共查询到20条相似文献,搜索用时 515 毫秒
1.
2.
通过二次冷轧铜棒并850℃恒温热处理,制备出具有较强立方织构的Cu基带。以硝酸银、亚硫酸钠和硫代硫酸钠为主要原料配制镀银液,在立方织构Cu基带上制备出具有较强Ag(200)择优取向的银镀层。在600℃恒温热处理30min后Ag膜仍具有(200)择优取向,而830℃热处理后,Ag会扩散到Cu基底中,重复镀银、热处理5次后,Ag膜具有(200)的择优取向并少量面内织构,所得Ag/立方织构Cu复合带材可作为第二代高温超导带材YBCO涂层导体的金属基底。 相似文献
3.
Zhixiang Zheng Zaihua Wang Qingliang Feng Fengyuan zhang Yongling Du Chunming Wang 《Materials Chemistry and Physics》2013
Silver nanoparticles modified graphene-carbon nanotubes/polyimide (Gr-CNTs/PI) films have been prepared by electrochemical reduction of silver nitrate on potassium hydroxide hydroxylated of Gr-CNTs/PI films surface. The as-prepared nanocomposites were characterized by transmission electron microscopy, scanning electron microscopy, X-ray diffraction analyzer and semiconductor characterization system. The lower content of Gr-CNTs (≤10 wt. %) doping in PI matrix can improve the conductivity of PI films more clearly than pure CNTs. The conductivity can be regulated by controlling Gr-CNTs content in PI matrix. These silver nanoparticles into Gr-CNTs/PI films presented here can act as deposition seeds which can initiate subsequent electroless silver or copper or electrodeposition other metal. 相似文献
4.
5.
碳纳米管的化学镀Au研究 总被引:12,自引:0,他引:12
采用化学镀法首次在碳纳米管表面包覆了贵金属Au,研究了工艺过程对包覆层质量的影响,并利用高分辨透射电镜(HRTEM)及纳米束EDS能谱对包覆的碳纳米管进行了表征.所得包覆层完整、均匀、金属颗粒密度高,可望作为高性能准一维纳米导线得到应用. 相似文献
6.
Carbon nanotubes (CNTs) have advantages as conductive fillers due to their large aspect ratio and excellent conductivity. In this study, a novel silver/conducting polymer composite was developed by the incorporation of silver-plated CNTs. It is important to achieve a homogeneous dispersion of nanotubes and to improve the interfacial bonding to utilize the excellent properties of reinforcements in the matrix material. The homogeneous dispersion of nanotubes was achieved by an acid treatment process, and the interfacial contact was improved by electroless silver plating around nanotubes. The resistivity of the silver/conducting polymer composite was decreased by 83% by the addition of silver-plated single-walled carbon nanotubes. Conductive bumps were also screen-printed to demonstrate the capability of the composite as electrical interconnects for multi-layer printed circuit boards. 相似文献
7.
8.
9.
氧化铝陶瓷局部活化及选择性化学镀铜的研究 总被引:2,自引:1,他引:1
为解决陶瓷表面局部化学镀存在的问题,研制了一种针对氧化铝陶瓷局部化学镀铜前处理用的活化胶,其由具有活化能力的银盐(或钯盐)和粘稠的复合物有机载体组成.将活化胶印于氧化铝陶瓷表面,经500℃高温烧结形成局部活化层后,可直接置于化学镀液中进行镀铜处理,得到与印刷图形一致的局部镀铜层.利用电化学工作站测定样品在化学镀铜溶液中电位随时间的变化情况,考察不同活化条件对Cu2+还原的催化活性,利用SEM/EDS进行表面形貌及成分分析,确定了活化胶中银盐和钯盐的适宜浓度.结果表明,该两种活化胶应用于氧化铝陶瓷表面化学镀铜的活化工艺,可实现敏化活化的一步化,使陶瓷表面局部化学镀工艺流程简化,成本降低,具有较高的实用价值. 相似文献
10.
Chunju Xu Ruihua Zhou Huiyu Chen Xin Hou Guilin Liu Yaqing Liu 《Journal of Materials Science: Materials in Electronics》2014,25(10):4638-4642
Silver-coated glass fibers have been successfully fabricated using a simple electroless silver plating. The structures of the silver/glass fiber composites were characterized by X-ray diffraction, high-resolution transmission electron microscopy, and scanning electron microscopy, respectively. The morphology investigation showed that the silver coatings were compact and continuous. The minimum volume resistivity could reach 4.53 × 10?4 Ω cm, suggesting excellent electric conductivity. It was found that the quality of silver deposition was influenced by dosage of ammonia solution and plating temperature. Ammonia solution served as complexing reagent and supplied an alkaline media, and higher temperature easily led to metallic oxidation. The current method is simple-handle, inexpensive, large production, and the obtained silver/glass fibers can be used as fillers to fabricate electromagnetic wave shielding materials. 相似文献
11.
This work targets the identification of optimal rate-enhancement technique for the electroless fabrication of silver–ceramic porous membranes. The membranes were fabricated with porous ceramic supports of 4.5?µm and porosity of 19.3% and with alternate electroless plating (ELP) processes including conventional (CEP), sonication (SOEP), and surfactant (SIEP) plating baths. The alternate processes were evaluated based on the process (conversion, plating efficiency (η), average plating rate) and membrane characteristics (percent pore densification (PPD), metal loading index (MLI)), and their combinations (η/(MLI.PPD)). Among alternate processes, SOEP has been evaluated to be the best to yield silver–ceramic membranes. 相似文献
12.
13.
14.
Nanotube-containing membranes prepared by the template method show promise for use as highly selective filters for membrane-based chemical and biological separations. Most of the work to date has been done on gold nanotubes prepared by electroless deposition of Au within the pores of polymeric filtration membranes. These polymeric filters have very low porosities (< 1%), and, as a result, the flux through Au nanotube membranes based on these templates is very low. In contrast, the other popular template membranes-anodic aluminas-have high porosities-30% to 50%. In spite of this potential advantage of anodic alumina templates, there have been no reports of electrolessly plated Au nanotubes within the pores of these templates. This is because the electroless plating method used to deposit Au nanotubes in polymeric templates does not work in aluminas. We have developed a modified electroless plating strategy that can be used to deposit high-quality Au nanotubes within the pores of the alumina templates. We describe this new plating method here. 相似文献
15.
为降低碳纳米管的表面活化能, 改善碳纳米管与金属基体的相容性, 采用化学镀的方法, 在碳纳米管表面镀覆一层金属Ni。研究了施镀时间和镀液浓度对碳纳米管表面镀Ni层厚度的影响。结果表明: 随着施镀时间延长, Ni沉积颗粒变大导致镀Ni层变厚; 镀液浓度增加, 碳纳米管表面沉积的Ni颗粒增多, 镀Ni层逐渐致密。本实验工艺条件下, 镀液浓度为0.08 mol/L, 反应时间为30 min时, 可以在碳纳米管表面镀覆一层界面结合良好且致密的Ni层, 其厚度约为10 nm。热处理能有效缓解镀Ni层应力, 改善界面结合。 相似文献
16.
17.
Giovanni Mondin Benjamin Schumm Julia Fritsch René Hensel Julia Grothe Stefan Kaskel 《Materials Chemistry and Physics》2013
A novel single-step approach for the fabrication of poly(methyl methacrylate) structures by soft molding of a 5 wt% solution in acetone is reported. The use of a low weight solution and of a solvent with high volatility ensures a very fast patterning, down to 10 s. In addition, the process is extremely simple and cost-effective, since just one elastomeric mold is needed, and areas as large as 1 cm2 were patterned uniformly and defect-free. The process was applied to the fabrication of silver structures by silver deposition via electroless plating or evaporation followed by poly(methyl methacrylate) removal. Structures of various shapes and sizes, with dimensions in the micrometer and submicrometer range were successfully fabricated, showing the versatility of the process. This silver patterning process is particularly well suited for applications in microelectronics and optoelectronics, such as the fabrication of transparent electrodes for solar cells and displays, manufacturing of metal etching masks and wiring of printed circuits. 相似文献
18.
19.
20.
It has been demonstrated that silver could be plated on colloidal oxides by reducing silver salts in the presence of colloidal oxides in aqueous solution. In this electroless plating manner, silver coatings have been applied to colloidal silica, tin oxide and to these colloids which have previously been coated with a few monolayers of tin silicate. Data from this study have demonstrated the technical feasibility of electroless plating for the preparation of silver-tin oxide composites as a source of this material for electrical contact materials. 相似文献