半导体技术

O4712007060630GaN/AlN量子点结构中的应变分布和压电效应/梁双,吕燕伍(北京交通大学物理系)//半导体学报.―2007,28(1).―42～46.从Ⅲ-Ⅴ族氮化物半导体压电极化对应变的依赖关系出发,采用有限元方法计算了GaN/AlN量子点结构中的应变分布,研究了其自发极化、压电极化以及极化电荷密度。结果表明,应变导致的压电极化和Ⅲ-Ⅴ族氮化物半导体所特有的自发极化将导致电荷分布的变化,使电子聚集在量子点顶部,空穴聚集在量子点下面的湿润层中,在量子点结构中产生显著的极化电场,并讨论了电场的存在对能带带边的形状以及能级分布的影响。图4表1…     

压电陶瓷的原理与简介

压电陶瓷(Piezoelectric Ceramic)是具有压电效应的一种功能陶瓷,是压电材料中的一种。压电效应是指由应力诱导出极化(或电场),或由电场诱导出应力(或应变)的现象。前者为正压电效应,后者为负压电效应,两者统称为压电效应。富佳成公司开发的用于高压电源上的压电变压器(Piezo Transformer)利用正、逆两种压电效应。压电材料如锆钛酸铅或铌镁锆钛酸铅,     

压电陶瓷的原理与简介

压电陶瓷(Piezoelectric Ceramic)是具有压电效应的一种功能陶瓷,是压电材料中的一种。压电效应是指由应力诱导出极化(或电场),或由电场诱导出应力(或应变)的现象。前者为正压电效应,后者为负压电效应,两者统称为压电效应。富佳成公司开发的用于高压电源上的压电变压器(Piezo Transformer)利用正、     

GaN/AlN量子点结构中的应变分布和压电效应

从Ⅲ-Ⅴ族氮化物半导体压电极化对应变的依赖关系出发,采用有限元方法计算了GaN/AlN量子点结构中的应变分布,研究了其自发极化、压电极化以及极化电荷密度.结果表明,应变导致的压电极化和Ⅲ-Ⅴ族氮化物半导体所特有的自发极化将导致电荷分布的变化,使电子聚集在量子点顶部,空穴聚集在量子点下面的湿润层中,在量子点结构中产生显著的极化电场,并讨论了电场的存在对能带带边的形状以及能级分布的影响.     

GaN/AlN量子点结构中的应变分布和压电效应

从Ⅲ-Ⅴ族氮化物半导体压电极化对应变的依赖关系出发,采用有限元方法计算了GaN/AlN量子点结构中的应变分布,研究了其自发极化、压电极化以及极化电荷密度.结果表明,应变导致的压电极化和Ⅲ-Ⅴ族氮化物半导体所特有的自发极化将导致电荷分布的变化,使电子聚集在量子点顶部,空穴聚集在量子点下面的湿润层中,在量子点结构中产生显著的极化电场,并讨论了电场的存在对能带带边的形状以及能级分布的影响.     

逆压电极化效应对AlGaN/GaN异质结2DEG特性的影响

从正-逆压电极化效应对GaN材料的影响出发,通过自洽求解一维Poisson-Schr(o)dinger方程,研究了逆压电极化效应对AlGaN/GaN异质结中2DEG浓度的影响.计算结果显示,逆压电极化明显影响2DEG性质,当Al组分x=0.3,AlGaN层厚度为20 nm时,不考虑逆压电极化,2DEG浓度为1.53×1013 cm-2;当等效外加电压分别为10和15 V时,2DEG浓度降低至1.04×1013cm-2和0.789×1013cm-2,可见当等效外电压由0～15 V变化时,2DEG浓度下降了48.4%.     

GaN／AIN量子点结构中的应变分布和压电效应

从Ⅲ-Ⅴ族氮化物半导体压电极化对应变的依赖关系出发，采用有限元方法计算了GaN／AIN量子点结构中的应变分布，研究了其自发极化、压电极化以及极化电荷密度．结果表明，应变导致的压电极化和Ⅲ-Ⅴ族氮化物半导体所特有的自发极化将导致电荷分布的变化，使电子聚集在量子点顶部，空穴聚集在量子点下面的湿润层中，在量子点结构中产生显著的极化电场，并讨论了电场的存在对能带带边的形状以及能级分布的影响．     

压电传感器在煤气灶电子点火器上的应用

煤气灶电子点火器是利用压电传感器工作原理进行点火的。压电传感器采用某些特殊材料制成。某些晶体受一定方向外力作用而发生机械变形时,相应地在一定的晶体表面产生符号相反的电荷(即产生电位差),外力去掉后,电荷消失。力的方向改变时,电荷的符号也随之改变,这种现象称压电效应(正压电效应)。反之当晶体带电或处于电场中,则产生机械应力,这种现象称电致伸缩效应或逆压电效应。具有压电效应的材料称压电元件或压电材料。压电材料分为两类,其中一类是单晶压电材料(如石英晶体);另一类是极化的多晶压电陶瓷(如钛酸钡、锆钛酸钡等)。     

流体静压力下应变闪锌矿(111)取向GaN/AlGaN量子阱中受屏蔽激子的结合能

结合变分法与自洽计算方法研究了流体静压力下应变闪锌矿(111)取向GaN/AlχGa1-χN量子阱中受电子-空穴气体屏蔽的激子结合能.计算中,考虑了沿(111)取向生长多层结构时存在压电极化引起的内建电场.计算结果表明,考虑压力对双轴及单轴应变的调制以及禁带宽度、有效质量和介电常数等参数的压力效应时,激子结合能随压力的增大近似线性增加;且当电子-空穴气体密度大时,这一效应更加显著.当给定压力时,随着电子.空穴气面密度的增加,激子结合能先缓慢增加,但当密度达到大约1011cm-2时结合能开始迅速衰减.此外,当减小垒的厚度时,由于内建电场减弱,激子结合能显著增加.     

流体静压力下应变闪锌矿(111)取向GaN/AlGaN量子阱中受屏蔽激子的结合能

结合变分法与自洽计算方法研究了流体静压力下应变闪锌矿(111)取向GaN/AlχGa1-χN量子阱中受电子-空穴气体屏蔽的激子结合能.计算中,考虑了沿(111)取向生长多层结构时存在压电极化引起的内建电场.计算结果表明,考虑压力对双轴及单轴应变的调制以及禁带宽度、有效质量和介电常数等参数的压力效应时,激子结合能随压力的增大近似线性增加;且当电子-空穴气体密度大时,这一效应更加显著.当给定压力时,随着电子.空穴气面密度的增加,激子结合能先缓慢增加,但当密度达到大约1011cm-2时结合能开始迅速衰减.此外,当减小垒的厚度时,由于内建电场减弱,激子结合能显著增加.     

MOCVD生长AlGaN/GaN/Si(111)异质结材料

利用MOCVD在Si(111)衬底上生长了无裂纹的GaN外延薄膜和AlGaN/GaN异质结构。通过优化Si衬底的浸润处理时间、AlN层厚度等参数获得了无裂纹的GaN外延薄膜,研究了SiN缓冲层和插入层厚度对AlGaN/GaN异质结电学性质的影响,2DEG的迁移率和面密度分别达到1410cm2/V.s和1.16×1013cm-2。     

Influence of annealed ohmic contact metals on electron mobility of strained AlGaN/GaN heterostructures

The influence of annealed ohmic contact metals on the electron mobility of a two dimensional electron gas (2DEG) is investigated on ungated AlGaN/GaN heterostructures and AlGaN/GaN heterostructure field effect transistors (AlGaN/GaN HFETs). Current-voltage (I-V) characteristics for ungated AlGaN/GaN heterostructures and capacitance-voltage (C-V) characteristics for AlGaN/GaN HFETs are obtained, and the electron mobility for the ungated AlGaN/GaN heterostructure is calculated. It is found that the electron mobility of the 2DEG for the ungated AlGaN/GaN heterostructure is decreased by more than 50% compared with the electron mobility of Hall measurements. We propose that defects are introduced into the AlGaN barrier layer and the strain of the AlGaN barrier layer is changed during the annealing process of the source and drain, causing the decrease in the electron mobility.     

A surface-potential-based model for AlGaN/AlN/GaN HEMT

A new surface-potential-based model for AlGaN/AlN/GaN high electron mobility transistor(HEMT) is proposed in this paper. Since the high polarization effects caused by AlN interlayer favorably influence the two dimensional electron gas(2DEG) and scattering mechanisms, we first add spontaneous and piezoelectric charge terms to the source equation of surface-potential, and a mobility model for AlGaN/AlN/GaN HEMT is rewritten. Compared with TCAD simulations, the DC characteristics of AlGaN/AlN/GaN HEMT are faithfully reproduced by the new model.     

Analytical charge control model for AlGaN/GaN MIS-HFETs including an undepleted barrier layer

An analytical charge control model considering the insulator/AlGaN interface charge and undepleted Al-GaN barrier layer is presented for AlGaN/GaN metal-insulator-semiconductor heterostructure field effect transistors (MIS-HFETs) over the entire operation range of gate voltage. The whole process of charge control is analyzed in detail and partitioned into four regions: Ⅰ-full depletion, Ⅱ-partial depletion, Ⅲ-neutral region and Ⅳ-electron accu-mulation at the insulator/AlGaN interface. The results show that two-dimensional electron gas (2DEG) saturates at the boundary of region Ⅱ/Ⅲ and the gate voltage should not exceed the 2DEG saturation voltage in order to keep the channel in control. In addition, the span of region Ⅱaccounts for about 50% of the range of gate voltage before 2DEG saturates. The good agreement of the calculated transfer characteristic with the measured data confirms the validity of the proposed model.     

微波功率AlGaN/GaN HFET的二维能带和异质结构设计

在综述微波功率AlGaN/GaN HFET技术发展趋势基础上,提出了二维异质结能带优化设计的新课题.从自洽求解薛定谔方程和泊松方程出发研究了利用异质界面上的极化电荷来剪裁异质结能带.用极化电荷设计近矩形前势垒能增大高能热电子的隧穿势垒宽度,抑制电流崩塌.背势垒中的极化电荷强化了沟道阱的量子限制,减弱了沟道中的强场峰,能提高击穿电压和抑制电流崩塌.薄势垒层中的极化电荷强化了沟道阱的结构,降低势垒高度后能产生高密度的电子气.优化设计二维异质结构能抑制沟道中的强场峰和电流崩塌,提高击穿电压和大漏压下的输出功率.     

AlGaN/GaN异质结极化行为与二维电子气

AlGaN/GaN异质结及其相关器件因其优越的电学特性成为近几年的研究热点.2DEG作为其特征与材料本身的极化现象关系密切.本文主要从晶体微观结构角度介绍AlGaN/GaN异质结极化现象的产生、机理和方向性,着重讨论极化对异质结界面处诱生的二维电子气的影响.极化不仅可提高2DEG的浓度,而且还能使其迁移率得到提高.     

Oxygen addition to fluorine based SiN etch process: Impact on the electrical properties of AlGaN/GaN 2DEG and transistor characteristics

Early passivated AlGaN/GaN heterostructure field effect transistors (HFETs) have shown superior device performance compared to their unpassivated counterparts. The opening of gate trenches in the passivation layer by a fluorine based dry-etch process is the crucial step to obtain high-performance devices. Even though oxygen addition to this process has been reported, its effect on the device characteristics has not been studied yet. In this paper, we report the impact of oxygen addition to a fluorine based plasma on two-dimensional electron gas (2DEG) properties as well as on device characteristics of passivated AlGaN/GaN HFETs. It is shown that oxygen addition reduces the fluorine-induced degradation of the 2DEG density. Yet, recovery of the 2DEG density is prevented. Additionally, it is shown that oxygen addition increases the current collapse and therefore decreases the RF performance.     

AlGaN/GaN HFET的2DEG和电流崩塌研究(Ⅰ)

从不同的视角回顾和研究了A1GaN/GaN HFET的二维电子气(2DEG)和电流崩塌问题.阐述了非掺杂的AIGaN/GaN异质结界面存在2DEG的原动力是极化效应,电子来源是AlGaN上的施主表面态.2DEG浓度与AlGaN/GaN界面导带不连续性、AlGaN层厚和Al组分有密切关系.揭示了AlGaN/GaN HFET的2DEG电荷涨落受控于表面、界面和缓冲层中的各种缺陷及外加应力,表面空穴陷阱形成的虚栅对输入信号有旁路和延迟作用,它们导致高频及微波状态下的电流崩塌.指出由于构成电流崩塌因素的复杂性,各种不同的抑制电流崩塌方法都存在不足,因此实现该器件大功率密度和高可靠性还有很长的路要走.     

沟道电场分布对AlN/GaN HFETs极化库仑场散射的影响

Based on the measured capacitance–voltage(C–V) curves and current–voltage(I–V) curves for the prepared differently-sized Al N/Ga N heterostructure field-effect transistors(HFETs), the I–V characteristics of the Al N/Ga N HFETs were simulated using the quasi-two-dimensional(quasi-2D) model. By analyzing the variation in the electron mobility for the two-dimensional electron gas(2DEG) with the channel electric field, it is found that the different polarization charge distribution generated by the different channel electric field distribution can result in different polarization Coulomb field(PCF) scattering. The 2DEG electron mobility difference is mostly caused by the PCF scattering which can reach up to 899.6 cm2/(V s)(sample a), 1307.4 cm2/(V s)(sample b),1561.7 cm2/(V s)(sample c) and 678.1 cm2/(V s)(sample d), respectively. When the 2DEG sheet density is modulated by the drain–source bias, the electron mobility for samples a, b and c appear to peak with the variation of the 2DEG sheet density, but for sample d, no peak appears and the electron mobility rises with the increase in the2 DEG sheet density.     

AlGaN/GaN一维模型自洽求解和二维电子气特性研究

实现了一维Poisson-Schrodinger方程的自洽求解,在此基础上求出了AlGaN/GaN异质结导带结构和二维电子气分布。计算结果表明极化效应是形成高浓度电子面密度的主要因素。研究了AlGaN/GaN系统中隔离层厚度对二维电子气浓度的影响,并对计算结果进行了分析。