飞秒激光沉积ZnO/Si大面积均匀薄膜及其特性

利用飞秒脉冲激光沉积(PLD)法在Si(100)基片上制备大面积均匀的ZnO薄膜,通过激光束、靶材及衬底的运动使得所制备的薄膜均匀性面积大小不受限制。X射线衍射(XRD)结果显示,所制备的薄膜具有典型的六方纤锌矿结构,并沿(002)方向高度择优取向生长。场扫描电子显微镜(FESEM)显示,薄膜是沿垂直于衬底方向生长的六方柱状纳米晶,且膜厚均匀。紫外-可见光谱透射率显示,所制备的薄膜在380nm附近有一陡峭的吸收边,在可见光波段具有90%以上的透过率。光致发光(PL)光谱显示,薄膜在377nm处有一强而窄的紫外发射峰。实验结果表明,所制备的薄膜具有良好的结构及光学性能。     

正交实验法优化六方氮化硼薄膜的制备工艺

采用射频磁控溅射法,在Si(100)衬底上制备了适用于声表面波(SAW)器件的氮化硼(BN)薄膜。通过正交实验法,以薄膜中六方相的纯度和取向为指标,优化了磁控溅射方法制备六方BN(h-BN)薄膜的工艺条件。利用傅里叶变换红外光(FTIR)谱和X射线衍射(XRD)谱对薄膜进行了表征,实验结果表明,溅射功率为300W、无衬底负偏压、温度为400℃和N2∶Ar=7∶8vol.%时可以制备出高纯度且高c-轴择优取向的h-BN。     

(100)取向AlN薄膜的制备及其压电性能研究

采用射频磁控溅射法,在Si(100)衬底(含Au导电层)上制备了(100)取向的AlN薄膜并研究了工作压强和溅射功率对制备的AlN薄膜性能的影响。利用X射线衍射仪(XRD)分析了薄膜结构特性,结果表明,在一定范围内,工作压强的增加和溅射功率的减小更有利于AlN(100)晶面择优取向的生长。利用压电力显微镜(PFM)对AlN薄膜的形貌和压电性能进行了表征,发现(100)择优取向的AlN薄膜的压电性主要表现在薄膜面内方向上。     

适用SAW器件的ZnO/Ti/Si薄膜制备及缺陷分析

在Si(100)衬底和Ti/Si(100)衬底上分别制备了ZnO薄膜,探讨了Ti缓冲层对ZnO薄膜结构和缺陷的影响,利用X射线衍射(XRD)测试了ZnO薄膜的晶体结构及择优取向,利用原子力显微镜(AFM)观察ZnO薄膜的表面粗糙度(RMS),利用光致发光(PL)光谱检测了ZnO薄膜的缺陷,利用四探针法测试了ZnO薄膜的电阻率。结果表明,在Ti/Si(100)衬底上、衬底温度350℃的条件下,制备的ZnO薄膜表面光滑、缺陷少、电阻率高且具有高C轴取向。本文这一工作对于压电薄膜缺陷分析及高性能ZnO的声表面波(SAW)器件研制有重要意义。     

退火温度对ZnO/PZT薄膜结构及电阻率的影响

采用射频反应磁控溅射法在Pb(Zr0.52Ti0.48)O3(PZT)/Pt/Ti/SiO2/Si基片上制备了ZnO薄膜,利用X线衍射仪(XRD)、原子力显微镜(AFM)、霍尔效应测试系统等对不同退火温度下制备薄膜的结构、形貌及电阻率等进行了分析表征。结果表明,退火温度600℃的ZnO薄膜(002)择优取向较好,晶粒大小均匀,表面平整致密。随着退火温度的增大,电阻率先下降后升高,600℃时ZnO薄膜电阻率达最小。     

退火温度对Mn-Co-Ni-O系NTC薄膜阻温特性的影响

采用传统陶瓷工艺制作溅射靶材,通过射频磁控溅射法在Al2O3基片上制备了Mn-Co-Ni-O系NTC薄膜。利用X射线衍射仪(XRD)、原子力显微镜(AFM)对不同退火温度下制备的NTC薄膜的结构和形貌进行表征。经过蒸发电极、内电极图形化、淀积二氧化硅钝化层等工艺,将薄膜制成0805规格NTC热敏电阻器。利用高低温试验箱等测试系统对其性能进行测试,研究了退火温度对薄膜阻温特性的影响。结果表明,随着退火温度的升高,晶粒逐渐长大,当退火温度为950℃时,晶粒大小均匀,成相平整致密;材料常数B随着退火温度的升高而增大。     

PLD法制备ZnO薄膜的退火特性和蓝光机制研究

通过脉冲激光沉积(PLD)方法,在O2中和100～500℃衬底温度下,用粉末靶在Si(111)衬底上制备了ZnO薄膜,在300℃温度下生长的薄膜在400～800℃温度和N2氛围中进行了退火处理,用X射线衍射(XRD)谱、原子力显微镜(AFM)和光致发光(PL)谱表征薄膜的结构和光学特性。XRD谱显示,在生长温度300℃时获得较好的复晶薄膜,在退火温度700℃时获得最好的六方结构的结晶薄膜;AFM显示,在此退火条件下,薄膜表面平整、晶粒均匀;PL谱结果显示,在700℃退火时有最好的光学特性。     

PECVD法制备类金刚石薄膜结构和表面形貌分析

以CH4为碳源,Ar气为载气,采用等离子体增强化学气相沉积法(PECVD)在硅(100)衬底上制备了类金刚石(DLC)薄膜。利用拉曼(Raman)光谱仪与原子力显微镜(AFM)对其结构与表面形貌进行了表征。结果表明:所制备的DLC薄膜是含sp3和sp2混合键的非晶态碳膜,其表面均匀、光滑、致密;且随着射频功率的提高,薄膜的平均晶粒直径由8.0nm降为4.2nm,粗糙度由2.2nm减为0.9nm。     

射频磁控溅射制备声表面波器件用ZnO薄膜

研究了采用射频磁控溅射法在SiO2/Si衬底上制备ZnO薄膜工艺中溅射功率、氧氩比(V(O2)/V(Ar))及衬底温度对ZnO薄膜结构的影响。利用X-射线衍射(XRD)和扫描力显微镜(AFM)对薄膜进行结构性能分析,表明其结构性能随工艺参数变化的规律。利用优化的工艺条件:射频功率60 W、V(O2)/V(Ar)为0.55和衬底温度350℃,在DLC/Si衬底上制备了ZnO薄膜,制作加工成声表面波滤波器件,测试分析了频率响应特性,中心频率为596.5 MHz。     

适用于FBAR的ZnO薄膜制备及压电特性分析

采用射频磁控溅射法在Al电极层上制备了适用于 薄膜体声波谐振器(FBAR)的ZnO薄膜, 研究了溅射功率对ZnO薄膜择优取向、压电响应和极化分布的影响。X射线衍射(XRD)测试结 果 表明,在一定范围内,随着溅射功率的增大,ZnO薄膜的择优取向和结晶质量得到提高;但 溅射功率过大,ZnO薄膜的择优取向变差。压电响应力显微镜(PFM)测量表明,溅射功率对薄 膜的压电性能和极化取向也有很大影响, 在所制备的薄膜中,多数晶粒的自发极化方向均垂直向上,表明所制备ZnO薄膜的表面主要 为O 截止;压电响应的振幅与薄膜的结晶质量和择优取向相关,在溅射功率为150W条件下制备的ZnO 在垂直于表面方向上表现出最大压电响应振幅,同时薄膜极化取向分布的一致性最好。     

Research on the piezoelectric response of cubic and hexagonal boron nitride films

Boron nitride (BN) films for high-frequency surface acoustic wave (SAW) devices are deposited on Ti/Al/Si(111) wafers by radio frequency (RF) magnetron sputtering. The structure of BN films is investigated by Fourier transform infrared (FTIR) spectroscopy and X-ray diffraction (XRD) spectra, and the surface morphology and piezoelectric properties of BN films are characterized by atomic force microscopy (AFM). The results show that when the flow ratio of nitrogen and argon is 2:18, the cubic BN (c-BN) film is deposited with high purity and c-axis orientation, and when the flow ratio of nitrogen and argon is 4:20, the hexagonal BN (h-BN) film is deposited with high c-axis orientation. Both particles are uniform and compact, and the roughnesses are 1.5 nm and 2.29 nm, respectively. The h-BN films have better piezoelectric response and distribu- tion than the c-BN films.     

Al薄膜对(002)ZnO/Al/Si结构基片中ZnO薄膜特性影响的实验研究

采用射频磁控溅射法沉积制备了(002)ZnO/A l/Si复合结构。研究了Al薄膜对(002) ZnO/Al/Si复合结构的声表面波器件(SAWD)基片性能影响以及当ZnO 薄膜厚度一定时的Al膜最佳厚度。采用X射线衍射(XRD)对Al和ZnO薄膜进行了结构表征 ,采用 扫描电镜(SEM)对ZnO薄膜进行表面形貌表征,并从薄膜生长机理角度进行了分析。结果 表明,加Al薄膜有利于ZnO薄膜按(002)择优取向生长,并且ZnO 薄膜的结晶性能提高;与(002)ZnO/Si结构基片相比,当Al薄膜 厚为100nm时,(002)ZnO/Al/Si结构中ZnO薄 膜的机电耦合系数提高 了65%。     

Surface planarization of ZnO thin film for optoelectronic applications

In this paper, surface morphology and optical properties are investigated to find the optimum microstructure of zinc oxide (ZnO) thin films deposited by radio frequency (RF) magnetron sputtering. To achieve a high transmittance and a low resistivity, we examined various film deposition conditions. The transmittance and surface morphology of ZnO thin films were measured by an ultraviolet (UV)-visible spectrometer and atomic force microscopy (AFM), respectively. In order to improve the surface quality of ZnO thin films, we performed chemical mechanical polishing (CMP) by change of process parameters, and compared the optical properties of polished ZnO thin films. As an experimental result, we were able to obtain good uniformity and improved transmittance efficiency by the CMP technique.     

Li diffusion in epitaxial (11 $$\bar 2$$ 0) ZnO thin films

Zinc oxide (ZnO) possesses many interesting properties, such as a wide energy bandgap, large photoconductivity, and high excitonic binding energy. Chemical-vapor-deposition-grown ZnO films generally show n-type conductivity. A compensation doping process is needed to achieve piezoelectric ZnO, which is needed for surface acoustic wave (SAW), bulk acoustic wave, and micro-electromechanical system devices. In this work, a gas-phase diffusion process is developed to achieve piezoelectric (11 0) ZnO films. Comparative x-ray diffraction (XRD) and scanning electron microscopy (SEM) measurements confirmed that high crystal quality and good surface morphology were preserved after diffusion. Photoluminescence (PL) measurements show a broad band emission with a peak wavelength at ∼580 nm, which is associated with Li doping. The SAW, including both Rayleigh-wave and Love-wave modes, is achieved along different directions in piezoelectric (11 0) ZnO films grown on an r-plane sapphire substrate.     

六方氮化硼在二维晶体微电子器件中的应用与进展

六方氮化硼(h-BN)因其优异的性能和潜在的应用前景而受到广泛关注。着眼于h-BN在微电子器件领域中的发展与应用,总结了近年来国内外通过化学气相沉积(CVD)方法实现hBN的高质量、大规模可控制备及图形化的代表性工作。围绕h-BN的高介电常数、原子级平滑表面、高导热性和高稳定性,重点介绍了h-BN在二维晶体介电衬底、半导体器件热管理平台以及集成电路封装材料中应用的研究进展,并简述了将h-BN应用于隧穿器件和存储阵列的研究成果。最后,对h-BN在新型微电子器件大规模应用的已有成果进行总结,并展望了该领域未来的研究与发展方向。     

PECVD法氮化硅薄膜生长工艺的研究

采用等离子体增强化学气相沉积法(PECVD),在单晶硅衬底(100)上成功制备了不同生长工艺条件下的氮化硅薄膜。分别采用XP-2台阶仪、椭圆偏振仪等手段测试了薄膜的厚度、折射率、生长速率等参数。并采用原子力显微镜(AFM)研究了薄膜的表面形貌。结果表明,温度和射频功率是影响薄膜生长速率的主要因素,生长速率变化幅度可以达到230nm/min甚至更高。对于薄膜折射率和成分影响最大的是NH3流量,折射率变化范围可以达到2.7～1.86。分析得出受工艺参数调控的薄膜生长速率对薄膜的性质有重要影响。     

Piezoelectric zinc oxide by electrostatic spray pyrolysis

Zinc oxide (ZnO) possesses many interesting properties, such as a wide energy band gap, large photoconductivity, and high excitonic binding energy. Piezoelectric (ZnO) film has a high electro-mechanical coupling coefficient, which makes it a promising material for high frequency and low surface acoustic wave (SAW), bulk acoustic wave, and microelectromechanical system devices. In this work, we present the first results obtained for piezoelectric ZnO thin films prepared on corning 7059 glass substrate by electrostatic spray pyrolysis (ESP), a simple, cheap and efficient technique not widely used for ZnO deposition, using zinc nitrate in a mixture of deionised water and isopropyl alcohol. The structural morphologic and optical properties of the films have been studied and the effect of the preparation conditions, such as substrate temperature and substrate-nozzle distance, discussed. Highly c-axis preferred orientation, which is critical for piezoelectric applications (ultrasonic oscillators and transducers devices), ZnO thin films are obtained at 350 °C growth temperature and at 4.5 cm substrate-nozzle distance.     

p-Si TFT栅绝缘层用SiN薄膜的研究

以NH3和SiH4为反应源气体,采用射频等离子体增强化学气相沉积(RF-PECVD)法在多晶硅(p-Si)衬底上沉积了一系列SiN薄膜,并利用椭圆偏振测厚仪、超高电阻-微电流计、C-V测试仪对所沉积的薄膜作了相关性能测试.系统分析了沉积温度和射频功率对SiN薄膜的相对介电常数、电学性能及界面特性的影响.分析表明,沉积温度和射频功率主要是通过影响SiN薄膜中的Si/N比影响薄膜的性能,在制备高质量的p-Si TFT栅绝缘层用SiN薄膜方面具有重要的参考价值.