溶胶–凝胶法制备ATO-SiO2抗静电复合薄膜的特性研究

采用两步溶胶–凝胶法制备出ATO(掺锑氧化锡)-SiO2复合抗静电薄膜.通过DTA-TG、XRD、SEM对薄膜的结构和形貌进行了表征,结果表明:抗静电复合薄膜表面均匀致密.薄膜中SiO2为无定形结构,ATO的衍射峰与SnO2一致.研究了SnO2的含量对薄膜导电性能、结合强度和透过率的影响,发现随SnO2含量增加γ(SnO2/ SiO2)从5至12.5,薄膜的表面电阻降低(从1010Ω/□降低到108Ω/□),薄膜的结合强度下降,薄膜的透过率降低(从89.0%降至84.2%),结合三方面性能,得出最佳SnO2的配比为:γ(SnO2/ SiO2)=10.     

一般性问题

TN042005040001溶胶–凝胶法制备ATO-SiO2抗静电复合薄膜的特性研究/吴春春,杨辉,冯博,陆文伟(浙江大学材料系)//电子元件与材料.―2004,23(7).―22～24.采用两步溶胶–凝胶法制备出ATO(掺锑氧化锡)-SiO2复合抗静电薄膜.通过DTA-TG、XRD、SEM对薄膜的结构和形貌进行了表征,结果表明:抗静电复合薄膜表面均匀致密.薄膜中SiO2为无定形结构,ATO的衍射峰与SnO2一致.研究了SnO2的含量对薄膜导电性能、结合强度和透过率的影响,发现随SnO2含量增加γ(SnO2/SiO2)从5至12.5,薄膜的表面电阻降低(从1010Ω/□降低到108Ω/□),薄膜的结合…     

sol-gel法制备ATO薄膜的结构与光学性能研究

采用sol-gel法在玻璃衬底上制备ATO(SnO2∶Sb)薄膜,并用XRD、SEM、紫外-可见光谱和光致发光对薄膜进行了表征,研究了ATO薄膜的结构和光学性能。结果表明:ATO薄膜微晶晶相与SnO2一致,仍然是四方金红石结构;ATO薄膜在可见光区的透过率超过80%,当r(Sb∶Sn)为0.15时,ATO薄膜的透过率最高达87%;ATO薄膜在344～380nm处有一个很强的紫外-紫光发射带,随着Sb掺杂量的增加,发射峰逐渐变强,在r(Sb∶Sn)为0.25时,发射峰相对强度达302.4。     

电子元件包装用抗静电薄膜的制备

采用聚乙烯二氧噻酚(PEDT)为导电物质,聚氨酯为主要成膜物质在包装材料(PP)表面制备电子元件包装用抗静电薄膜。随着 w(导电材料)从 8%增加到 16%,膜的表面电阻从 109ù/□降低为 107ù/□,之后保持不变。当w(导电材料)大于 24%时,表面电阻继续降低为 106ù/□。随着聚氨酯加入量的增加,薄膜的表面电阻升高,从 106变为 108ù/□。聚氨酯含量的增加,使薄膜的强度先增加后降低。实验确定之理想配方为:w(PEDT)为 12%,w(聚氨酯)为 32.8%。     

Sb掺杂对SnO_2薄膜光电性能的影响研究

以乙醇为溶剂采用溶胶-凝胶法制备出了Sb掺杂的SnO_2复合透明导电薄膜,并利用XRD,SEM,紫外-可见分光光度计,四探针电阻仪等测试方法对Sb掺杂的SnO_2复合薄膜的结构和物性进行了研究。结果表明,当Sb掺杂量小于摩尔分数7%时,SnO_2复合薄膜均呈四方金红石型晶体结构;随着Sb掺杂量的增加,薄膜电阻率先降低后增大,当Sb掺杂量为摩尔分数5%时,薄膜电阻率达到最小值1.4×10~(–3)?·cm。在350~700 nm波长范围内,当Sb掺杂量小于摩尔分数7%时,SnO_2复合薄膜的透过率均在80%以上。     

溅射压强对ATO透明导电薄膜性能的影响

利用射频磁控溅射法在石英衬底上制备得到高质量的锑掺杂二氧化锡(ATO)透明导电薄膜,研究了溅射压强对ATO薄膜的结构和光电性能的影响。结果表明:溅射压强对ATO薄膜的相结构、择优生长取向和结晶质量均有一定的影响。所制薄膜的电阻率随着溅射压强的增加有先减小后增大的规律,并在溅射压强为1 Pa时取得最小值(1.99×10–3?·cm)。不同溅射压强下制备的薄膜在可见光区的透过率均在85%以上。     

低温生长ITO薄膜及其在太阳电池中的应用

氧化铟锡(ITO)同时结合了可见光范围内高透过率和高电导率等特性,被广泛应用于Si基薄膜太阳电池中。本文侧重研究了采用反应热蒸发(RTE)技术低温(约160℃)生长ITO透明导电薄膜过程中不同Sn掺杂含量对薄膜微观结构以及光电性能的影响。实验结果表明,随着Sn掺杂含量的增加,ITO薄膜微观结构稍有变化,薄膜的电子迁移率呈现先增大后减小的趋势,薄膜的光学带隙一定程度上呈现展宽趋势;对于较高的Sn掺杂含量,在低温条件下电离杂质散射和中性杂质散射成为影响电子迁移率降低的重要因素。经过薄膜生长优化,较佳的Sn掺杂含量为6.0wt.%,ITO薄膜电阻率为3.74×10-4Ω·cm,电子迁移率为47cm2/Vs,载流子浓度为3.71×1020cm-3,且在380~900nm波长范围内的平均透过率约87%。将其应用于结构为SS/Ag/ZnO/nip aSiGe:H/nipa-Si:H/ITO/Al的n-i-p型a-Si:H/a-SiGe:H叠层太阳电池,取得的光电转化效率达10.51%(开路电压Voc=1.66V,短路电流密度Jsc=9.31mA/cm2,填充因子FF=0.68)。     

衬底温度和溅射偏压对ZnO:Al透明导电膜结构和光电特性的影响

利用射频磁控溅射法在有机薄膜衬底和7059玻璃衬底上制备出了具有良好附着性的低电阻率的 ZnO:Al透明导电膜。研究了薄膜的结构和光电特性与衬底温度的关系,薄膜为多晶纤锌矿结构,垂直于衬底的 c 轴具有[002]方向的择优取向,薄膜的最低电阻率分别为 1.01×10–3ù·cm 和 8.48×10–4ù·cm,在可见光区的平均透过率分别达到了72%和 85%。并研究了溅射偏压对有机衬底 ZnO:Al 薄膜结构及光电特性影响,最佳负偏压为 60 V。     

SnO_(2)缓冲层对VO_(2)薄膜微观结构与相变性能的影响北大核心

利用电子束蒸发法在Si衬底上制备了不同厚度的SnO_(2)缓冲层,并使用磁控溅射法制备出上层氧化钒薄膜,研究了SnO_(2)缓冲层厚度对于氧化钒薄膜微观结构、相组成以及相变性能的影响。结果表明,引入具有四方金红石结构的SnO_(2)缓冲层后,上层氧化钒薄膜的结晶性变好,随着SnO_(2)缓冲层厚度的增加,沉积的氧化钒薄膜中V^(4+)含量逐渐提高,氧化钒薄膜的平均晶粒尺寸增大,成膜质量变好;相变锐度有所降低,热滞回线宽度减小。这些结果表示SnO_(2)缓冲层的引入有利于在硅衬底上生长高质量且相变性能优越的VO_(2)薄膜。     

退火温度对Ga掺杂SnO_2薄膜结构和光致发光特性的影响

利用电子束蒸镀在石英玻璃上制备出Ga掺杂的SnO_2(SnO_2∶Ga)薄膜。结合X射线衍射仪、原子力显微镜、紫外-可见-近红外分光光度计和光致发光谱,研究了不同退火温度对薄膜的结构与发光特性的影响。研究结果表明:当退火温度超过500℃,薄膜呈现四方金红石结构,随着退火温度的提高,晶粒尺寸增大,薄膜的禁带宽度变宽,发光强度逐渐增加,成功制备出发蓝紫光的SnO_2∶Ga薄膜。薄膜样品在700℃下退火后光致发光强度显著增强,这是因为随着退火温度的升高,SnO_2∶Ga薄膜的非辐射中心减少,有利于发生辐射复合。     

Sb掺杂SnO2/SiO2纳米光学气敏薄膜的制备及其性质

采用溶胶凝胶(sol-gel)工艺制备了Sb掺杂SnO2/SiO2复合膜。通过X射线衍射(XRD)、傅立叶变换红外谱(FT-IR)及原子力显微镜(AFM)表征了薄膜样品的物相结构与表面形貌,利用紫外-可见光谱研究了复合薄膜光学特性．利用p-偏振光双面反射法对薄膜的气敏特性进行了测试。实验结果表明,薄膜中的晶粒具有纳米尺寸(～35nm)的大小．比表面积大,孔隙率高;薄膜的透光率高,可见光波段近95％;纳米Sb：SnO2：SiO2复合膜的气敏灵敏度高于纯SnO2薄膜及Sb掺杂的SnO2薄膜。     

An MWCNT-doped SnO_2 thin film NO_2 gas sensor by RF reactive magnetron sputtering

An MWCNT-doped (multi-walled carbon nanotube) SnO_2 thin film NO_2 gas sensor, prepared by radio frequency reactive magnetron sputtering, showed a high sensitivity to ultra-low concentrations of NO_2 in the parts per billion range. X-ray diffraction, X-ray photoelectron spectroscopy, and scanning electron microscopy (SEM) characterizations indicated that the MWCNTs were affected by the morphology of the SnO_2 thin film and the particle size.The properties of the MWCNT-doped SnO_2 sensor, such as sensitivity, selectivity, and response-recovery time, were investigated. Experimental results revealed that the MWCNT-doped SnO_2 thin film sensor response to NO_2 gas depended on the operating temperature, NO_2 gas concentration, thermal treatment conditions, film thickness, and so on.The mechanism of the gas-sensing property of the MWCNT-doped SnO_2 thin film sensor was investigated and showed that the improved gas-sensing performance should be attributed to the effects between MWCNTs (p-type) and SnO_2 (n-type) semiconductors.     

脉冲激光淀积MgF2薄膜的制备及性质研究

本文采用脉冲激光淀积方法(PLD)制备了MgF2光学薄膜，并对其表面形貌以及光学性质进行了测试分析，X射线光电子能谱分析显示MgF2样品具有很好的化学组分配比，F／Mg原子比在1．9～2．1之间，接近于体材料；在可见光波段其光学透过率为60％～80％，在红外波段更是达到了90％以上，由KK变换计算MgF2的折射率大约为1．39，也接近于体材料的折射率1.38。     

TFT-LCD阵列穿透率提升的研究

提高薄膜晶体管液晶显示器阵列基板的光利用效率的主要方法是提高开口率和穿透率。文章制作了低温多晶硅阵列穿透区多层膜,考察膜层以及结构对穿透率的影响,研究阵列光线穿透率提升的方法。结果表明,层间介质层（ILD）完成后不同折射率膜层接口对穿透率影响较大,平坦层（PL）的厚度对穿透率没有明显影响,导电膜氧化铟锡（ITO）厚度增加,穿透率下降。通过在阵列穿透区减少膜层数量和改变膜层组分,减少折射率差异较大的界面,可增加穿透率7%左右。     

Sputter-Deposited AlTiO Thin Films for Semi-Transparent Silicon Thin Film Solar Cells

This paper reports on sputter-deposited AlTiO (ATO) thin films and their effects on the performance of semi-transparent silicon thin film solar cells. The electrical resistivity and the transparency of the ATO films depend significantly on the flow ratio of oxygen to argon during the reactive sputtering process. With highly transparent ATO films, transmittances of over 80% were obtained by increasing this flow ratio. When the ATO films were used on silicon substrates, they exhibited an anti-reflection property, where the minimum reflectance at visible light wavelength was decreased to 1.2%. The introduction of ATO thin film layers into solar cells resulted in a 24% increase in transmittance at wavelengths of around 700 nm, due to the film’s anti-reflection characteristic. In addition, the color of the cells changed from green to bright red as the ATO layers were adopted. These beneficial effects of the sputter-deposited ATO films suggest an effective pathway towards the semi-transparent silicon thin film solar cells for building-integrated photovoltaic system applications.     

Optical and electrical properties of crystalline indium tin oxide thin film deposited by vacuum evaporation technique

Indium tin oxide (ITO) thin film was deposited on glass substrate by means of vacuum evaporation technique and annealed at 200 °C, 300 °C and 400 °C in air for 1 h. The characterization and properties of the deposited film samples were analyzed by X-ray diffraction (XRD), scanning electron microscopy (SEM), and UV-VIS-NIR spectroscopy techniques. From the XRD patterns, it was found that the deposited thin film was of crystalline at an annealing temperature of 400 °C. The crystalline phase was indexed as cubic structure with lattice constant and crystallite size of 0.511 nm and 40 nm, respectively. The SEM images showed that the films exhibited uniform surface morphology with well-defined spherical grains. The optical transmittance of ITO thin film annealed at 400 °C was improved from 44% to 84% in the wavelength range from 250 nm to 2 100 nm and an optical band gap was measured as 3.86 eV. Hall effect measurement was used to measure the resistivity and conductivity of the prepared film.     

Conductive Transparent TiNx/TiO2 Hybrid Films Deposited on Plastics in Air Using Atmospheric Plasma Processing

The successful deposition of conductive transparent TiN_x/TiO₂ hybrid films on both polycarbonate and silicon substrates from a titanium ethoxide precursor is demonstrated in air using atmospheric plasma processing equipped with a high‐temperature precursor delivery system. The hybrid film chemical composition, deposition rates, optical and electrical properties along with the adhesion energy to the polycarbonate substrate are investigated as a function of plasma power and plasma gas composition. The film is a hybrid of amorphous and crystalline rutile titanium oxide phases and amorphous titanium nitride that depend on the processing conditions. The visible transmittance increases from 71% to 83% with decreasing plasma power and increasing nitrogen content of the plasma gas. The film resistivity is in the range of ～8.5 × 10¹ to 2.4 × 10⁵ ohm cm. The adhesion energy to the polycarbonate substrate varies from ～1.2 to 8.5 J/m² with increasing plasma power and decreasing plasma gas nitrogen content. Finally, annealing the film or introducing hydrogen to the primary plasma gas significantly affects the composition and decreases thin‐film resistivity.