Synthesis and characterization of phosphorus-doped ZnO and (Zn,Mg)O thin films via pulsed laser deposition

The transport and optical properties of phosphorus-doped (Zn,Mg)O thin films grown via pulsed laser deposition (PLD) are studied. The carrier type of as-deposited (Zn,Mg)O:P films converts from n-type to p-type with increasing oxygen partial pressure. All the films exhibit good crystallinity with c-axis orientation. This result indicates the importance of oxidation conditions in realizing p-type (Zn,Mg)O:P films. The as-deposited ZnO:P film properties show a strong dependence on the deposition ambient at different growth temperatures. The resistivity of the samples deposited in O₃/O₂ mixture is two orders of magnitude higher than the films grown in oxygen and O₂/Ar/H₂ mixture. The room-temperature photoluminescence (PL) of the as-deposited films has been shown that growing in the O₂/Ar/H₂ mixture ambient significantly increases the band edge emission while inhibiting the visible emission. The enhanced ultraviolet (UV) emission in the films grown in O₂/Ar/H₂ mixture may result from hydrogen passivation of the deep level emission centers. The annealed ZnO:P films are n-type with nonlinear dependence of resistivity on annealing temperature. The resistivity increases in the films with annealing at 800°C while decreasing with further increasing annealing temperature. Strong visible light emission is observed from the ZnO:P films annealed in oxygen.     

退火温度对Cr-Si压阻薄膜电性能的影响

采用射频磁控溅射法在氧化铝陶瓷基底上制备了Cr-Si-Ni-Ti压阻薄膜,研究了不同退火温度对薄膜电性能的影响.结果表明:在溅射态及退火温度低于600℃时,薄膜为非晶态.随着退火温度的升高,薄膜的电阻温度系数(TCR)逐渐增大,应变因子(GF)先增大后减小,室温电阻率(ρ)则逐渐降低.在退火温度为300℃时,Cr-Si...     

PbZr0.52Ti0.48O3薄膜红外椭圆偏振光谱研究

用磁控溅射法在Pt/Ti/SiO2 /Si衬底上制备了PbZr0 .52 Ti0 .4 8O3(PZT)薄膜 .XRD结果表明经过退火后的PZT薄膜呈现多晶结构 .通过红外椭圆偏振光谱仪测量了λ为 2 .5～ 12 .6 μm范围内PZT薄膜的椭偏光谱 ,采用经典色散模型拟合获得PZT薄膜的红外光学常数 ,同时拟合得到未经处理的PZT薄膜和退火后PZT薄膜的厚度分别为 45 4.2nm和 45 0 .3nm .最后通过拟合计算得到结晶PZT薄膜的静态电荷值为 |q|=1.76 9± 0 .0 2 4.这说明在磁控溅射法制备的PZT薄膜中 ,电荷的转移是不完全的 .     

Growth and characterization of PECVD semi-insulating polysilicon films and resistors

Semi-insulating polycrystalline (SIPOS) films deposited by plasma-enhanced chemical vapor deposition (PECVD) were investigated. The films were deposited using monosiane, nitrous oxide and argon at 300° C in a parallel-plate plasma reactor. Rapid thermal annealing was shown to restructure and densify the films with an activation energy of 0.7 eV. Nitrogen was found to be incorporated into the as-deposited films but not in annealed films. It was found that the resistivity of PECVD SIPOS was less sensitive to temperature and an order of magnitude lower than the values reported for LPCVD SI-POS. The differences are thought to be due to the more amorphous nature of PECVD material because of the lower deposition temperature of 300° C. This work was supported by a research contract from Sandia National Laboratories.     

Thermal annealing effect on zinc nitride thin films deposited by reactive rf-magnetron sputtering process

Zinc nitride films were deposited by reactive radio-frequency magnetron sputtering using a zinc target in a nitrogen and argon plasma. The deposited films were annealed in either air or O₂ at 300 °C to investigate the annealing effect on the microstructure, optical properties, and electronic characteristics of zinc nitride films. It was found that the annealing process decreased the crystallinity of zinc nitride films. It was also found that the optical band gap decreased from 1.33 eV to 1.14 eV after annealing. The analysis of film composition suggested that the concentration of oxygen increased slightly after annealing. Although the conduction type of both as-deposited and annealed films were n-type, the annealed films exhibited a higher resistivity, lower carrier concentration and lower mobility than the as-deposited films. Also, it was found that the as-deposited films did not exhibit any photoconducting behavior whereas the annealed films exhibited a pronounced photoconducting behavior.     

磁控溅射制备Mn-Co-Ni-O热敏红外探测薄膜

尖晶石Mn-Co-Ni-O三元氧化物具有优良的负温度系数（NTC）,是一种制作热敏红外探测器较为理想的材料。采用射频磁控溅射法在非晶Al2O3衬底上制备了Mn1.56Co0.96Ni0.48O4（MCNO）多晶薄膜。使用能量色散X射线谱（EDS）对薄膜中金属元素组分进行了测量,分析得出薄膜中金属元素组分与靶材中的组分偏离在5%以内。对经过750℃空气中退火后的薄膜结构、电学和光学性质也进行了研究。实验结果表明:退火后薄膜具有单一立方尖晶石结构,且薄膜表面致密、均匀性好;薄膜的传导机制遵循小极子跃迁传导,在240~330K范围内符合VRH模型,其激活能和电阻温度系数（TCR）在室温下（300K）分别为0.297eV和-3.83%K-1;薄膜在紫外-可见波段具有较高的吸收率,间接带宽为0.61eV。     

Effect of thermal annealing on physical properties of vacuum evaporated In2S3 buffer layer for eco-friendly photovoltaic applications

The present communication reports the effect of thermal annealing on the physical properties of In₂S₃ thin films for eco-friendly buffer layer photovoltaic applications. The thin films of thickness 150 nm were deposited on glass and indium tin oxide (ITO) coated glass substrates employing thermal vacuum evaporation technique followed by post-deposition thermal annealing in air atmosphere within a low temperature range 150–450 °C. These as-deposited and annealed films were subjected to the X-ray diffraction (XRD), UV–vis spectrophotometer, current–voltage tests and scanning electron microscopy (SEM) for structural, optical, electrical and surface morphological analysis respectively. The compositional analysis of as-deposited film is also carried out using energy dispersive spectroscopy (EDS). The XRD patterns reveal that the as-deposited and annealed films (≤300 °C) have amorphous nature while films annealed at 450 °C show tetragonal phase of β-In₂S₃ with preferred orientation (109) and polycrystalline in nature. The crystallographic parameters like lattice constant, inter-planner spacing, grain size, internal strain, dislocation density and number of crystallites per unit area are calculated for thermally annealed (450 °C) thin films. The optical band gap was found in the range 2.84–3.04 eV and observed to increase with annealing temperature. The current–voltage characteristics show that the as-deposited and annealed films exhibit linear ohmic behavior. The SEM studies show that the as-deposited and annealed films are uniform, homogeneous and free from crystal defects and voids. The grains in the thin films are similar in size and densely packed and observed to increase with thermal annealing. The experimental results reveal that the thermal annealing play significant role in the structural, optical, electrical and morphological properties of deposited In₂S₃ thin films and may be used as cadmium-free eco-friendly buffer layer for thin films solar cells applications.     

Mg_xZn_(1-x)O单晶薄膜和MgZnO/ZnO异质结构的光学性质

报道了利用等离子辅助分子束外延技术,在蓝宝石c平面上外延生长的Mgx Zn1 - x O单晶薄膜以及Mg Zn O/Zn O异质结构的光学性质.室温下随着Mg浓度增加,合金薄膜样品的发光峰与吸收边均向高能侧移动.研究了样品紫外发光的起因,将Mgx Zn1 - x O合金薄膜的发光归结为束缚激子的复合.在Mg0 .0 8Zn0 .92 O/ Zn O样品中,观察到了分别来自于Zn O层和Mg Zn O盖层的发光和吸收,并将其归因于来自Zn O层的自由激子和Mg Zn O盖层的束缚激子发射     

Electron emission from phosphorus- and boron-doped polycrystallinediamond films

The electron emission from CVD-grown phosphorus (P-) and boron (B)-doped polycrystalline diamond films has been studied. The current density against electric field characteristics of the P-doped film showed low-field emission compared to the B-doped film. From the slope ratio of the Fowler-Nordheim (F-N) characteristics of P- and B-doped films, a ratio of 0.66 for the emission barrier height was obtained. The small ratio might be caused by the n-type semiconducting properties of P-doped diamond films     

镍酸镧缓冲层的制备及对钙锶铋钛的影响

采用溶胶-凝胶(Sol-Gel)法在Si(100)衬底上制备了LaNiO3薄膜,然后在LaNiO3/Si(100)上制备了钙锶铋钛薄膜。研究了热处理工艺对LaNiO3(LNO)薄膜的影响。研究结果表明,当热分解温度为350℃、退火温度为750℃,厚为250nm时,制备的LNO薄膜的(110)衍射峰取向择优最明显,电阻率也较低,(为1.8×10-3Ω.cm)。LNO缓冲层的引入促进钙锶铋钛薄膜沿A轴方向生长,明显改善了钙锶铋钛薄膜的电性能,即剩余极化强度Pr=15.2μC/cm2,矫顽电场Ec=70kV/cm。     

脉冲激光制备ZnO压敏电阻薄膜

利用脉冲激光沉积技术，在光学玻璃基片上制备了性能良好的ＺｎＯ压敏多晶薄膜，其非线性系数ａ≥６，压敏转折电压约３．５Ｖ。     

Effects of Annealing in a Partially Reducing Atmosphere on Sputtered Al-Doped ZnO Thin Films

Aluminum-doped ZnO (AZO) films have been deposited by room-temperature radio frequency (RF) magnetron sputtering onto fused-quartz substrates using a ZnO:Al₂O₃ (98:2 wt.%) target. A post-deposition anneal in an N₂ flow has been shown to improve the electrical and optical properties of as-deposited AZO. All films were polycrystalline and exhibited a hexagonal wurtzite structure with the c-axis oriented perpendicular to the substrate. An increase in the estimated crystallite size was observed after annealing. Electrical resistivity was reduced from 3.7 × 10⁻³ Ω cm for as-deposited layers to 7.1 × 10⁻⁴ Ω cm for annealed films. An average optical transmittance >85% for annealed films was routinely measured. X-ray photoelectron spectroscopy measurements indicated that the surfaces of all layers investigated were oxygen deficient, and the density of oxygen vacancies was found to increase following the anneal.     

Characteristics of DC magnetron sputtered ternary cobalt-nickel silicide thin films for ultra shallow junction devices

Ternary cobalt-nickel silicide thin films were synthesized by DC magnetron sputtering from an equiatomic cobalt-nickel alloy target. Grazing incidence XRD, Rutherford back scattering, high-resolution cross-sectional TEM analysis and electrical study were carried out to investigate the formation of silicide, stoichiometry, film thickness, depth profile and sheet resistance of as-deposited and post-deposition annealed films. The ternary silicide layer thickness was calculated from RBS simulated data, which was found to vary 20-43 nm for as-deposited and different vacuum annealed films. A minimum value of sheet resistance 2.73 Ω/sq corresponding to a resistivity of ∼8.4 μΩ-cm was obtained for optimized deposition and annealing conditions.     

Pb(Zr_(0.52)Ti_(0.48))O_3 memory capacitor on Si with a polycrystalline silicon/SiO_2 stacked buffer layer

Pb(Zr_(0.52)Ti_(0.48))O_3(PZT) thin films have been deposited on a p-type Si substrate separated by a polycrystalline silicon/SiO_2 stacked buffer layer.The X-ray diffraction peaks of the PZT thin films prepared on the polycrystalline silicon annealed at different temperatures were measured.In addition,the polarization of the Pt/PZT/polycrystalline silicon capacitor has been investigated.The memory capacitor of the metal/ferroelectric/polycrystalline silicon/SiO_2/semiconductor structure annealed at 650℃...     

热处理对双离子束溅射SiO2薄膜力学及热力学特性的影响

光学薄膜的力学及热力学特性决定了光学系统性能的优劣。采用双离子束溅射的方法在硅110和肖特石英Q1基底上制备了SiO2薄膜,并对制备的膜层进行退火处理。系统研究了热处理前后SiO2薄膜的力学及热力学特性。研究结果表明,750℃退火条件下SiO2薄膜的弹性模量（Er）增加到72 GPa,膜层硬度增加到10 GPa。镀完后未经退火处理的SiO2薄膜表现为压应力,但是应力值在退火温度达到450℃以上时急剧降低,说明热处理有助于改善SiO2薄膜内应力。经退火处理的SiO2薄膜泊松比（vf）为0.18左右。退火前后SiO2薄膜的杨氏模量（Ef）都要比石英块体材料大,并且750℃退火膜层杨氏模量增加了50 GPa以上。550℃退火的SiO2薄膜热膨胀系数（f）从6.7810-7℃-1降到最小值5.2210-7℃-1。     

The structural,optical, and electrical properties of vacuum evaporated Cu-doped ZnTe polycrystalline thin films

We have studied the structural, optical, and electrical properties of thermally evaporated, Cu-doped, ZnTe thin films as a function of Cu concentration and post-deposition annealing temperature. X-ray diffraction measurements showed that the ZnTe films evaporated on room temperature substrates were characterized by an average grain size of 300Å with a (111) preferred orientation. Optical absorption measurements yielded a bandgap of 2.21 eV for undoped ZnTe. A bandgap shrinkage was observed for the Cu-doped films. The dark resistivity of the as-deposited ZnTe decreased by more than three orders of magnitude as the Cu concentration was increased from 4 to 8 at.% and decreased to less than 1 ohm-cm after annealing at 260°C. For films doped with 6–7 at.% Cu, an increase of resistivity was also observed during annealing at 150–200°C. The activation energy of the dark conductivity was measured as a function of Cu concentration and annealing temperature. Hall measurements yielded hole mobility values in the range between 0.1 and 1 cm²/V·s for both as-deposited and annealed films. Solar cells with a CdS/CdTe/ZnTe/metal structure were fabricated using Cudoped ZnTe as a back contact layer on electrodeposited CdTe. Fill factors approaching 0.75 and energy conversion efficiencies as high as 12.1% were obtained.     

退火温度对ZnO/PZT薄膜结构及电阻率的影响

采用射频反应磁控溅射法在Pb(Zr0.52Ti0.48)O3(PZT)/Pt/Ti/SiO2/Si基片上制备了ZnO薄膜,利用X线衍射仪(XRD)、原子力显微镜(AFM)、霍尔效应测试系统等对不同退火温度下制备薄膜的结构、形貌及电阻率等进行了分析表征。结果表明,退火温度600℃的ZnO薄膜(002)择优取向较好,晶粒大小均匀,表面平整致密。随着退火温度的增大,电阻率先下降后升高,600℃时ZnO薄膜电阻率达最小。     

Effects of thermal annealing on the structural properties of sputtered W–Si–N diffusion barriers

W–Si–N thin films were deposited via rf-magnetron sputtering from a W₅Si₃ target in Ar/N₂ reactive gas mixtures over a large range of compositions, obtained by varying the partial flow of nitrogen within the reaction chamber. The samples of each set were then thermally annealed in vacuum at different temperatures up to 980 °C.Film composition was determined by Rutherford backscattering spectrometry (RBS), surface film morphology by scanning electron microscopy (SEM), micro-structure by transmission electron microscopy (TEM), vibrational properties by FT-IR absorption and Raman scattering spectroscopy, and electrical resistivity by four-point probe measurements.Independently of the deposition conditions, all the as-deposited films have an amorphous structure, while their composition varies, showing an increase of Si/W ratio from 0.1 up to 0.55 when the nitrogen concentration in the films increases from 0 to 60 at%. Thermal treatments in vacuum induce an important loss of nitrogen in the nitrogen-rich samples, especially at temperatures higher than 600 °C. Samples with high nitrogen content preserve their amorphous structure even at the highest annealing temperature, despite the chemical bonding ordering observed by means of FT-IR measurements. Raman spectroscopy of as-deposited films rich in nitrogen suggests the presence of an important amorphous silicon nitride component, but fails to detect any structural rearrangement either within the composite matrix of film or within silicon nitride component. Segregation of metallic tungsten was detected by TEM in the annealed sample with lowest nitrogen content (W₅₈Si₂₁N₂₁). Finally, the resistivity of the films increases with the N content, while the loss of nitrogen accompanies the decrease of resistivity especially of samples with high nitrogen content.     

sol-gel法制备ZnO薄膜压敏电阻

利用sol-gel法在镀有Au底电极的单晶硅片上,制备掺有Bi2O3、Co2O3、Cr2O3和MnO2的ZnO薄膜压敏电阻。薄膜由旋涂法制备,并在300℃下预处理、600℃退火。制得的ZnO薄膜结晶良好。膜厚约为1μm,ZnO薄膜压敏电阻的非线性系数为15.1,压敏电压为3.037 V,漏电流为43.25μA。     

ZnO缓冲层对Mg0.3Zn0.7O紫外探测器的影响

利用溶胶-凝胶法制备了Mg0.3Zn0.7O薄膜,并制作了金属-半导体-金属结构的深紫外探测器.研究了高质量ZnO缓冲层的引入对Mg0.3Zn0.7O薄膜的吸收谱和结晶特性以及Mg0.3Zn0.7O紫外探测器响应参数的影响.实验结果表明:ZnO缓冲层的引入使Mg0.3Zn0.7O薄膜的紫外-可见光吸收谱有轻微的红移,但可以明显提高薄膜的结晶质量,同时ZnO/Mg0.3Zn0.7O探测器的I-V特性表明,ZnO缓冲层的引入可以显著提高器件的光电流,改善其响应特性,在20V偏压下将Mg0.3Zn0.7O探测器的响应度由0.035 A/W提高至0.63 A/W.