纳米压印光刻技术

为了避免纳米压印光刻技术与光刻技术混淆，纳米压印光刻技术严谨的专业术语定义是：不使用光线或者辐射使光刻胶感光成形，而是直接在硅衬底或者其他衬底上利用物理学机理构造纳米级别的图形。这种纳米成像技术真正地实现了纳米级别的图形印制。     

纳米压印光刻模版制作技术

在下一代光刻技术中,光刻的成本越来越高,这使得工业界开始寻找新的技术。纳米压印作为非光学的下一代光刻技术,具有分辨率高、成本低、产率高等诸多优点,因而可能应用于将来的半导体制造中。同时,纳米压印也可以用于微机电系统(MEMS)和其他纳米结构的图形复制。纳米压印光刻技术主要包括热压印、紫外固化压印和微接触法压印。介绍了在这3种纳米压印光刻技术中,压印模版制作的制作工艺和模版表面的防粘连处理,并且讨论3种压印方法适用的不同领域。     

纳米压印技术进展及应用

半导体加工几十年里一直采用光学光刻技术实现图形转移,最先进的浸润式光学光刻在45 nm节点已经形成产能,然而,由于光学光刻技术固有的限制,已难以满足半导体产业继续沿着摩尔定律快速发展.在下一代图形转移技术中,电子束直写、X射线曝光和纳米压印技术占有重要地位.其中纳米压印技术具有产量高、成本低和工艺简单的优点,是纳米尺寸电子器件的重要制作技术.介绍了传统纳米压印技术以及纳米压印技术的新进展,如热塑纳米压印技术、紫外固化纳米压印技术、微接触纳米压印技术、气压辅助纳米压印技术、激光辅助压印技术、静电辅助纳米压印技术、超声辅助纳米压印技术和滚轴式纳米压印技术等.     

纳米压印光刻技术--下一代批量生产的光刻技术

纳米压印光刻技术已被证实是纳米尺寸大面积结构复制的最有前途的下一代技术之一。这种速度快、成本低的方法成为生物化学、μ级流化学、μ-TAS和通信器件制造以及纳米尺寸范围内广泛应用的一种日渐重要的方法,如生物医学、纳米流体学、纳米光学应用、数据存储等领域。由于标准光刻系统的波长限制、巨大的开发工作量、以及高昂的工艺和设备成本,纳米压印光刻技术可能成为主流IC产业中一种真正富有竞争性方法。对细小到亚10nm范围内的极小复制结构,纳米压印技术没有物理极限。从几种纳米压印光刻技术中选择两种前景广阔的方法——热压印光刻(HEL)和紫外压印光刻(UV-NIL)技术给予介绍。两种技术对各种各样的材料以及全部作图的衬底大批量生产提供了快速印制。重点介绍了HEL和UV-NIL两种技术的结果。全片压印尺寸达200mm直径,图形分辨力高,拓展到纳米尺寸范围。     

基于光刻版的无留膜紫外纳米压印技术研究

针对纳米压印光刻技术中压印脱模后的留膜去除问题,提出了一种基于光刻版的无留膜紫外纳米压印技术.采用传统的光刻版作为紫外压印模版,由于模版上铬层的遮蔽作用.使得铬层下面的光刻胶不被曝光,从而可以轻易地被去除.实验结果表明,该技术综合了压印与光刻各自的优点,可以获得无留膜厚度的压印图形,省去了压印后的留膜刻蚀工艺.从而避免了由于留膜厚度不均匀所带来的过刻蚀或欠刻蚀的问题.     

纳米压印模板需要高质量的检测技术

纳米压印光刻经学术和行业团体近十年的研究之后，已逐渐开始对半导体行业产生引导作用。简单地讲，纳米压印是把一个1×的模板压进一个柔性层，从而在衬底上制作图形。斯坦福大学的电子工程教授Fabian Pease说：“它引人注意之处是具有半导体行业现在非常感兴趣的分辨率，即远低于100nm的线条，而在这个范围内，如果无法用纳米压印光刻来实现，光学光刻将变得很昂贵。”     

下一代光刻技术的设备

下一代光刻技术是指≤32nm工艺节点的光刻技术。介绍了下一代光刻技术与设备,包括X射线光刻技术、极紫外线光刻技术和纳米压印光刻技术等。     

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纳米压印掩膜复制缩减光刻拥有成本随着纳米压印光刻很好地解决了分辨率的问题,关注的焦点转移到了拥有成本(CoO)上。本文重点研究了掩膜成本,包括一种称为"掩膜复制"的方     

《国际半导体技术蓝图》(2005版)光刻部分解析

对2005年公布的《国际半导体就十时微蓝图》中光刻部分进行了介绍与分析,并与之前的版本进行比较,列出了光刻技术面临的挑战和潜在技术方案。最后指出,浸入式光刻、纳米压印、极紫外光刻和ML2将是未来几年重点研究对象。     

SUSS光刻机实现大面积纳米压印光刻

<正>SUSS MicroTec,全球领先的三维、MEMS、先进封装、纳米压印设备供应商,于日前宣布,其手动光刻机,外加一个纳米压印的组件,即可对大面积图形重复进行亚50nm的压印。这项新技术名为"基板完整压印光刻"(SCIL),由荷兰埃因霍恩飞利浦研究所开发,通过技术协议转让给SUSS MicroTec。硬质模版纳米压印光刻(NIL)分辨率高,但面积小,软质模版压印面积大,但分辨率通常低于200nm,SCIL刚好弥补两者的缺陷。     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Nanoimprint Lithography -A Next Generation High Volume Lithography Technique

IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

Influence of PVK ： NPB hole transporting layer on the characteristics of organic light-emitting devices

A doping system consisting of NPB and PVK is employed as a composite hole transporting layer （CHTL）. By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK ： NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK ： NPB at 1：3.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.     

Analysis of error performance on Turbo coded FDPIM

Due to variable symbol length of digital pulse interval modulation（DPIM）, it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation（FDPIM） method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.