sol-gel法制备ZnO薄膜压敏电阻

利用sol-gel法在镀有Au底电极的单晶硅片上,制备掺有Bi2O3、Co2O3、Cr2O3和MnO2的ZnO薄膜压敏电阻。薄膜由旋涂法制备,并在300℃下预处理、600℃退火。制得的ZnO薄膜结晶良好。膜厚约为1μm,ZnO薄膜压敏电阻的非线性系数为15.1,压敏电压为3.037 V,漏电流为43.25μA。     

氧化物掺杂ZnO-Ba_(0.8)Sr_(0.2)TiO_3复合陶瓷的制备及电性能研究

采用固相法制备了氧化物掺杂ZnO-Ba0.8Sr0.2TiO3复合陶瓷,并利用X射线衍射仪和扫描电子显微镜对其晶相及微观形貌进行了观测;另外,研究了氧化物掺杂对陶瓷介电性能及压敏性能的影响。结果表明,当掺杂摩尔分数为0.50%的Bi2O3和0.50%的Sb2O3时,陶瓷在室温下的εr为36402,tanδ为0.065;在此基础上继续掺入0.25%的MnO和0.35%的Cr2O3,陶瓷的非线性系数α为5.4,漏电流IL为1.5×10–6A/mm2,压敏电压为3.0V。Bi2O3、Sb2O3、MnO和Cr2O3掺杂使ZnO-Ba0.8Sr0.2TiO3复合陶瓷的介电性能和压敏性能同时得到了有效提高。     

Y~(3+)掺杂ZnO压敏陶瓷的微结构和电性能研究

采用两步烧结法制备了Y3+掺杂的(以Y(NO3)3·6H2O形式加入)ZnO压敏陶瓷,通过XRD、SEM和EDX系统研究了Y3+掺杂量对ZnO压敏陶瓷微结构和电性能的影响。结果表明:随着Y3+掺杂量的增加,电位梯度VT和非线性系数α提高,晶粒尺寸减小,施主浓度Nd和晶界态密度Ns降低,势垒宽度ω增大。当掺杂的x[Y(NO3)3·6H2O]为1.2%、烧结温度为1100℃时,ZnO压敏陶瓷电性能最好,其VT为675V/mm,α为63.9,漏电流IL为2.40μA。     

改性钙钛酸铅陶瓷的电导性能研究

当掺钙钛酸铅(PCT)用作为压电、热释电材料时,除介电性能外,电导性能也是重要的性能参数。采用传统固相法制备掺钙钛酸铅系陶瓷,研究了不同掺杂量的Sb2/3Mn1/3及烧结助剂NiO、Bi2O3对陶瓷相结构、介电损耗和电导性能的影响。结果表明,在1 180℃下烧结2h,得到纯钙钛矿结构的改性陶瓷,陶瓷介电损耗降低;Sb2/3Mn1/3掺杂量对PCT系陶瓷在20~40℃的电阻温度稳定性有明显影响,随Sb2/3Mn1/3含量增加电阻温度系数(TCR)增大;在Pb0.80Ca0.20(Sb2/3Mn1/3)0.05Ti0.95O3中加入NiO、Bi2O3后有效降低了陶瓷在20~40℃的电阻温度系数;掺杂元素种类和掺杂量对陶瓷在20~80℃的TCR值基本没有影响,TCR值约为-0.15μ℃-1。     

Na和Ti掺杂对Bi_2(Zn_(1/3)Nb_(2/3))_2O_7陶瓷性能的影响

采用传统固相反应法制备了Na-Ti掺杂Bi2(Zn1/3Nb2/3)2O7陶瓷。研究了Na+替代Bi3+,Ti4+替代Nb5+对Bi2(Zn1/3Nb2/3)2O7陶瓷烧结特性、显微结构和介电性能的影响。结果表明,掺入Na+和Ti4+后,Bi2(Zn1/3Nb2/3)2O7陶瓷的烧结温度从1000℃降到了860℃左右;在–30℃～+130℃的温度范围内,Na-Ti掺杂Bi2(Zn1/3Nb2/3)2O7陶瓷表现出明显的、激活能约为0.3eV的介电弛豫现象。这主要是由缺陷偶极子和晶格畸变在陶瓷中的出现引起的。     

Pr系ZnO压敏陶瓷的sol-gel法制备及电性能研究

以Zn(N03)2和NaOH为原料,采用sol-gel法制备了Pr系ZnO压敏陶瓷.研究了所制压敏粉体和压敏陶瓷的性能.结果表明:干凝胶在700℃下煅烧2 h,得到球状Pr系ZnO粉体颗粒,平均粒径为200 nm.1 220℃烧结制备的Pr系ZnO压敏陶瓷性能优异:晶粒大小约为3.2μm,压敏电压为910 V/mm,非...     

Bi_2O_3对TiO_2系压敏陶瓷性能的影响

采用传统电子陶瓷工艺制作了TiO2系压敏陶瓷。通过测试其I-V特性、复阻抗特性、晶界电阻、晶粒电阻及势垒高度,研究了Bi2O3对TiO2-Bi2O3-Nb2O5-SrO系压敏陶瓷微结构及电性能的影响。结果表明,Bi2O3的适当掺杂范围在0.3%~0.5%(摩尔分数)。其掺杂量的变化,可显著改变TiO2-Bi2O3-Nb2O5-SrO系压敏陶瓷的晶界电阻及势垒高度,进而对压敏陶瓷的电学非线性特性产生影响。当x(Bi2O3)为0.4%时,压敏陶瓷的V1mA与α分别为40V/mm与6.2。     

La2O3的掺杂对氧化锌压敏陶瓷电性能的影响

采用传统固相法制备稀土氧化物La2O3掺杂的ZnO压敏陶瓷。采用X线衍射(XRD)、扫描电子显微镜(SEM)和压敏电阻直流参数仪对样品的物相、显微组织及电性能进行分析。结果表明,随着La2O3掺杂量的增加,ZnO压敏陶瓷电位梯度单调递增,非线性系数先增加后减小,而漏电流呈现先减小后增大的变化趋势。综合衡量ZnO压敏电阻的各项性能指标发现,在1 000 ℃烧结温度下,La2O3的质量分数为0.25%时,ZnO压敏电阻的综合性能最好,其电位梯度为532.2 V/mm,非线性系数为41.6,漏电流为3.3 μA。     

激光冲击波对ZnO压敏陶瓷电学性能的影响

为了研究激光冲击处理对ZnO压敏陶瓷电学性能的影响,采用Nd:YAG激光器对ZnO压敏陶瓷进行激光冲击处理,利用压敏电阻直流参量仪（CJ1001型）测量材料电学参量和X射线衍射仪、电子扫描显微镜表征相组成及微观形貌,取得了激光冲击处理前后ZnO压敏陶瓷电学性能的实验数据。结果表明,ZnO压敏陶瓷经激光冲击处理后,电位梯度降低了15.6%;非线性系数大幅提高了43.4%;漏电流降低了50%;同时,ZnO压敏陶瓷相组成除高温烧结态(包括ZnO主晶相、Zn2.33Sb0.67O4尖晶石相以及-Bi2O3相)外,而还出现了新相-Bi2O3相。新相的出现是材料电学性能变化的根本原因。     

Sb2O3掺杂对ZnO薄膜光吸收性能的影响

采用RF磁控溅射技术制备了Sb2O3掺杂ZnO薄膜，通过X射线光电子能谱仪（XPS）、X射线衍射仪（XRD）和紫外-可见光（UV-Vis）分光光度计研究了Sb2O3对ZnO薄膜结构和光吸收性能的影响。结果表明：Sb2O2的掺杂影响了ZnO的原子和电子状态、晶粒的生长方式和光吸收性能。薄膜中Sb以多种形态存在：替位原子和化合物（Sb2O3、Zn，Sb2O14）等，ZnO呈混晶方式生长；随着Sb含量的增加，其引起的晶格畸变和次晶相的含量逐渐增加；掺杂薄膜在远紫外（UVA）波段的吸收显著增强，UV吸收峰变窄，强度增大，吸收边变得陡峭且向短波方向移动达5nm，在Vis波段的吸收有所增强。     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.     

GaAsSb/InAlAs PA DHBTs Grown by Production MBE

The epi material growth of GaAsSb based DHBTs with InAlAs emitters are investigated using a 4 × 100mm multi-wafer production Riber 49 MBE reactor fully equipped with real-time in-situ sensors including an absorption band edge spectroscope and an optical-based flux monitor. The state-of-the-art hole mobilities are obtained from 100nm thick carbon-doped GaAsSb. A Sb composition variation of less than ± 0.1 atomic percent across a 4 × 100mm platen configuration has been achieved. The large area InAlAs/GaAsSb/InP DHBT device demonstrates excellent DC characteristics,such as BVCEO＞6V and a DC current gain of 45 at 1kA/cm2 for an emitter size of 50μm × 50μm. The devices have a 40nm thick GaAsSb base with p-doping of 4. 5 × 1019cm-3 . Devices with an emitter size of 4μm × 30μm have a current gain variation less than 2% across the fully processed 100mm wafer. ft and fmax are over 50GHz,with a power efficiency of 50% ,which are comparable to standard power GaAs HBT results. These results demonstrate the potential application of GaAsSb/InP DHBT for power amplifiers and the feasibility of multi-wafer MBE for mass production of GaAsSb-based HBTs.     

Technology innovation and process integrations for sub-100nm gate patterning

This paper presents a brief overview of the Applied Centura(R)DPS(R)system,configured with silicon etch DPS Ⅱ chamber, with emphasis on discussing tuning capability for CD uniformity control. It also presents the studies of etch process chemistry and film integration impact for an overall successful gate patterning development. Discussions will focus on resolutions to key issues, such as CD uniformity, line-edge roughness, and multilayer film etching integration.     

White organic light-emitting devices based on fac tris（2- phenylpyridine） iridium sensitized 5,6,11,12-tetraphenylnap -hthacene

We have fabricated the white organic light-emitting devices （WOLEDs） based on 4,4＇ -bis（2,2 -diphenyl vinyl）-1,1＇ - biphenyl （DPVBi） and phosphorescence sensitized 5,6,11,12,-tetraphenylnaphthacene （rubrene）. The device structure is ITO/2T-NATA （20 nm）/NPBX （20 nm）/CBP： x%Ir（ppy）3：0.5% rubrene （8 nm）/NPBX （5 nm）/DPVBi （30 nm）/Alq（30 nm）/LiF（0.5 nm）/A1. In the devices, DPVBi acts as a blue light-emitting layer, the rubrene is sensitized by a phosphorescent material, fac tris （2-phenylpyridine） iridium [Ir（ppy）3], acts as a yellow light-emitting layer, and N,N＇ -bis- （1-naphthyl）- N,N＇ -diphenyl -1, 1＇ -biphenyl-4,4＇ -diamine （NPBX） acts as a hole transporting and exciton blocker layer, respectively. When the concentration of Ir （PPY）3 is 6wt%, the maximum luminance is 24960 cd/m^2 at an applied voltage of 15 V, and the maximum luminous efficiency is 5.17 cd/A at an applied voltage of 8 V.     

Complete approach to automatic identification and subpixel center location for ellipse feature

To meet the need of automatic image features extraction with high precision in visual inspection, a complete approach to automatic identification and sub-pixel center location for similar-ellipse feature is proposed. In the method, the feature area is identified automatically based on the edge attribute, and the sub-pixel center location is accomplished with the leastsquare algorithm. It shows that the method is valid, practical, and has high precision by experiment. Meanwhile this method can meet the need of instrumentation of visual inspection because of easy realization and without man-machine interaction.     

小角度扩展相关性近似算法分析

本论文提出一种在多天线MIMO信道相关性建模中小角度扩展近似理论算法,并应用于分析MIMO系统性能。分析中分别对三种不同角能量分布情况下的空间相关性研发快速近似计算法,并同时提出双模(Bi-Modal)角能量分布情况下的近似运算。通过分析这些新方法的近似效率,可以得到计算简单、复杂度低、而且符合实际的MIMO相关信道矩阵,对系统级的快速高效计算法的研究和系统级的评估以及误差分析具有重要的意义。     

Noise character analysis and the restraint of self-pulsation laser diodes

We calculate the Langevin noise sources of self-pulsation laser diodes, analyze the effects of active region noise and saturable-absorption region noise on the power fluctuation as well as period fluctuation, and propose a novel method to restrain the noise effects. A visible SIMULINK model is established to simulate the system, The results indicate that the effects of noise in absorption region can be ignored; that with the increase of DC injecting current, the noise effects enhance power jitter, and nevertheless, the period jitter is decreased; and that with external sinusoidal current modulating the self-pulsation laser diode, the noise-induced power jitter and period jitter can be suppressed greatly. This work is valuable for clock recovery in all-optical network.