CMOS技术中的光集成电路

鉴于CD-ROM更大存贮电容和更高的数据速率,数字视盘(DVD)更长播放时间和这些光存储系统的更低价恪的不断增长要求,单片光集成电路(PIC),又称作含集成光探测器红光光电集成电路,成为新的光存储系统的关键电路。ULSI(甚大规模集成电路)CPU的时钟频率正在不断增长,电气互连特别易在电路     

硅基异质集成技术发展趋势与进展

目前主流的异质集成技术有单片异质外延生长、外延层转移和小芯片微米级组装。硅基异质集成主要是指以硅材料为衬底集成异质材料(器件)所形成的集成电路技术。它首先在军用微电子研究中得到重视,并逐渐在民用领域扩展。硅基异质集成技术正处于芯片级集成向晶体管级集成的发展初期,已有关于晶体管级和亚晶体管级集成的报道。本文重点研究了单片三维集成电路(3D SoC)、太赫兹SiGe HBT器件、超高速光互连封装级系统(SiP)、单片集成电磁微系统等硅基异质集成技术前沿,展现了硅基异质集成技术的发展趋势,及其在军用和民用通信、智能传感技术发展中所具有的重要意义。     

2.5D/3D硅基光电子集成技术及应用

全球网络流量急速增长，数据传输所需带宽和能源消耗也随之快速增加，传统电子信息互联架构已无法满足日益增长的带宽和节约能耗的需求。硅基光电子技术具有带宽高、能耗低并且可以利用成熟的互补金属氧化物半导体(CMOS)技术将光子集成电路和电子集成电路大规模集成在硅衬底上等优势，能满足下一代数据传输系统的迫切需求。2.5D/3D硅基光电子集成技术可以有效缩短光芯片和电芯片之间电学互连长度、减小芯片尺寸，从而减小寄生效应、提高集成密度和降低功耗。文章介绍了硅基光电子集成技术的不同方案和最新进展，并展望了硅基光电子芯片结合2.5D/3D集成技术在数据通信、激光雷达、生化传感以及光计算等领域的应用前景。     

集成电路芯片上光互连研究的新进展

讨论了集成电路向高集成度、高工作频率和高传输速率继续发展时 ,常规金属互连出现的困难以及集成电路芯片上光互连具有的潜在优势 .介绍了组成芯片上光互连的光发射器件、光接收器件和光传输器件等三种基本器件及其与硅集成电路集成的研究新进展 .最后展望了集成电路芯片上光互连的应用前景 .     

集成电路芯片上光互连研究的新进展

讨论了集成电路向高集成度、高工作频率和高传输速率继续发展时,常规金属互连出现的困难以及集成电路芯片上光互连具有的潜在优势．介绍了组成芯片上光互连的光发射器件、光接收器件和光传输器件等三种基本器件及其与硅集成电路集成的研究新进展．最后展望了集成电路芯片上光互连的应用前景．     

前言北大核心

随着光子技术在光纤通信、微波光子学、激光雷达、量子信息处理等领域的广泛应用,光子和光电子集成的重要性日益突显,成为解决相关应用面临的体积、功耗和成本瓶颈的关键。实际上,早在20世纪60年代就提出了集成光学的概念。受到集成电路(IC)技术的启发,提出了光子集成回路(PIC)和光电集成电路(OEIC)的概念,期望通过集成技术来增强光电子器件的性能,减小体积和功耗,并提高可靠性。然而,相比于集成电路芯片的迅猛发展,光子和光电子集成由于面临材料和工艺等一系列挑战,直到近十余年才实现突破。目前,大规模光子集成技术正在逐渐走向实用化。     

InGaAs(P)/InP光电子集成(OEIC)器件的研究与进展

单片集成光电子器件是采用光电子集成(OEIC)技术,将集成光路与集成电路融合为一体的一种器件,以完成发射、接收等特定的电路功能.本文着重于1.0～1.6μm波长范围的单片集成先电子器件,简要介绍目前正在广泛研究的OEIC的结构类型及其性能水平,讨论有关的材料生长技术和某些关键的工艺技术问题.     

超高速光传送集成电路

日本电气公司研制出一种1.2Gb超高速光传送光电集成电路.这种用于光发射和光接收的光电集成电路,把长波长半导体激光器和三极管集成到一块集成块上.发光用的发光集成电路用基片上的磷化铟,把1.3μm带的半导体激光器和驱动此激光器的3个双极晶体管,以及光接收用的光电二极管和3个场效     

前言

<正>随着光子技术在光纤通信、微波光子学、激光雷达、量子信息处理等领域的广泛应用,光子和光电子集成的重要性日益突显,成为解决相关应用面临的体积、功耗和成本瓶颈的关键。实际上,早在20世纪60年代就提出了集成光学的概念。受到集成电路(IC)技术的启发,提出了光子集成回路(PIC)和光电集成电路(OEIC)的概念,期望通过集成技术来增强光电子器件的性能,减小体积和功耗,并提高可靠性。然而,相比于集成电路芯片的迅猛发展,光子和光电子集成由于面临材料和工艺等一系列挑战,直到近十余年才实现突破。目前,大规模光子集成技术正在逐渐走向实用化。     

光学元件

Y99-61713 99150481998年 SPIE 会议录,卷3278:集成光学器件2=1998proceedings of SPIE,Vol.3278:integrated optic devicesⅡ[会,英]/SPIE-the International Society for OpticalEngineering.—1998.—354P.(EG)本会议录报道了在1998年1月28日至30日在美国圣何塞召开的集成光学器件专题讨论会上发表的40篇论文。主要涉及光集成电路的模型设计和特性、导波调制器与开关,光电子器件与集成,集成光放大器与激光器,波导设计与制造,导波光敏传感器,以及基于硅的集成光器件诸方面内容。     

集成电路技术对通信发展的影响

首先说明晶体管和激光管的发明、微电子集成电路、光电子集成和光子集成不断快速进展的情况。于是，叙述几项重要的信息设备技术：（1）处理器、存贮器、计算机；（2）磁盘、光盘、大容量存储；（3）程控交换系统；（4）光纤固定通信网和无线移动通信网。这些重要应用的发展受到集成电路技术的深刻影响，因而能够以惊人速度持续向前跃进。     

GaAs integrated optoelectronics

Monolithic integrated optoelectronic circuits, which incorporate electronic and optical devices on the same substrate, have the advantages of smaller size, and potentially higher reliability compared with conventional hybrid circuits. In addition, significant improvements in the speed and noise performance of communication systems can be realized. This paper reviews the various elements which constitute the integrated optoelectronic circuits (IOEC's) with emphasis on the structure of GaAlAs injection lasers. Several integrated circuits on GaAs substrates are described in detail. A view of optoelectronic circuits in other III-V compounds is presented.     

精密掺杂技术的发展与应用

微电子学和光电子学的迅速发展,要求能对掺入半导体晶片中的杂质数量、深度和浓度分布进行精密控制,因此原子平面掺杂和超浅层掺杂技术已成为发展新器件的重要工艺之一。本文介绍了当前三种主要的浅层或薄层平面掺杂技术的特点,并简要论述了它们在光电子器件和集成电路中的应用。     

基于Pspice光发射机驱动电路的仿真分析

根据发光二极管（LED）和双异质结激光器（DH-LD）的Pspice等效子电路程序,将它们做成新的元件嵌入Pspice A/D 8.0电路仿真平台中。利用该平台对各种光发射机的光驱动回路进行模拟,证明用光电子器件的等效电路模型来模拟光电集成回路的可行性和便利性。     

Recent developments in silicon optoelectronic devices

Due to the rapid growth of the internet and multi-media communication networks, there are urgent needs and tremendous commercial values in the development of optoelectronics integrated circuits (OEICs). This work reviews the recent developments and the prospect of silicon-based integrated optoelectronic circuits (Si-OEICs). The technological aspects of porous silicon and oxynitride devices for integrated optoelectronic applications are discussed. Some optoelectronic devices being realized with these technologies are described. Recent achievements indicate that the present constraints for using Si-based materials in optoelectronics are mainly technological rather than physical. Once these technological difficulties are resolved, the realization and applications of Si-OEICs will grow rapidly.     

高速光器件的光集成及光电集成

本文介绍了高速激光器的现状，并综述了高速激光器的光集成和接收机的光电集成。最后，讨论了光集成和光电集居技术及今后的发展。     

Microwave photonic multichip modules

The increasing use of microwave frequencies and gigabit per second transmission rates in optical-fibre systems and the corresponding interest in using optical techniques for microwave systems are spurring the development of microwave photonic circuits. Despite a considerable investment in research and development, monolithic photonic and optoelectronic integrated circuits have not entered into widespread production. The paper illustrates that for the majority of microwave photonic applications, the multichip module approach is better suited in terms not only of performance but also of economy and of ease of manufacture. The advantages of the silicon optical bench for optoelectronic integration are discussed in depth. It is then shown how, with suitable modifications, silicon-based multichip modules can also provide interconnections to microwave devices, thus creating microwave photonic multichip modules     

微波集成电路技术—回顾与展望

半个多世纪来 ,微波电路技术经历了从分立电路、两维微波集成电路、三维微波集成电路等阶段。在回顾这一发展历程后 ,介绍多层微波集成电路和三维微波集成电路。阐述其产生背景、关键技术及发展方向。文中将涉及微加工技术以及从直流至射频的多芯片全集成新概念。瞻望二十一世纪前景。     

SOI集成光电子器件

Silicon-on-insula tor(SOI)集成光电子器件的工艺与标准CMOS工艺完全兼容,采用SOI技术可以实现低成本的整片集成光电子回路。文章回顾了近几年来SOI集成光电子器件的发展以及一些最新的研究进展。     

A three-dimensional high-throughput architecture usingthrough-wafer optical interconnect

This paper presents a three-dimensional, highly parallel, optically interconnected system to process high-throughput stream data such as images. The vertical optical interconnections are realized using. Integrated optoelectronic devices operating at wavelengths to which silicon is transparent. These through-wafer optical signals are used to vertically optically interconnect stacked silicon circuits. The thin film optoelectronic devices are bonded directly to the stacked layers of silicon circuitry to realize self-contained vertical optical interconnections. Each integrated circuit layer contains analog interface circuitry, namely, detector amplifier and emitter driver circuitry, and digital circuitry for the network and/or processor, all of which are fabricated using a standard silicon integrated circuit foundry. These silicon circuits are post processed to integrate the thin film optoelectronics using standard, low cost, high yield microfabrication techniques. The three-dimensionally integrated architectures described herein are a network and a processor. The network has been designed to meet off-chip I/O using a new offset cube topology coupled with naming and renting schemes. The performance of this network is comparable to that of a three-dimensional mesh. The processing architecture has been defined to minimize overhead for basic parallel operations. The system goal for this research is to develop an integrated processing node for high-throughput, low-memory applications