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1.
食品安全示范城市创建是食品安全治理体系的重要载体。本文系统性回顾食品安全治理体系相关研究,从“党政同责”、政府监管、市场主体、社会共治等四个治理主体,构建生产规范、产业转型升级等27个评价指标的治理标准,利用层次分析法实证分析了浙江省食品安全示范城市创建情况。结果表明:采用暗查暗访、现场检查、体系评估、示范引领答辩等形式,按照一定的评价流程、评价标准的食品安全示范城市创建,是实现食品安全现代化目标的重要载体。食品安全治理体系包括“治理载体—治理主体—治理标准—治理目标”。食品安全治理成效与跟踪评价、群众满意度以及体系评估高度关联。 相似文献
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采用改性木质素(MZS)作为成核剂,生物质纤维(BF)作为增强剂,通过双螺杆挤出机制备了生物降解的聚乳酸(PLA)/BF/MZS材料。采用差式扫量热仪(DSC)、电子万能试验机和扫描电子显微镜(SEM)分析了BF和MZS对PLA材料性能的影响。结果表明,BF和MZS有效提高了PLA的结晶能力和力学性能。当BF和MZS的含量分别为15%和1%时,PLA材料结晶度提高至67.1%,在50℃/min降温速率下仍具有较高的结晶能力。105℃等温结晶时,15%BF和1%MZS的PLA材料半结晶时间降低至9.0 s,比纯PLA缩短了72.2%。当PLA含有3%BF和1%MZS时,拉伸强度和冲击强度分别为70.1 MPa和7.4 kJ/m^2,比纯PLA分别提高了7.8%和10.4%,根据SEM显示,当BF含量为3%时,在PLA材料中分布较均匀。 相似文献
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The effect of charge on the dihydrogen storage capacity of Sc2–C6H6 has been investigated at B3LYP-D3/6-311G(d,p) level. The neutral system Sc2–C6H6 can store 8H2 with gravimetric density of 8.76 wt %, and one H2 dissociates and bonds atomically on the scandium atom. The adsorption of 8H2 on Sc2–C6H6 is energetically favorable below 155 K. The atom-centered density matrix propagation (ADMP) molecular dynamics simulations show that Sc2–C6H6 can adsorb 3H2 within 1000 fs at 300K. Compared with Sc2–C6H6, the charged systems can adsorb more hydrogen molecules with higher gravimetric density, and all the H2 are adsorbed in the molecular form. The gravimetric densities of Sc2–C6H6+ and Sc2–C6H62+ are 9.75 and 10.71 wt%. Moreover, the maximum adsorption of charged systems are favorable in wider temperature range. Most importantly, the ADMP-MD simulations indicate that Sc2–C6H62+ can adsorb 6 hydrogen molecules within 1000 fs at 300K. It can be found that the gravimetric density (6.72 wt%) of Sc2–C6H62+ still exceeds the target of US Department of Energy (DOE) under ambient conditions. 相似文献
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Yang Yueyi Wang Lide Chen Huang Wang Chong 《Analog Integrated Circuits and Signal Processing》2021,107(3):605-616
Analog Integrated Circuits and Signal Processing - Fault diagnosis of analog circuit is critical to improve safety and reliability in electrical systems and reduce losses. Traditional fault... 相似文献
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Deep Integration of Innovation and Entrepreneurship (InE) Education in Chinese University Classrooms
Recently, InE has been regarded as a popular education strategy in Chinese universities. However, problems have been exposed in the adoption of InE, for example, in InE courses and competitions. The purpose of this paper is to provide a possible solution to the problems, which is to organize effective InE courses by integrating InE with Inter-Course-level Problem-Based Learning (ICPBL). A detailed case is demonstrated by an ICPBL elective course design with deep integration of InE in the teaching, learning, and assessments. This paper contributes to a new curriculum design for promoting InE education in practically for Chinese universities. 相似文献
8.
Lai-Ying Leong Teck-Soon Hew Keng-Boon Ooi Alain Yee Loong Chong Voon-Hsien Lee 《Information & Management》2021,58(2):103416
This paper examines what influences trust in mobile social commerce environment. Drawing on trust-based acceptance model (i.e. cognitive and emotional trust) and online review features (i.e. profile photo, linguistic style, and reported experience), we examine how these factors affect trust in mobile social commerce. Hypotheses were tested using survey data. The results of our model showed that there are significant influences of profile photo, reported experience, cognitive, and emotional trust towards trust in ms-commerce. This work contributes to existing literature by examining the roles of previous trust in mobile payments and online reviews on trust in mobile social commerce. 相似文献
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Chong D. Y. R. Lim B. K. Rebibis K. J. Pan S. J. Sivalingam K. Kapoor R. Sun A. Y. S. Tan H. B. 《Advanced Packaging, IEEE Transactions on》2006,29(4):674-682
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported 相似文献
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