共查询到16条相似文献,搜索用时 328 毫秒
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微波毫米波固态有源相控阵天线在通信、雷达和导航等电子装备中得到广泛应用,三维互联与封装技术是研制小型化、高集成和高可靠有源相控阵天线的微波毫米波多芯片模块(MMCM)的关键技术。通过开展三维多层多芯片热布局优化设计,使MMCM 温度分布均匀,保证三维MMCM 可靠工作。通过研发含有双面高精度腔体的低温共烧陶瓷(LTCC)多层电路基板,并采用球栅阵列(Ball Grid Array, BGA)和毛纽扣微波毫米波垂直互联工艺、激光密封焊接工艺,研制出小型化、高性能和高可靠性的三维微波毫米波多芯片模块,满足新一代微波毫米波相控阵天线技术要求。 相似文献
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介绍了一种宽带幅相一致变频组件的设计思路并给出测试结果.该组件在6~18 GHz工作频带内,幅度一致性≤±2.5 dB,相位一致性≤±25°,噪声系数≤7 dB.该变频组件采用了微波多芯片组件(MMCM)工艺,具有小型化、模块化、通用化的特点. 相似文献
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为解决微波多芯片组件(Microwave Multi-Chip Module,MMCM)中键合互连线的设计问题,采用三维电磁场软件HFSS和电路设计软件Ansoft Designer对键合线的模型进行了仿真分析。根据仿真结果,提取了键合线的等效电路参数。最后建议采用增加线宽的微带线结构结合两到三根键合线,以达到优化设计的目的。 相似文献
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低温共烧陶瓷(LTCC)实现微波多芯片组件(MMCM)的一种理想组装技术.论述了制造微波多芯片组件的LTCC基板工艺,分析了LTCC基板生瓷材料在热切过程刀体运动流程以及其控制特点,研究了刀体在高速热切过程中的速度控制特点,提出了在确定结构下实现LTCC热切刀体的高精度和高速度控制方法,实验证明,在切割精度不受影响的情况下该方法提高了切割效率,减小了在高加减速情况下对机械系统造成的冲击。 相似文献
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本文将有限元模拟与基于统计试验的表面响应法(RSM)相结合,应用于特定需求的埋置型大功率多芯片微波组件热布局分析中,先通过ANSYS温度场分析,得出大功率芯片布局是影响整体温度和芯片结温的关键因素,再对一含有四个大功率芯片的微波组件模块进行了表面响应分析,得到了关于芯片坐标的线性回归方程,利用该方程可预测坐标组合下芯片的结温和进行芯片坐标的寻优。同时评价了RSM响应模型的精度,采用有限元仿真验证表明:线性回归方程的预测值与仿真值误差仅为0.0623℃,研究成果对埋置型大功率多芯片微波组件热设计具有指导意义。 相似文献
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With the development of electronics towards smaller, more compact, and increasingly complex, flip chip technology has been used extensively in microelectronic packaging, and disadvantages occur in traditional detection methods. It is indispensable to explore new methods for flip chip solder joint inspection. In this paper we investigate an approach for solder joint inspection based on the active thermography. The basic principle of the active thermography method is described, and the experimental investigation is carried out using the method. The test flip chip is heated by a non-contact heating source. The thermal distribution on two kinds of chips is captured by an infrared thermal imager. With median filter and segmentation processes, positions of the bumps are segmented. For chips with smaller bumps, principal component thermography is introduced to enhance the segmentation process. The analysis results demonstrate that missing bumps in flip chips can be discerned obviously, which proves the feasibility of the proposed method for defects inspection of flip chips. 相似文献
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The thermal characteristics of 808 nm Al Ga As/Ga As laser diodes(LDs) are analyzed via electrical transient measurements and infrared thermography. The temperature rise and thermal resistance are measured at various input currents and powers. From the electrical transient measurements, it is found that there is a significant reduction in thermal resistance with increasing power because of the device power conversion efficiency. The component thermal resistance that was obtained from the structure function showed that the total thermal resistance is mainly composed of the thermal resistance of the sub-mount rather than that of the LD chip, and the thermal resistance of the sub-mount decreases with increasing current. The temperature rise values are also measured by infrared thermography and are calibrated based on a reference image, with results that are lower than those determined by electrical transient measurements. The difference in the results is caused by the limited spatial resolution of the measurements and by the signal being captured from the facet rather than from the junction of the laser diode. 相似文献
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鉴于越来越多的领域要求微波功率管工作于脉冲应用状态,研究管子的瞬态温度特性就显得日益重要。假设热源为一无限大平面,且在芯片表面热源产生的热量只沿垂直于芯片表面一维地传递。从这一简化的理想热传导模型出发,对热传导方程离散化;在热沉端,定义了能够与实际情况相吻合的温度上升与下降时间常数来确定边界条件,从而得到了在脉冲应用情况下,芯片表面瞬态温度随时间变化的计算机模拟结果。通过在连续波工作下与红外显微镜实测温度的比较,验证了模拟程序的准确性,并且给出了最高结温随时间、脉宽、占空比的拟合公式。为微波脉冲功率晶体管的设计提供了育价值的参考。 相似文献
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利用红外热成像技术和有限元方法在实验和理论上研究了高功率808 nm半导体激光器巴条热耦合特征,给出了稳态和瞬态热分析,呈现了详细的激光器巴条热耦合轮廓.发现器件稳态温升随工作电流呈对数增加,热耦合也随之增加且主要发生在芯片级.另外,作者利用热阻并联模型解释了芯片级热时间常数随工作电流减小的现象. 相似文献