共查询到18条相似文献,搜索用时 359 毫秒
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本文应用MOCVD技术制备出高质量的GaAs,AlGaAs外延材料以及GaAs/AlGaAs异质结和多量子阱结构.首次成功地用该技术生长了微波HBT全结构材料,并获得了较高性能的器件结果:300K时直流增益(β)为15~40,77K时为60,截止频率大于10GHz,最高振荡频率为5.5GHz. 相似文献
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实现了一种可用于单片集成光接收机前端的GaAs基InP/InGaAs HBT。借助超薄低温InP缓冲层在GaAs衬底上生长出了高质量的InP外延层。在此基础上,只利用超薄低温InP缓冲层技术就在半绝缘GaAs衬底上成功制备出了InP/InGaAsHBT,器件的电流截止频率达到4.4GHz,开启电压0.4V,反向击穿电压大于4V,直流放大倍数约为20。该HBT器件和GaAs基长波长、可调谐InP光探测器单片集成为实现适用于WDM光纤通信系统的高性能、集成化光接收机前端提供了一种新的解决方法。 相似文献
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Yu Jinyong Yan Beiping Su Shubing Liu Xunchun Wang Runmei Xu Anhuai Qi Ming Liu Xinyu 《半导体学报》2006,27(10):1732-1736
报道了发射极自对准的InP基异质结双极型晶体管.在集电极电流Ic=34.2mA的条件下,发射极面积为0.8μm×12μm的InP HBT截止频率fT为162GHz,最大振荡频率fmax为52GHz,最大直流增益为120,偏移电压为0.10V,击穿电压BVCEO达到3.8V(Ic=0.1μA).这种器件非常适合在高速低功耗方面的应用,例如OEIC接收机以及模拟数字转换器. 相似文献
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InGaP/GaAs异质结双极晶体管(HBT)是当前微波毫米波领域中具有广阔发展前景的高速固态器件,其直流特性是器件重要参数之一.本文采用Medici软件对两种InGaP/GaAs外延结构HBT的直流特性和高频特性进行了模拟计算,并实际制备出了两种材料结构的大尺寸(发射极面积100μm×100μm)双台面InGaP/GaAs HBT器件,对其直流特性进行了测试和分析,两种外延结构的器件共射直流增益分别为50和350,模拟得其最大截止频率分别为8和10GHz. 相似文献
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LIN Tao CAI Dao-min LI Xian-jie JIANG Li ZHANG Guang-ze 《半导体光子学与技术》2007,13(3):215-217,234
High performance InP/InGaAs heterojunction bipolar transistors(HBTs) have been widely used in high-speed electronic devices and optoelectronic integrated circuits. InP-based HBTs were fabricated by low pressure metal organic chemical vapor deposition(MOCVD) and wet chemical etching. The sub-collector and collector were grown at 655 ℃ and other layers at 550 ℃. To suppress the Zn out-diffusion in HBT, base layer was grown with a 16-minute growth interruption. Fabricated HBTs with emitter size of 2.5×20 μm2 showed current gain of 70~90, breakdown voltage(BVCE0)>2 V, cut-off frequency(fT) of 60 GHz and the maximum relaxation frequency(fMAX) of 70 GHz. 相似文献
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J. Garcia C. Dua S. Mohammadi J. W. Park D. Pavlidis 《Journal of Electronic Materials》1998,27(5):442-445
We report on the complete characterization of a hydride- and hydrogen-free chemical beam epitaxy (CBE) process for the realization
of GaAs/GaInP heterojunction bipolar transistors. Alternative group V sources tertiarybutylarsine, tertiarybutylphosphine,
and trisdimethylaminoarsenic are used instead of traditionally employed AsH3 and PH3. A very high degree of reproducibility of growth parameters (fluxes, substrate temperature, doping levels) is demonstrated.
Total defect densities lower than 10 def/cm2 are routinely obtained. Large-area GaInP/GaAs heterojunction bipolar transistors (HBTs) show a high current gain of 225 for
base sheet resistance of 400 ohm/sq. The devices also exhibit excellent high-frequency characteristics. A cut-off frequency
of 48 GHz and a maximum oscillation frequency of 60 GHz have been obtained. These results demonstrate the high potential capability
of CBE for high-throughput GaInP/GaAs HBT production. 相似文献
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Kobayashi K.W. Umemoto D.K. Velebir J.R. Jr. Oki A.K. Streit D.C. 《Solid-State Circuits, IEEE Journal of》1993,28(10):1011-1017
The authors report the microwave results of complementary heterojunction bipolar transistor (HBT) amplifiers that integrate both n-p-n and p-n-p devices on the same chip using selective molecular beam epitaxy (MBE). An HBT wideband amplifier utilizing the Darlington configuration and implementing a p-n-p active load has a gain of 7.5 dB and a bandwidth from DC to 2.5 GHz. A complementary push-pull amplifier has a saturated output power of 7.5 dBm at 2.5 GHz 相似文献
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K. F. Yarn Y. H. Wang M. P. Houng B. K. Lew 《International Journal of Electronics》2013,100(8):521-532
We will first derive a physics-based, analytical single-finger heterojunction bipolar transistor (HBT) model which takes into account the thermal effect. Next, the model is used to calculate the three figures of merit of HBT, i.e., current gain, cut-off frequency and maximum frequency. Their variation against the collector current density under the influence of thermal effect is presented and the calculation results are discussed. 相似文献
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GaN HBT: toward an RF device 总被引:1,自引:0,他引:1
McCarthy L.S. Smorchkova I.P. Huili Xing Kozodoy P. Fini P. Limb J. Pulfrey D.L. Speck J.S. Rodwell M.J.W. DenBaars S.P. Mishra U.K. 《Electron Devices, IEEE Transactions on》2001,48(3):543-551
This paper reviews efforts to develop growth and fabrication technology for the GaN HBT. Conventional devices are grown by plasma assisted MBE on MOCVD GaN templates on sapphire. HBTs were fabricated on LEO material identifying threading dislocations as the primary source of collector-emitter leakage which was reduced by four orders of magnitude for devices on nondislocated material. Base doping studies show that the mechanism of this leakage is localized punch-through caused by compensation near the dislocation. High contact and lateral resistance in the base cause large parasitic common emitter offset voltages (from 1 to 5 V) in GaN HBTs. The effect of this voltage drop on common emitter characteristics is discussed. The combination of this voltage drop and the emitter collector leakage make Gummel and common base characteristics unreliable without verification with common emitter characteristics. The selectively regrown emitter bipolar transistor is presented with a DC current gain of 6 and early voltage greater than 400 V. The transistor operated to voltages over 70 V. This device design reduces base contact resistance, and circumvented difficulties associated with the emitter mesa etch process. The Mg memory effect in MOCVD grown GaN HBTs is discussed, and MBE grown device layers are shown to produce sharp doping profiles. The low current gain of these devices is discussed, and an HBT with a compositionally graded base is presented, as well as simulations predicting further current gain improvements with base grading 相似文献
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Xianjie LI Yonglin ZHAO Daomin CAI Qingming ZENG Yunzhang PU Yana GUO Zhigong WANG Rong WANG Ming QI Xiaojie CHEN Anhuai XU 《中国光电子学前沿》2008,1(3)
The epitaxial structure and growth, circuit design, fabrication process and characterization are described for the photoreceiver opto-electronic integrated circuit (OEIC) based on the InP/lnGaAs HBT/PIN photodetector integration scheme. A 1.55 μm wavelength monolithically integrated photoreceiver OEIC is demonstrated with self-aligned InP/lnGaAs heterojunction bipolar transistor (HBT) process. The InP/lnGaAs HBT with a 2 μm × 8 μm emitter showed a DC gain of 40, a DC gain cutoff frequency of 45 GHz and a maximum frequency of oscillation of 54 GHz. The integrated InGaAs photodetector exhibited a responsivity of 0.45 AAV at λ = 1.55 μm, a dark current less than 10 nA at a bias of -5 V and a -3 dB bandwidth of 10.6 GHz. Clear and opening eye diagrams were obtained for an NRZ 223-l pseudorandom code at both 2.5 and 3.0 Gbit/s. The sensitivity for a bit error ratio of 10-9 at 2.5 Gbit/s is less than -15.2 dBm. 相似文献
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提出和制作了准平面型InAlAs/InGaAs异质结双极晶体管。该管主要采用硅离子注入法在半绝缘磷化铟衬底中形成隐埋型集电区以代替台面型集电区。晶体管的实测结果如下:h_(fe)=100,f_T=10GHz(V_(CE)=3V,I_c=10mA)。作为单片光电集成方面的实例,研制成功了由三个InGaAs/InAlAsHBT和一个电阻组成的激光器驱动电路,其电流调制速率高达4Gbit/s。 相似文献
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Bartusiak P.J. Henderson T. Kim T. Bayraktaroglu B. 《Electron Device Letters, IEEE》1992,13(11):584-586
A Ku -band monolithic HBT power amplifier was developed using a metal-organic chemical vapor deposition (MOCVD)-grown AlGaAs/GaAs heterojunction bipolar transistor (HBT) operating in common-emitter mode. At a 7.5 V collector bias, the amplifier produced 0.5 W CW output power with 5.0 dB gain and 42% power-added efficiency in the 15-16 GHz band. When operated at a single frequency (15 GHz), 0.66 W CW output power and 5.2 dB of gain were achieved with 43% PAE 相似文献