碲锌镉衬底晶面极性对水平液相外延碲镉汞薄膜的影响

研究了碲锌镉衬底（111）晶面的不同极性对水平推舟液相外延生长碲镉汞薄膜的影响。实验结果显示,（111）A面碲锌镉衬底水平液相外延生长碲镉汞薄膜材料组分和厚度均与常规（111）B面碲锌镉衬底碲镉汞薄膜材料相当;碲镉汞母液在采用（111）A面、（111）B面衬底进行液相外延生长的碲镉汞薄膜上接触角分别为（50±2）°和（30±2）°,结合微观模型分析确认碲镉汞母液在碲镉汞薄膜（111）A面存在更大的表面张力;观察并讨论了（111）A面碲镉汞与（111）B面碲镉汞薄膜材料表面微观形貌的差别;实验获得的（111）A面碲镉汞薄膜XRD半峰宽为33.1arcsec。首次报道了（111）晶面选择对母液残留的影响,研究结果表明,采用（111）A面碲锌镉衬底进行碲镉汞水平推舟液相外延生长,能够在不降低晶体质量的情况下,大幅减小薄膜表面母液残留。     

硅单晶晶向偏离方向的确定方法

为了获取较快的外延生长速率及减少层错,作外延衬底用的硅片需要离取向(111)面偏离一个角度。例如,作TTL数字集成电路用的(111)硅片需要晶向朝着(110)晶面有3±0.5度的偏离。作其他半导体器件用的硅单晶片的晶向亦有各种不同的偏离要求。下面介绍几种(111)硅单晶片偏离方向的确定方法。 1.根据晶体的生长棱线来定向及切割向〔110〕偏离的(111)硅片众所周知,表现单晶方向性的一个最明显的几何特征就是单晶棒的棱线。按〔111〕方向生     

采用(211)碲锌镉衬底制备碲镉汞液相外延薄膜

文中对(211)晶向的CdZnTe衬底进行液相外延生长HgCdTe。获得的碲镉汞液相外延材料的组分为0. 30 ～0. 33,薄膜厚度为10 ～15μm,表面缺陷密度为500cm- 2 ,材料的FWHM达到24弧秒,位错腐蚀坑密度约为2 ×105 cm- 2 ,该材料的表面形貌与采用(111)晶向衬底的HgCdTe外延材料有较大区别。     

Au/Cd复合电极沉积方法对其与(111)面CdZnTe衬底接触性能的影响

CdZnTe晶片是HgCdTe外延薄膜的理想衬底。为了优化CdZnTe衬底的电学接触性能,作者基于真空蒸发法和磁控溅射法分别在p型导电性CdZnTe晶片(111)B (富碲面)制备Au/Cd复合电极。通过接触粘附试验,研究了复合电极的制备方法对电极与衬底之间的粘附性;利用卢瑟福背散射光谱法（RBS）比较了不同沉积方法下样品的元素深度分布;采用电流-电压(I-V)测试比较了两种制备工艺对Au/Cd复合电极与CdZnTe衬底欧姆接触特性的影响,从而确定了最佳复合电极的制备工艺。     

用MBE方法在GaAs衬底上生长偏离(111)B面0.5的高质量的量子阱激光器

本文主要是探讨用分子束外延(MBE)方法在(111)B面GaAs衬底上生长GaAs/AlGaAs以及在(111)B面衬底上制备的量子阶激光器的特性。为获得良好的晶体,只需偏离严格的(111)B面0.5°微小角度。偏离(111)B面衬底0.5°制备的量子阱激光器给出极低的阈值电流密度。得到了最小值为I45A/cm~2的低阈值。100μm宽的条状结构电极的量子阶激光器用CW驱动,获得了1W以上的输出功率,同时在50℃、200mW的驱动条件下,可连续稳定地运转1000小时以上。用MBE法在(111)B衬底上生长偏离(111)B面0.5°的量子阱激光器,而且晶体具有很高的质量。     

Si/CdTe复合衬底HgCdTe液相外延材料的生长与性能分析

通过改进推舟液相外延技术,成功地在(211)晶向Si/CdTe复合衬底上进行了HgCdTe液相外延生长,获得了表面光亮的HgCdTe外延薄膜.测试结果表明,(211)Si/CdTe复合衬底液相外延HgCdTe材料组分及厚度的均匀性与常规(111)CdZnTe衬底HgCdTe外延材料相当;位错腐蚀坑平均密度为(5～8)×105 cm-2,比相同衬底上分子束外延材料的平均位错密度要低一个数量级;晶体的双晶半峰宽达到70″左右.研究结果表明,在发展需要低位错密度的大面积长波HgCdTe外延材料制备技术方面,Si/CdTe复合衬底HgCdTe液相外延技术可发挥重要的作用.     

Si/CdTe复合衬底HgCdTe液相外延材料的生长与性能分析

通过改进推舟液相外延技术,成功地在(211)晶向Si/CdTe复合衬底上进行了HgCdTe液相外延生长,获得了表面光亮的HgCdTe外延薄膜.测试结果表明,(211)Si/CdTe复合衬底液相外延HgCdTe材料组分及厚度的均匀性与常规(111)CdZnTe衬底HgCdTe外延材料相当;位错腐蚀坑平均密度为(5～8)×105 cm-2,比相同衬底上分子束外延材料的平均位错密度要低一个数量级;晶体的双晶半峰宽达到70″左右.研究结果表明,在发展需要低位错密度的大面积长波HgCdTe外延材料制备技术方面,Si/CdTe复合衬底HgCdTe液相外延技术可发挥重要的作用.     

Hg_(0.8)Cd_(0.2)Te液相外延的优质衬底——Cd_(1-x)Zn_xTe的晶体生长及应用

用改进型垂直布里奇曼法(VMB)生长出的Cd_(1-x)Zn_xTe (X=0.04)梨晶,切成具有单晶的薄片面积大达10～12cm~2,本文还对它代替CdTe用作液相外延生长HgCdTe的衬底,作了评价。与典型的CdTe晶体相比,CdZnTe晶体的缺陷密度较低、机械强度较好,并大大改善了在CdZnTe上生长的HgCdTe液相外延层的宏观与微观形态。CdZnTe衬底上生长的液相外延层的表面形貌表明,它与取向的关系,比在CdTe衬底(取向接近于{111}的平面)上生长的外延层与取向的关系更小。Zn加到CdTe晶格中可以使共价性增加,离子性降低,这样就抑制了范性形变和位错的产生。这些因素的组合能把晶格常数调整到两个极值范围内的任何所需要的值,这样就可以生长高性能红外探测器阵列所要求的低缺陷密度的HgCdTe外延层。通过缺陷腐蚀、红外显微镜检查、X射线摆动曲线分析和X射线形貌测量,对衬底和外延层的质量作了评定。     

HWE生长条件对CdTe/Si薄膜结构特性的影响

研究了热壁外延(HWE)生长条件对Si(100)衬底上沉积外延的多晶CdTe薄膜的晶粒尺寸和取向的影响.用SEM和XRD技术分析了不同外延时间、不同衬底温度及不同源温下外延膜的表面形貌和结构特征.SEM发现随着外延时间的增加或衬底温度的提高,晶粒尺寸明显增大;XRD显示所有的外延薄膜均为面心立方结构,并高度显示优势取向(111),且随着衬底温度或薄膜厚度的增加,(111)峰的衍射强度增加,显示薄膜的择优取向更好.其原因是面心立方结构中,(111)表面具有的表面自由能最低.通过对不同外延时间下薄膜厚度的测试发现,薄膜具有加速生长趋势.衬底温度及源温对外延层厚度均有较大的影响.     

AIN/Si(111)复合衬底上4H-SiC薄膜的异质外延

利用化学气相淀积(CVD)的方法在AlN/Si(111)复合衬底上成功实现了4H-SiC薄膜的异质外延生长,用X射线衍射(XRD)、扫描电子显微镜(SEM)、阴极荧光(CL)等方法对所得样品的结构特征、表面形貌和光学性质进行了表征测量.XRD测量结果显示得到的SiC薄膜的晶体取向单一;室温CL结果表明所得SiC薄膜为4H-SiC,且随着生长温度的升高,SiC薄膜的CL发光效率提高.生长温度、反应气源中C/si比等工艺参数对SiC薄膜的外延生长及其性质影响的研究表明在AIN/Si(111)复合衬底上外延4H-SiC的最佳衬底温度为1230～1270℃,比通常4H-SiC同质外延所需的温度低200～300℃;较为合适的C/Si比值为1.3.     

金掺杂HgCdTe气相外延生长及二次离子质谱研究

通过气相外延技术生长了Au掺杂的Hg1-xCdxTe薄膜材料。利用傅里叶光谱仪和金相显微镜对外延材料进行了表征。通过二次离子质谱(Secondary Ion Mass Spectroscopy, SIMS)技术分析了Au在Hg1-xCdxTe外延层以及CdZnTe衬底中的纵向分布趋势。利用SIMS技术还分析了I、II族和VI、VII族杂质在Hg1-xCdxTe外延层以及CdZnTe衬底中的纵向分布趋势,发现衬底和外延层的过渡区具有吸杂作用。研究结果对提高探测器的性能具有指导意义。     

碲锌镉晶体定向研究

碲锌镉材料是制备高性能碲镉汞红外焦平面探测器不可或缺的衬底材料.液相外延工艺和分子束外延工艺分别需要使用(111)晶面和(211)晶面碲锌镉衬底制备碲镉汞薄膜材料.低偏角、高精度衬底的选取有利于高质量碲镉汞外延层的获得.介绍了孪晶线快速定向法、使用X射线衍射仪(X-Ray Diffractome-ter,XRD)定向法...     

Au掺杂碲镉汞气相外延生长及电学性能

采用气相外延技术生长Au掺杂的Hg_(1-x)Cd_xTe薄膜材料,利用范德堡法对薄膜材料进行电学性能表征.通过变温霍尔测量,分析了常规Au掺杂p型薄膜的霍尔系数和霍尔迁移率随温度的变化,利用二次离子质谱(SIMS)分析薄膜中Au的纵向分布趋势.讨论了三种反常p型薄膜的霍尔系数和霍尔迁移率随温度的变化.通过变磁场霍尔测量,分析了具有反型层Hg_(1-x)Cd_xTe薄膜的迁移率谱,证实了由于表面电子、体电子以及体空穴混合导电造成的反常霍尔性能.     

碲锌镉晶体的X射线衍射形貌与腐蚀形貌

碲锌镉晶体中存在着各种典型晶体缺陷,其缺陷研究一直倍受关注,X射线衍射形貌术是一种非破坏性地研究晶体材料结构完整性、均匀性的有效方法.采用反射式X射线衍射形貌术对碲锌镉衬底的质量进行了研究,并将衬底的X射线衍射形貌与Everson腐蚀形貌进行了对比分析,碲锌镉衬底的X射线衍射形貌主要有六种特征类型,分别对应不同的晶体结构或缺陷,包括均匀结构、镶嵌结构、孪晶、小角晶界、夹杂、表面划伤,对上述特征类型进行了详细的分析.目前,衬底的X射线衍射形貌主要以均匀结构类型为主,划伤和镶嵌结构缺陷基本已消除,存在的晶体缺陷主要以小角晶界为主.通过对比分析碲锌镉衬底和液相外延碲镉汞薄膜的X射线衍射形貌,发现小角晶界等晶体结构缺陷会延伸到外延层上,碲锌镉衬底质量会直接影响碲镉汞外延层的质量,晶体结构完整的衬底是制备高质量碲镉汞外延材料的基础.     

Strain relief in epitaxial HgCdTe by growth on a reticulated substrate

In nearly all cases when an epitaxial layer of HgCdTe is grown on a CdZnTe substrate, there will be a finite lattice mismatch due to the lack of precise control over the ZnTe mole fraction. This leads to strains in the layer, which can be manifested in one or more ways: (1) as misfit dislocations near the interface, (2) as threading dislocations, (3) as surface topographical textures, and (4) as cross-hatch lines seen by x-ray topography. We have found that much of the strain can be relieved by growing on a reticulated substrate. Specifically, when the substrate has been etched to form mesas prior to growth of the layer, the resulting layer on the tops of the mesas shows evidence of significantly reduced strain. CdZnTe substrates oriented (111)A were prepared with two sets of mesas on 125 μm centers and 60 μm centers, and with other planar areas remaining for comparison. From a Hg melt, a layer of LWIR HgCdTe was grown about 16 μm thick on each substrate. Nomarski microscopy showed that the layers on the mesa tops were extremely flat, showing no sign of curvature or surface texture. X-ray topography showed no cross hatch on the mesa tops, while the usual cross hatch appeared in the planar regions. The LPE layer extended laterally beyond the edges of the original mesa because of faster growth in non-(111) directions. Samples were cleaved and examined in cross section. The linear density of etch pits seen in the cross section near the substrate, which represent misfit dislocations, was three times lower in the layer on the mesas than in the layer in the unpatterned region, although both regions have the same layer/substrate lattice mismatch. When an epilayer is grown on an unpatterned wafer (the conventional approach), the growth in any small region is confined laterally by the growing layer in the neighboring regions. However, when growth occurs on a reticulated surface, the lateral confinement is removed, providing strain relief and fewer defects.     

金掺杂碲镉汞外延材料生长及拉曼光谱研究

采用气相外延技术生长金掺杂的Hg1-xCdxTe 薄膜材料,通过高低温退火工艺有效控制p 型Hg1-xCdxTe 材料的电学参数,利用傅里叶光谱仪、金相显微镜以及拉曼光谱技术对薄膜材料进行表征。通过常规光伏器件的制作工艺,利用金掺杂材料初步研制了短波器件,器件性能较好黑体DP* 可达4.67E+11/(cmHz1/2W-1)。     

Surface morphology of liquid-phase-epitaxial InP

It is shown that misorientation of a substrate from a lowest index plane even by 0.1° results in epitaxial layers having lamellar surface structure and indium inclusions. Smooth layers can be grown from a supercooled melt on nominally oriented (±1°) (111) B planes. For (100) substrates, exact orientation (±0.1°) and melt supercooling are necessary to grow smooth layers.     

Si基复合衬底碲镉汞液相外延技术的研究

文章报道了采用Si基复合衬底，利用液相外延方法成功进行中波碲镉汞薄膜生长的情况，并且采用X光双晶衍射、X光形貌、红外付立叶光谱仪等手段对碲镉汞薄膜进行了表征。Si基复合衬底碲镉汞外延膜晶体结构为单晶，并且它的双晶衍射半峰值接近国外同类产品的先进水平。     

The relationship between lattice matching and crosshatch in liquid phase epitaxy HgCdTe on CdZnTe substrates

X-ray topography provides a very sensitive map of lattice mismatch between a HgCdTe LPE epitaxial layer and its (111) CdZnTe substrate. A well-defined Crosshatch pattern in the three «110» directions indicates a positive room-temperature lattice mismatch. For conditions of near-perfect lattice matching (±0.003% mismatch), the Crosshatch pattern disappears, presumably because there are few or no misfit dislocations present near the interface, and a region free of topographic contrast is observed. The crosshatch-free region occurs for a small positive room-temperature mismatch (about 0.02%); this is attributed to differences in the lattice matching condition at room temperature and the growth temperature. For negative mismatches, where the film is in tension, a mosaic pattern, rather than a crystallographically oriented Crosshatch, is observed in the topograph. Rocking curve full width at half maximum of the epitaxial layer is minimized in the crosshatch-free zone at a value nearly equal to that of the substrate. Etch pit density of the HgCdTe layer shows a strong minimum for perfect room temperature lattice matching, with values as low as 1 x 10⁴ cm^?2. For nearly lattice matched layers, Crosshatch is present throughout the thickness of the epitaxial layer except for a narrow graded-composition region near the substrate interface. Crosshatch contrast appears to result from long-range strain fields associated with a misfit dislocation network near the substrate interface. Spatial variations in topographic features and mismatch across relatively small lateral distances are caused by variations in substrate alloy composition. For truly lattice-matched substrates, better control over the substrate lattice parameter is required.