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舰用电子设备机柜热设计 总被引:1,自引:0,他引:1
电子设备机柜热设计是结构设计的一个重要内容,对提高电子设备的可靠生起着相当重要的作用。本文介绍几种常用的机柜热设计方法,着重介绍了两种适宜舰船电子设备的冷却方法:气-水混合冷却和集中供冷风法。 相似文献
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电子方舱舱内热环境仿真分析 总被引:1,自引:0,他引:1
介绍了电子方舱系统的总体布局方案,对方舱热源进行分析,提出了传热问题,并给出了解决方案。借助Icepak软件,对方舱系统舱内热环境建模,仿真分析方舱总体布局设计方式下,舱内热环境能否满足电子设备通风冷却要求,同时兼顾操作人员的热舒适性。仿真计算表明,以Icepak软件为工具开展的系统热仿真工作,对结构总体设计能够发挥较好的理论支撑与指导作用。 相似文献
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电子设备热设计、热评估实施要求 总被引:1,自引:1,他引:0
介绍了对电子设备进行热设计、热评估的必要性,指出对电子设备进行可靠性热设计,实施有效的热控制是提高设备工作可靠性的关键措施;同时简明阐述了热设计的概念和热设计的主要内容和实施要求,并介绍了热评估的必要性和对保障电子设备可靠性的实用意义。 相似文献
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为了提高机载电子设备的冷却散热性能,保证设备可靠稳定工作,采用热仿真方法,对某机载电子设备进行了热设计.根据设备结构特点,提出了多种不同的设计方案,并对其进行了对比分析.综合考虑设备散热效果及可维修性,确定了最优的设计方案,实现了对某机载电子设备的热设计.该热设计方案已随电气设计和结构设计一起通过了各项验证试验,使用情况良好,同时,也为同类型机载电子设备热设计提供了较大的参考价值. 相似文献
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一种新型无机传热元件 总被引:1,自引:0,他引:1
随着电子设备的结构越来越紧凑,组装密度越来越高,功耗越来越大,设备的散热问题越来越严重,传统的热设计技术已很难满足其要求,应积极跟踪并应用新的热设计技术,以满足现代电子设备的发展需要.对一种新型无机传热元件的工作原理进行了详细说明,对其传热效果进行了验证,给出了应用实例,可供从事军用电子设备研制的设计人员参考.该传热元件能有效解决大功率设备和密封设备的散热问题,从而确保设备工作的稳定性,提高其可靠性. 相似文献
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Legierski J. Wiecek B. 《Components and Packaging Technologies, IEEE Transactions on》2001,24(4):549-553
This paper presents simulation of new cooling fins equipped with heat pipes for high power and high temperature electronic circuits and devices. Highly conductive heat pipe provides more effective energy dissipation to the ambient. Calculated thermal resistance shows quantitatively the improvement of cooling conditions for fins with heat pipe in comparison to traditional device 相似文献
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Selected aspects of cooling technology for electrical apparatus and electronic devices are considered for the past 80 years. The emphasis is on the past 50 years. The technology has evolved to meet the challenges of microminiaturization, and heat transfer considerations are now an integral part of the design procedure for microelectronic systems. 相似文献
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电力电子装置的热分析对设备的可靠性影响不可忽略,但在研究生课程中都没有涉及,往往使得他们在毕业后工作中要重新进行学习.为此,本文从散热原理和应用于热分析的软件Flotherm两方面介绍了电力电子装置热分析的步骤,合理选择散热器及风量,籍此改善装置的工作可靠性. 相似文献
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Passive radiative technology enables sustainable cooling by synchronously emitting heat and reflecting solar light without any energy consumption. However, the consumption of non-recyclable and non-renewable radiative materials in large quantities may eventually cause resource waste and environmental issues. Herein, reconfigurable and renewable nano-micro-structured plastics for future eco-friendly and large-scale radiative cooling applications are developed. The plastics are facilely prepared from a locally confined polymerization method, which not only enables the customization of nano/micro-structures for thermal emission and sunlight reflection but also provides physically cross-linked networks for damage repairing, shape reconfiguration, and recyclable usage. Compared with traditional plastics applied on electronic devices, the nano-micro-structured plastic achieves much higher cooling efficiency with a temperature drop of 8.6 °C on electronic circuits and 7.5 °C cooling improvements under sunlight. With the excellent cooling performance and the recycling potential, the nano-micro-structured plastics open an environmentally sustainable pathway to address the thermal issues encountered by electronic devices and challenges of global warming. 相似文献
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The small physical size of electronic equipment, space limitation for installing air-cooling systems and high heat flux produced from a single chip have attracted a great deal of interest in more efficient heat dissipation equipment such as high-performance liquid cooling systems and mini-rectangular fin heat sinks. In this study, the influence of nanofluids on the performance of heat sink for CPU cooling is investigated experimentally and numerically. The former is carried out for water and nanofluid CuO-water at two solid concentrations of 0.86 and 2.25 vol.%. While in the latter, numerical simulations are validated for the laminar flow model with the application of the commercial package ANSYS Fluent 13. For the investigated range of mass flow rate and heat load (115 and 130 W), up to 7.7% of thermal conductance improvement is observed in case of nanofluids in comparison to water. The results of this study pave the way for more credible designs of cooling systems of electronic devices to promote a high-performance and longer life cycle. 相似文献
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现场可编程门阵列(Field programmable gatearray,FPGA)是一种可编程逻辑器件,设计方便、便于修改、功能便于扩展,极大地提高了电子系统设计的灵活性和通用性,被广泛地应用在通信、航空航天和汽车电子等诸多领域。本文分析FPGA结构原理的同时,对FPGA在航天及空间电子系统中的应用进行了总结。指出了航天应用对FPGA的可靠性要求,对相关可靠性设计技术进行了总结,并对航天应用FPGA及其可靠性设计技术的发展进行了展望。 相似文献