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铜基受电弓滑板试件电阻率和磨损性能研究 总被引:16,自引:0,他引:16
为了制备具有优良电阻率和磨损性能的C/Cu复合材料,运用传统的粉末冶金(PM)方法,首次将受电弓滑板材料中C的质量分数提高到8%(采用大粒度石墨的粒度为50目和32目),分析了压制压力、烧结保温时间和烧结温度对其电阻率和磨损性能的影响.研究了石墨粒度和镀铜石墨对受电弓滑板材料性能的影响.研究结果表明:如果增大压制压力,电阻率下降;而延长烧结保温时间和提高烧结温度,使材料的电阻率增加.烧结温度过高或过低对材料的耐磨性和减摩性不利.石墨粒度越大,电阻率越小,减摩性和耐磨性越差.镀铜石墨能够改善铜基受电弓滑板材料的烧结过程,降低其孔隙度和电阻率,提高其耐磨性和减摩性,但不改变材料的磨损机理. 相似文献
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采用超声波化学镀覆技术和电镀技术分别对导电陶瓷Ti_3SiC_2颗粒表面和碳纤维表面进行镀铜处理。用粉末冶金法制备了两组成分相同的Ti_3SiC_2-碳纤维-铜-石墨复合材料,其中一组加入的是镀铜Ti_3SiC_2(A组),另一组加入的是不镀铜Ti_3SiC_2(B组),对它们的密度、电阻率、硬度和抗弯强度进行了测试。结果表明:随Ti_3SiC_2含量的增加两组复合材料的密度、导电性、硬度和抗弯强度明显提高,并且加镀铜Ti_3SiC_2的碳纤维-铜-石墨复合材料的性能指标明显优于加不镀铜Ti_3SiC_2的碳纤维-铜-石墨复合材料。 相似文献
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Three copper-film-coated steel plates (abbreviated hereafter as copper-coated plate) with different thicknesses of copper film 30 to 90 nm were prepared and their adhesion properties to rubber compounds were examined. The high adhesion of copper-coated plates to the rubber compound containing resinous bonding additives was obtained at normal and over-cure conditions The copper-coated plate containing an amount of copper coating sufficient to plate the surface with a uniform copper layer showed better adhesion than that having a small amount of copper coating on its surface. The stability against green humidity aging and the cause for the high adhesion of the copper-coated plate were discussed compared with those of the brass plate. 相似文献
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Three copper-film-coated steel plates (abbreviated hereafter as copper-coated plate) with different thicknesses of copper film 30 to 90 nm were prepared and their adhesion properties to rubber compounds were examined. The high adhesion of copper-coated plates to the rubber compound containing resinous bonding additives was obtained at normal and over-cure conditions The copper-coated plate containing an amount of copper coating sufficient to plate the surface with a uniform copper layer showed better adhesion than that having a small amount of copper coating on its surface. The stability against green humidity aging and the cause for the high adhesion of the copper-coated plate were discussed compared with those of the brass plate. 相似文献
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研究了在铜-石墨基复合材料中用镀铜TiB2和碳纤维取代一部分石墨后对复合材料密度、电阻率、硬度和抗弯强度的影响。结果表明:用2%的碳纤维取代部分石墨后,随着镀铜TiB2的含量增加到2%时,其复合材料的密度比原来提高2%,电导率提高31%,硬度提高26%,抗弯强度提高8%。 相似文献
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镀铜碳纤维-镀铜石墨-铜基复合材料的制备与性能研究 总被引:2,自引:0,他引:2
用粉末冶金法成功地制备了短碳纤维-镀铜石墨-铜基复合材料,对其体积密度、电阻率、硬度、抗弯强度和摩擦磨损性能进行了测试,观察了它们的显微组织、断口和磨面形貌,并与石墨-铜、镀铜石墨-铜基复合材料进行了对比。结果表明,镀铜碳纤维-镀铜石墨-铜基复合材料的各项性能,明显优于石墨-铜、镀铜石墨-铜基复合材料。 相似文献
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为了制备具有优良电阻率和磨损性能的 C/Cu 复合材料,运用传统的粉末冶金(PM)方法,首次将受电弓滑板材料中 C 的质量分数提高到8%(采用大粒度石墨的粒度为50目和32目),分析了压制压力、烧结保温时间和烧结温度对其电阻率和磨损性能的影响.研究了石墨粒度和镀铜石墨对受电弓滑板材料性能的影响.研究结果表明:如果增大压制压力,电阻率下降;而延长烧结保温时间和提高烧结温度,使材料的电阻率增加.烧结温度过高或过低对材料的耐磨性和减摩性不利.石墨粒度越大,电阻率越小,减摩性和耐磨性越差.镀铜石墨能够改善铜基受电弓滑板材料的烧结过程,降低其孔隙度和电阻率,提高其耐磨性和减摩性,但不改变材料的磨损机理. 相似文献