Microstructural evolution mechanism during brazing of Hastelloy X superalloy using Ni–Si–B filler metal

The paper aims at understanding solidification phenomena and solid state precipitations during diffusion brazing of Hastelloy X nickel base superalloy using a ternary Ni–4.5Si–3.2 B (in wt-%) filler metal. The joint is featured by the formation of Ni-rich solid solution in an isothermal solidification zone, borides/silicide formation during eutectic-type solidification in an athermal solidification zone, on-cooling precipitation of fine nickel silicides in the joint centerline, in situ precipitation of Mo–Cr-rich borides in the diffusion affected zone and grain growth in the heat affected zone. The implication of the phase transformations on the joint properties is discussed. It is shown that Hastelloy X exhibited very fast isothermal solidification which can be attributed to its high Mo and Cr content that promotes in situ boride precipitation during brazing.     

Microstructure of diffusion-brazing repaired IN738LC superalloy with uneven surface defect gap width

Slots with uneven width were cut by femtosecond laser in small plates of IN738LC superalloy to imitate service cracks. The ‘cracks’ were repaired by diffusion brazing using BNi-1a or a mixed filler alloy at 1100°C. The joint region was composed of isothermal solidification zone (ISZ), diffusion affected zone (DAZ) and precipitate zone (PZ). The compositions were different between the upper and lower ISZ due to the variation of gap width. The sample, repaired with two kinds of filler metals, had similar DAZ microstructure. PZ of mixed filler alloy bonded sample had a similar microstructure with that of BNi-1a, but less borides. The maximum gap sizes of complete isothermal solidification were almost the same for different filler alloys, followed a square root relationship with time. However, PZ of BNi-1a bonded was larger, resulting from a more base metal dissolution. The relationship between the PZ, ISZ and crack width is discussed.     

High temperature diffusion induced liquid phase joining of a heat resistant alloy

Transient liquid phase bonding (TLP) of a nickel base superalloy, Waspaloy, was performed to study the influence of holding time and temperature on the joint microstructure. Insufficient holding time for complete isothermal solidification of liquated insert caused formation of eutectic-type microconstituent along the joint centerline region in the alloy. In agreement with prediction by conventional TLP diffusion models, an increase in bonding temperature for a constant gap size, resulted in decrease in the time, t_f, required to form a eutectic-free joint by complete isothermal solidification. However, a significant deviation from these models was observed in specimens bonded at and above 1175 °C. A reduction in isothermal solidification rate with increased temperature was observed in these specimens, such that a eutectic-free joint could not be achieved by holding for a time period that produced complete isothermal solidification at lower temperatures. Boron-rich particles were observed within the eutectic that formed in the joints prepared at the higher temperatures. An overriding effect of decrease in boron solubility relative to increase in its diffusivity with increase in temperature, is a plausible important factor responsible for the reduction in isothermal solidification rate at the higher bonding temperatures.     

Microstructure－properties relationship of transient liquid phase diffusion bonded a third generation single crystal superalloy joint

Microstructure of transient liquid phase( TLP) diffusion bonded a third generation single crystal superalloy joint was investigated using scanning electron microscopy( SEM),and mechanical properties test of joint was carried out,for obtaining relationship between microstructure and mechanical properties of joint. The results showed that the joint contained bonding zone and base metal. The diffusion zone was obviously observed. When it was not finished for isothermal solidification process,the bonding zone would contain isothermal solidification zone and rapid solidification zone. Metallographic examination revealed that isothermal solidification zone was consisted of γ and γ' phase. Rapid solidification zone was consisted of two different structures,which were ternary eutectic of borides,γ and γ' phase developing at the edge of joint,binary eutectic of γ and γ' phase appearing in the portion of joint. When it was not enough for homogenization process under the condition of finishing isothermal solidification process,the bonding zone would contain isothermal solidification zone and borides at the interface. Under the conditions of relatively high welding temperature and long welding time,average tensile strength of joint was equivalent to that of parent material.     

Numerical modelling and experimental investigation of diffusion brazing SS304/BNi-2/SS304 joint

Abstract

The kinetics of dissolution and isothermal solidification at the bonding temperature during diffusion brazing SS304/BNi-2/SS304 has been studied through a combination of analytical modelling and experimental investigations. The modelling is based on the diffusion theory and the consideration of transient motion of liquid/solid interface. A set of coupled finite differential equations has been programmed to track the motion of liquid/solid interface during the isothermal solidification of liquid filler. Four parameters can be mathematically determined from the analytical modelling including the evolution of solute concentration profile, the maximum diffusion distance, and the maximum liquid thickness as well as the time to complete the isothermal solidification. These analyses are helpful to understanding the joining mechanism during diffusion brazing. The temperature dependent diffusion coefficient used in the modelling is derived together with the experimental data from brazing the wedge shaped joint specimen of SS304/BNi-2/SS304. The effects of bonding temperature and initial joint thickness on the joining process have also been investigated.     

IC10单晶过渡液相扩散焊接头微观组织与力学性能

采用扫描电镜（SEM）和能谱分析仪（EDS）研究IC10单晶高温合金过渡液相（TLP）扩散焊接头微观组织演变．结果表明,接头由连接区和基体区所组成,连接区由等温凝同区和快速凝固区组成．快速凝固区可以通过延长保温时间的方法予以消除．随着保温时间从2h增加到8h,基体内的γ＇相尺寸达到了0．9μm．通过限制TLP扩散焊接头内晶界的形成,以及焊后固溶处理的方法可以有效提高接头的力学性能．在温度1000℃下,接头平均抗拉强度为507MPa．在温度1000℃、应力144MPa下接头持久寿命可达到120h以上．     

Thermodynamic and kinetic simulations of high temperature brazing: microstructure evolution in CMSX-4 joints

In this study, thermodynamic and kinetic simulations with Thermo-Calc and DICTRA software were utilised to predict the microstructural evolution observed in brazing of high-strength nickel base single crystal superalloy, CMSX-4, with two commonly used filler metals (FMs), AWS BNi-2 (AMS 4777) and AWS BNi-9. DICTRA diffusion models of the Ni-B binary system were used to calculate base materials dissolution, the amount of centreline eutectic constituents and time required for complete isothermal solidification at various joint gaps. Thermo-Calc simulations using the CALPHAD technique predicted transformation temperatures and equilibrium phases of the joints based on the chemical compositions of the two FMs. Experimental brazing and characterisations of joint microstructure at various brazing temperatures, hold times and joint gaps were used to validate the simulation modelling results. Good correlation with both Thermo-Calc and DICTRA simulations and empirical data demonstrated the benefits of using this modelling approach for braze joint development and applications.     

瞬间液相扩散焊与钎焊主要特点之异同

从焊接进程、凝固、氧化物的破碎、中间层与钎料的区别、接头组成、脆性相的形成与消除、压力的作用、接头强化机理等方面总结分析了瞬间液相扩散焊与钎焊的区别。强调指出了下述关键点 :(1)中间层的选取是获得两种不同焊接方法接头的首要前提 ;(2 )在钎焊中侧重点是润湿性 ,它是保证接头获得一定强度的首要前提与主要手段 ;(3 )在瞬间液相扩散焊过程中 ,除了润湿性之外 ,更为关注的是降熔元素的扩散。中间层中降熔元素向母材的持续扩散是TLP接合中液态区增宽、破碎氧化膜、等温凝固、均匀化现象的本质原因 ;降熔元素向母材的充分扩散及由此而出现的中间层成分的合理改变是TLP焊接成败的命脉     

Aging response of transient liquid phase bonded wrought IN718 superalloy: influence of post-bond heat treatment

Aging response of transient liquid phase Nb bearing wrought IN718 nickel base superalloy is studied. The aging behaviour of the joint is influenced by low Nb+Al+Ti content of isothermal solidification zone (ISZ) and formation of Nb–Cr–Mo based boride precipitates in diffusion affected zone (DAZ). It was shown that applying a post-bond heat treatment which was able to eliminate the diffusion induced boride precipitates in DAZ and increase the Nb+Al+Ti content of the ISZ improved the aging response and shear strength of the joint.     

Microstructural characteristics of a cast IN718 superalloy bonded by isothermal solidification

Isothermal solidification is a key feature of transient liquid phase bonding which prevents the formation of deleterious intermetallic phases in the joint centerline and results in bonds with improved mechanical performance. This paper discusses the metallurgical characteristics and mechanical properties of an as-cast IN718 superalloy bonded by diffusion-induced isothermal solidification of Ni-7Cr-4.5Si-3.2B-3Fe (wt%) filler metal. After transient liquid phase bonding of as-cast IN718 at 1000 °C for 60 min, a bond exhibiting a solid solution microstructure with joint efficiency of 72% in terms of shear strength was obtained. The joining process was effectively able to prevent the formation of hard and brittle nickel and chromium borides, which typically lead to critical problems in brazing. The formation of Nb-rich Laves phase, which is well known as a major issue in the fusion welding of IN718, was not observed. The bonding time, which governs the extent of isothermal solidification, was a critical parameter for controlling the mechanical properties of the joints in terms of shear strength and hardness distribution across the bond.     

单晶过渡液相扩散焊接头单晶化机理

为了探明单晶高温合金TLP扩散焊接头单晶化机理,采用扫描电镜（SEM）、背散射电子（BES）和背散射衍射（EBSD）分析接头微观组织.结果表明,接头内形成贯穿型晶界和等轴晶粒是接头无法实现单晶化的主要原因.在实际焊接过程中,应严格控制试样加工、中间层添加、装配、焊接等工序.在等温凝固阶段,液相依附于固态单晶基体以平面晶的方式外延生长,直至液相消失,界面上形成具有一致晶体取向的一块单晶,随着保温时间的延长,固态均匀化过程充分进行,冷却后将形成单晶化的接头.     

单晶高温合金的过渡液相扩散焊

为了探明单晶过渡液相(TLP)扩散焊接头组织与性能的关系,采用扫描电镜(SEM)研究接头微观组织,并进行力学性能测试. 结果表明,接头由连接区和基体区所组成. 当等温凝固过程未完成时,连接区由等温凝固区和快速凝固区组成,而等温凝固区主要由γ和γ'相组成,快速凝固区主要是由共晶组织组成. 当等温凝固完成而固态均匀化过程不充分时,连接区由等温凝固区和分布在接头中心的硼化物相组成. 采用低温等温凝固,高温固态均匀化的焊接工艺可以获得高性能的接头.     

A study on the two-step transient liquid phase diffusion bonding of K640 superalloy

A new technology, the two-step transient liquid phase diffusion bonding （TLP-DB） technology for cobalt-based K640 superalloy, was investigated. The method consists of a short-time high temperature heating to melt interlayer followed by isothermal solidification of liquid phase at a lower temperature than that of the conventional TLP-DB. The result indicates that the two-step TLP-DB can reliably produce an ideal joint with uniform chemical composition, which is superior to the joint welded by conventional TLP-DB in microstructure and mechanical properties. Bonding parameters of new process are 1 250℃ for 0. 5 h and 1 180℃ for 3 h. The high-temperature tensile strength of the joint by two-step TLP-DB reaches 74% of that of the base material on an equal basis, but the high-temperature tensile strength of the joint by conventional TLP-DB is only 58% of that of the base material.     

MICROSTRUCTURE CHARACTERISTICS AND CRYSTALLOGRAPHIC ORIENTATION OF TRANSIENT LIQUID PHASE JOINT OF NI-BASE SINGLE CRYSTAL SUPERALLOY

采用Ni-15Cr-3.5B非晶合金箔带作为中间层合金对镍基单晶高温合金进行瞬态液相(TLP)连接. 利用光学显微镜、扫描电镜、透射电镜对接头的微观结构进行观察和分析, 利用电子背散射衍射(EBSD)方法测定了连接区域和基体之间的结晶学取向. 结果表明, 接头区域由连接区、中间金属/基体金属界面扩散区和基体金属区组成, 连接区中心形成M23B6+γ和MB+γ 共晶, 扩散区形成细小的M3B2颗粒; 均匀化处理后接头与基体的γ'相的尺寸趋于一致; TLP接头等温凝固过程中, 固/液界面向液相移动中外延生长, 连接层与所连接的基体金属的结晶学取向一致.     

BNi68CrWB钎焊K24/GH648异种高温合金的界面形成机理

采用BNi68CrWB钎料粉末对K24和GH648异种高温合金进行钎焊连接,分析了接头典型界面组织,提出了钎焊过程反应机理.结果表明,接头由共晶区、等温凝固区和扩散区组成.共晶区由WB,CrB和镍基固溶体组成,等温凝固区为镍基固溶体,GH648侧扩散区由WB,W_xB_y,Cr_xB_y,以及沿晶界析出的镍基固溶体和少量的Cr₂Ni₃相组成,K24侧扩散区与母材差异不明显.钎焊过程由元素富集、母材溶解、等温凝固和共晶凝固四个阶段组成.其中等温凝固阶段是钎焊过程中最关键的阶段,等温凝固不完全时,钎缝中央存在共晶组织,影响接头性能.钎焊温度1 150℃,保温120 min时,等温凝固完全,接头组织均匀,力学性能最优,室温拉剪强度可达323 MPa.     

Diffusional solidification phenomena in clad aluminum automotive braze sheet

Differential scanning calorimetry (DSC) was used to investigate clad/core interactions and the evolving microstructure during simulated brazing of aluminum brazing sheet alloy No. 12, which consists of an AA3003 core with AA4343 cladding layers on either side. During the brazing operation the clad layers can alloy with the core as a result of Si diffusion before and after clad melting (i.e. in the solid-state and the solid/liquid state). This interaction affects the amount of liquid formed and its duration, which will impact on joint formation and mechanical performance. Metallographic data and DSC liquid fraction measurements show that solid-state interdiffusion prior to melting is responsible for some initial liquid suppression, but the amount of liquid present during the brazing cycle decreases rapidly as a result of isothermal, or diffusional, solidification. The liquid phase can be completely removed via diffusional solidification at the brazing temperature prior to cooling, leaving behind a significantly coarsened clad structure. Using this novel and practical DSC technique, experimental insight regarding Si diffusion into the core can be obtained as well as the evolving clad/core solidification structure.     

铝合金与不锈钢大气钎焊性的改善——铝合金与不锈钢焊接技术(二)

在基本查明铝合金与不锈钢焊接困难原因的基础上,参考钎料对纯铝等温凝固过程的数值解析以及熔融钎料层消失时间的推定及试验结果,探讨了解决对策.采用电阻炉、TCM10000万能试验机进行了钎焊接头改善及评价试验,以此为依据提出了改善铝合金与不锈钢钎焊性的新焊接方法,即增大钎焊间隙实施钎焊的方法;预先使钎料对不锈钢产生润湿,然后再与铝合金实施钎焊的方法.又采用上述方法进行了其它形状部件的制作,从理论到实践验证了新焊接方法的可行性.     

Thermal Properties of Ni-Cr-Si-B-Fe Based Interlayer Material and Its Application in TLP Bonding of IN 718 Superalloy

A new Ni-Cr-Si-B-Fe filler material is prepared for transient liquid-phase (TLP) bonding of Inconel 718 superalloy by mechanical alloying technique. The melting temperature range of the filler material and its activation energy of melting are determined by differential scanning calorimetry technique. The activation energy and melting temperature of the alloy powder decrease with increasing milling time. Inconel 718 alloy was joined via TLP by using the newly developed filler material. The effect of TLP bonding temperature and time on microstructural evolution and mechanical properties of the joint was investigated. Three distinct microstructural regions were observed in the bonding area: isothermal solidification zone consisting of a single-phase solid solution, diffusion affected zone consisting of extensive diffusion-induced precipitates of metallic boride, and unaffected base material. The ultimate shear strength and microhardness of the TLP-bonded joint increase with bonding time and temperature.     

Bonding phenomena of transient liquid phase bonded joints of a Ni base single crystal superalloy

The bonding phenomena of Ni base single crystal superalloy CMSX-2 during transient liquid phase (TLP) bonding have been investigated using MBF-80 and F-24 insert metals. TLP bonding of the superalloy was carried out at 1373-1548K for 0-19.6ks in vacuum and the (100) plane of each test specimen was always aligned perpendicular to the joint interface. The dissolution width increased when the bonding temperature and holding time increased. The eutectic width decreased linearly with the square root of holding time during isothermal solidification. After homogenization treatment, the microstructure, distributions of hardness and alloying elements in the bonded interlayer become similar to those of the base metal.     

SS304/BNi-2/SS304高温钎焊对接接头微观结构特征

通过试验手段研究了SS304/BNi-2/SS304钎焊对接接头微观结构特征,使用能谱分析结合合金三元相图研究了接头区域典型的微观结构形貌和特征相变化规律,讨论了降熔元素在接头等温凝固连接过程中所起的关键作用。结果表明,在钎焊温度时,B从液相钎料向固相母材的快速扩散控制了接头的等温凝固过程,也因此决定了接头的微观结构相...