MOCVD生长的GaN 薄膜中缺陷团引起的X射线漫散射研究

采用高分辨X射线衍射对在蓝宝石(0001)面生长的GaN外延膜的漫散射进行了研究.结果表明,GaN薄膜中存在缺陷团,其浓度随着穿透位错密度的增加而增加,其平均半径呈相反趋势.基于位错是点缺陷的聚集区,缺陷团优先在位错附近形成的效应对结果进行了解释.同时发现电子迁移率随缺陷团浓度的增加而减少.     

Fe掺杂GaN中Fe相关缺陷发光特性研究

利用氢化物气相外延方法制备了 Fe掺杂GaN单晶.材料发光特性随掺杂浓度、温度和激发功率的变化规律表明,位于蓝光波段的发光与掺杂的Fe离子有关.随着Fe掺杂浓度的增加,红外波段发光强度将被抑制,而蓝光波段发光强度显著增加.在较高位错密度样品中,相比于蓝光,红外发光强度显著增加.掺杂样品的光致激发光谱进一步说明了 Fe离子相关的红外和蓝光发光能级跃迁特征及过程.结果表明GaN中的本征缺陷结构以及位错对Fe相关能级跃迁具有重要影响.     

GaN和AlxGa1-xN/CaN异质结的高温性质

通过高温Hall测量研究了GaN和AlxGa1-xN/GaN异质结从室温到500℃高温下的输运性质.实验发现GaN背景载流子浓度随着温度的升高而升高,载流子浓度变化的幅度和GaN的位错密度存在正比关系,持续光电导的跃迁幅度和GaN的位错密度也存在正比关系,说明位错相关的深施主或者陷阱对GaN在高温下的背景浓度有很大影响.实验发现AlxGa1-xN/GaN异质结中二维电子气的浓度在室温到250℃的范围内随着温度的升高而下降,然后随着温度的升高开始增加.前者主要是由于随着温度的升高,AlxGa1-xN/GaN异质结的导带不连续减小引起的,后者主要是由GaN层背景载流子浓度增加导致的.通过求解自洽的薛定谔和泊松方程得到的二维电子气浓度的温度关系和实验结果一致.     

GaN和AlxGa1-xN/CaN异质结的高温性质

通过高温Hall测量研究了GaN和AlxGa1-xN/GaN异质结从室温到500℃高温下的输运性质.实验发现GaN背景载流子浓度随着温度的升高而升高,载流子浓度变化的幅度和GaN的位错密度存在正比关系,持续光电导的跃迁幅度和GaN的位错密度也存在正比关系,说明位错相关的深施主或者陷阱对GaN在高温下的背景浓度有很大影响.实验发现AlxGa1-xN/GaN异质结中二维电子气的浓度在室温到250℃的范围内随着温度的升高而下降,然后随着温度的升高开始增加.前者主要是由于随着温度的升高,AlxGa1-xN/GaN异质结的导带不连续减小引起的,后者主要是由GaN层背景载流子浓度增加导致的.通过求解自洽的薛定谔和泊松方程得到的二维电子气浓度的温度关系和实验结果一致.     

溅射AlN技术对GaN基LED性能的影响

研究了在图形蓝宝石衬底(PSS)上利用磁控溅射制备AlN薄膜的相关技术,随后通过采用金属有机化学气相沉积(MOCVD)在相关AlN薄膜上生了长GaN基LED.通过一系列对比实验,分析了AlN薄膜的制备条件对GaN外延层晶体质量的影响,研究了AlN薄膜溅射前N2预处理功率和溅射后热处理温度对GaN基LED性能的作用机制.实验结果表明:AlN薄膜厚度的增加,导致GaN缓冲层成核密度逐渐升高和GaN外延膜螺位错密度降低刃位错密度升高;N2处理功率的提升会加剧衬底表面晶格损伤,在GaN外延膜引入更多的螺位错;AlN热处理温度的升高粗化了表面并提高了GaN成核密度,使得GaN外延膜螺位错密度降低刃位错密度升高;而这些GaN外延膜位错密度的变化又进一步影响到LED的光电特性.     

Dislocation Reduction in GaN on Sapphire by Epitaxial Lateral Overgrowth

采用侧向外延(ELOG)方法,在制作了条形掩膜图形的GaN衬底上用MOCVD生长高质量GaN.AFM,化学湿法腐蚀及TEM分析表明:采用两步法ELOG生长的GaN中,掩膜下方的缺陷被掩膜所阻挡,窗口区内二次生长的GaN的位错也大幅降低;在相邻生长前沿所形成的合并界面处形成晶界;化学湿法腐蚀无法得到关于合并界面处缺陷的信息.侧翼区域中极低的穿透位错使得ELOG GaN适用于在其上制作高性能的氮化物基激光器.     

蓝宝石衬底上侧向外延GaN中的位错降低

采用侧向外延(ELOG)方法,在制作了条形掩膜图形的GaN衬底上用MOCVD生长高质量GaN.AFM,化学湿法腐蚀及TEM分析表明:采用两步法ELOG生长的GaN中,掩膜下方的缺陷被掩膜所阻挡,窗口区内二次生长的GaN的位错也大幅降低;在相邻生长前沿所形成的合并界面处形成晶界;化学湿法腐蚀无法得到关于合并界面处缺陷的信息.侧翼区域中极低的穿透位错使得ELOG GaN适用于在其上制作高性能的氮化物基激光器.     

异质外延GaN中穿透位错对材料发光效率的影响

用阴极射线致发光(CL)法、透射电子显微镜(TEM)和X射线衍射(XRD)法研究了异质外延GaN材料的发光性质与结构特性的关系.结果表明,GaN外延层中的穿透位错是材料有效的非辐射复合中心,但GaN的CL带边峰强度并不随位错密度的增加而减少.两步法生长GaN形成的马赛克结构的亚晶粒尺寸和晶粒间合并产生的位错的弯曲程度是影响材料发光效率的关键.     

GaN:Si薄膜的结构和应力特性研究

对掺杂浓度为1017～1019cm-3的GaN:Si样品进行高精度X射线衍射和拉曼散射光谱的研究发现:随着Si掺杂浓度的增加,GaN晶粒尺寸逐渐减小,引发更多的螺位错和混合位错致使摇摆曲线的半高宽有所增加,同时薄膜中的剩余应力也逐渐减小。当掺杂浓度高于2.74×1018cm-3时,薄膜从压力状态转变为张力状态。     

AlGaN/GaN异质结材料的中子辐照效应

采用归一化能量1 MeV的中子脉冲反应堆对AlGaN/GaN异质结材料进行了辐照研究.实验发现,经1015cm-2注量的中子辐照后,异质结材料的二维电子气(2DEG)载流子浓度(ns)下降,而2DEG迁移率由于受到ns的调制作用略有增加,同时辐照导致的载流子浓度ns下降造成了沟道串联电阻的增加和异质结构阈值电压(VTH)的正向漂移.分析认为,辐照感生类受主缺陷是造成ns下降和阈值电压漂移的原因.原子力显微镜(AFM)和X射线衍射仪(XRD)的测试结果表明,辐照后材料的表面形貌有所恶化,材料应变基本不变,而材料的螺位错和刃位错密度辐照后都略有增加.此外,实验结果还表明初始材料质量越好,辐照退化越小.     

金属有机物化学气相淀积法生长的Si掺杂GaN薄膜的应力，结构与电学特性研究

The stresses, structural and electrical properties of n-type Si-doped GaN films grown by metaiorganic chemical vapor deposition （MOCVD） are systemically studied. It is suggested that the main stress relaxation is induced by bending dislocations in low doping samples. But for higher doping samples, as the Si doping concentration increases, the in-plane stresses in the grown films are quickly relaxed due to the rapid increase of the edge dislocation densities. Hall effect measurements reveal that the carrier mobility first increases rapidly and then decreases with increasing Si doping concentration. This phenomenon is attributed to the interaction between various scattering process. It is suggested that the dominant scattering process is defect scattering for low doping samples and ionized impurity scattering for high doping samples.     

Stress, structural and electrical properties of Si-doped GaN film grown by MOCVD

The stresses, structural and electrical properties of n-type Si-doped GaN films grown by metalorganic chemical vapor deposition (MOCVD) are systemically studied. It is suggested that the main stress relaxation is induced by bending dislocations in low doping samples. But for higher doping samples, as the Si doping concentration increases, the in-plane stresses in the grown films are quickly relaxed due to the rapid increase of the edge dislocation densities. Hall effect measurements reveal that the carrier mobility first increases rapidly and then decreases with increasing Si doping concentration. This phenomenon is attributed to the interaction between various scattering process. It is suggested that the dominant scattering process is defect scattering for low doping samples and ionized impurity scattering for high doping samples.     

Correlation of carbon doping variations with the vertical breakdown of GaN-on-Si for power electronics

In this work gallium nitride (GaN) grown on silicon substrates was investigated in order to determine critical defects responsible for differences in the vertical breakdown of HEMT structures. Cathodoluminescence studies at the SEM revealed a direct correlation between the intensity of the blue luminescence (BL) band and the carbon doping concentration. Observing this, carbon depletion zones were found around threading dislocations in the active GaN layer, as well as a deep depletion in growth columns concluded from a reduction of the BL intensity. Using the given results a model of a defect, here called the deep carbon depletion (DCD), is proposed to explain the correlation between carbon variations and the vertical breakdown.     

Surface morphology and electronic properties of dislocations in AlGaN/GaN heterostructures

Scanning force microscopy was used to examine the surfaces of AlGaN/GaN heterostructures grown by molecular beam epitaxy (MBE) on GaN templates prepared by hydride vapor phase epitaxy (HVPE). Away from dislocations, the MBE growth replicates the surface morphology of the HVPE film, with monolayer steps clarly visible in topographic images. However, the surface morphology near dislocations depends strongly on the MBE growth conditions. Under Ga rich growth the dislocations appear as hillocks, while under stoichiometric growth they appear as pits. A dependence on Al concentration is also observed. Surface contact potential variation near dislocations is consistent with excess negative charges surrounding by a depletion region, but this was observed only for the film grown under stoichiometric conditions.     

Dislocation Clustering and Luminescence Nonuniformity in Bulk GaN and Its Homoepitaxial Film

Cathodoluminescence (CL) spectroscopy and mapping techniques were used to study defect and impurity distributions in free-standing bulk GaN substrates prepared by hydride vapor-phase epitaxy. It was found that, in the bulk GaN substrates investigated, dislocation clusters appearing as dark cores in the CL map were surrounded by bright disk-like regions with higher luminescence efficiency than that of the outside areas. This large-area luminescence nonuniformity disappeared in homoepitaxial GaN grown on top of the GaN substrate. Schottky barrier diodes fabricated on the homo-epilayer exhibited low average reverse leakage current, while dislocation clusters duplicated from the original bulk GaN substrate still limited device yield.