例,针对电路中存在的传导干扰,探讨了不同的滤波方法。通过在电路的电源入口处采取滤波技术对电路的EMI进行抑制,使电路的传导干扰的测试结果达到了国际的EMI标准限值。     

用于LCD测试系统的程控驱动器设计

为了制作一款用于LCD测试系统的程控驱动器,采用基于嵌入式系统ARM7实现程序控制,内建DC/DC升压电路和DC/AC转换电路,以提供直流电源和产生驱动脉冲信号,电源内建/外接可选,其信号输出端按一定时序产生特定的连续脉冲, 供给LCD 屏的行列电极作驱动源, 从而使被选行与被选列交叉位置上的液晶像素或笔段在电场作用下呈现显示状态（遮光或透光） 。该系统输出的工作电压峰值、频率、占空比均可调,是一款低功耗、低输出阻抗的LCD程控驱动器。     

SXGA TFT-LCD驱动电路的设计

文中详细分析了一种分辨率为ＳＸＧＡ的液晶显示器驱动电路的设计概要,介绍了其所使用的驱动方法－－三级电压驱动方法、数据驱动器和扫描驱顺的结构及其功能,对在驱顺的灰度级产生方法进行了分析,并阐述了电路中电磁干扰（ＥＭＩ）的解决方法,对接口中所应用的ＬＶＤＳ技术进行了说明。     

Comparison among emission and susceptibility reduction techniques for electromagnetic interference in digital integrated circuits

This paper presents a comparative study of susceptibility reduction techniques for electromagnetic interference (EMI) in digital integrated circuits (ICs). Both direct power injection (DPI) and very-fast transmission-line pulsing (VF-TLP) methods are used to inject interference into the substrate of a single test chip. This IC is built around six functionally identical cores, differing only by their EMI protection strategies (RC protection, isolated substrate, meshed power supply network) which were initially designed for low emission design rules. The ranking of three of these cores in terms of electromagnetic immunity is then compared with the one of their radiated emission, thanks to near-field scanning (NFS) measurements. This leads to the establishing of design guidelines for low EMI in digital ICs.     

小尺寸LCD模块的抗干扰技术的研究

随着手机中LCD及相机的视频分辨率越高,数据工作的频率将超过40MHz,对抑制无线EMI与ESD而言,传统的滤波器方案已达到它们的技术极限。为适应数据速率的增加且实时显示图像信息,文章通过差分传输技术的分析,提出一种将并行传输的RGB显示信号转换为串行差分信号,抑制接口电路和手机无线EMI的方法,同时简化了接口的设计。