一种动态调节前沿消隐电路

基于原边反馈反激变换器结构,提出了一种适用于PWM、PFM调节模式的动态调节前沿消隐电路。首先,当系统工作在PWM或PFM模式时,分别检测输出电流信息和系统工作频率,产生动态调节的前沿消隐信号,避免了辅助绕组高频振荡导致的膝点电压误采样。其次,通过动态调节前沿消隐时间,减小了全负载范围内膝点采样电路的功耗。设计的原边峰值电流采样电路能获得输出电流信息和系统工作频率信息,避免了反激变换器工作条件变化时前沿消隐时间非线性调节导致的膝点电压误采样。基于0.18 μm BCD工艺对电路进行设计。仿真结果表明,该电路产生的动态调节前沿消隐时间误差的最小值为4%。     

一种基于COT控制的快速瞬态响应Buck变换器

设计了一种基于TSMC 0.18 μm CMOS工艺的快速瞬态响应Buck型变换器。基于电流模COT架构的Buck型变换器,结合电容电流采样电路和负载电流调节器,设计了一种新颖的瞬态增强电路,对负载电流进行补偿,有效地减小了恢复时间,提高了输出电压精度。仿真结果表明,没有瞬态增强电路时,负载电流从0 A跳变到3 A,电流变化率为3 A/10 ns,下跌电压为166.9 mV,恢复时间为5.8 μs；加入瞬态增强电路后,下跌电压变为21 mV,恢复时间变为0.5 μs。没有瞬态增强电路时,负载电流从3 A跳变到0 A,电流变化率为3 A/10 ns,过冲电压为73 mV,恢复时间为3.3 μs；加入瞬态增强电路后,过冲电压变为36 mV,恢复时间变为0.6 μs。     

基于自适应频率DPWM的数字控制Buck变换器

为了用于固定频率电压模PWM控制,提出了一种基于自适应频率DPWM的数字控制Buck变换器。在负载阶跃响应时,DPID的输出值发生改变,以调制PWM信号的占空比;DPWM频率根据输出误差值而变化,提高了PWM信号的调制强度。通过小数分频和检测ADC输出,实现了DPWM频率的变化。采用分段调节的方式,有效改善了电路的瞬态响应。该Buck变换器基于0.18 μm CMOS工艺设计。仿真结果表明,当负载电流在10~20 A范围变化时,过冲电压降低了5 mV,恢复时间缩短了10.5 μs,下冲电压降低了8 mV,恢复时间缩短了9.6 μs。     

一种瞬态增强的无片外电容LDO设计

针对无片外电容型低压差线性稳压器(LDO)瞬态响应差的问题,基于40 nm CMOS工艺设计了一种带瞬态负载变化感知的无片外电容型LDO电路。采用有源前馈频率补偿,实现了电路稳定;瞬变检测电路感应负载的变化,为功率管栅极提供充、放电通路,减弱了输出电压波动。仿真结果表明,负载电流在0~100 mA范围内,该LDO的输出过冲电压和下冲电压分别为100 mV和140 mV,稳定时间在1 μs以内。全负载电流范围内,瞬态性能大幅提升。     

一种快速瞬态响应的无片外电容型LDO

设计了一种快速瞬态响应的无片外电容型LDO。采用高增益高带宽的超级跨导结构(STC)的误差放大器,利用动态偏置技术与电容耦合技术,极大地增强了摆率。引入额外的快速响应环路,进一步提升了瞬态响应速度。基于0.18 μm CMOS工艺进行设计。结果表明,该LDO的最低供电电压为1 V,漏失电压仅为200 mV,可提供最大100 mA的负载电流,能在最大输出电容为100 pF、最低负载为50 μA的条件下保证电路稳定。负载电流在0.5 μs内由50 μA跳变至100 mA时,LDO输出导致的过冲电压和下冲电压分别为200 mV和306 mV。     

带自适应斜坡补偿的COT控制Buck变换器

提出了一种采用自适应斜坡补偿(ARC)的恒定导通时间控制Buck变换器。引入了两个斜坡电压,实现对电感电流下降斜率的检测;通过负反馈环路调节斜坡斜率,使斜坡斜率跟随电感电流下降斜率的变化。最终斜坡补偿带来的额外极点被固定下来,以便于补偿设计。在此基础上,引入瞬态增强电路,提高了负载阶跃响应速度。在5 V输出电压下,负载从3 A到100 mA阶跃时,输出上冲电压减小了150 mV,恢复时间缩短了10 μs。负载从100 mA到3 A阶跃时,输出下冲电压减小了130 mV,恢复时间缩短了12 μs。     

适用于高频开关芯片的快速瞬态响应LDO设计

设计了一种片外大电容快速瞬态响应低压差线性稳压器。该LDO电路基于跨导线性结构设计,在输出级引入推挽结构,有效地减小过冲的幅值和恢复时间,提高了LDO的瞬态响应速度;利用浮动缓冲器驱动功率管,有效地提高了LDO的电流效率;采用动态零点补偿技术,保证了LDO在全负载范围内的环路稳定性。该LDO电路基于0.35μm BCD工艺设计与仿真验证。结果表明,在1.2 V~3 V输入电压范围,LDO的输出电压为1 V,静态电流约为50μA,可提供0~300 mA的负载。在上升下降沿为500 ns、幅度为300 mA、轻载持续时间为50μs的负载瞬态跳变下,过冲和下冲均小于20 mV。电路满足高频负载跳变的应用需求。     

一种高稳定性高精度低压差线性稳压器的分析与设计

提出了LDO,其基于缓慢滚降式频率补偿方法,通过在电路中引入三个极零对（极零对的产生没有增加静态功耗）,不仅克服了常规LDO不能使用低等效串联电阻、低成本陶瓷输出电容的缺点,而且确保了系统在整个负载和输入电压变化范围内稳定工作。由于LDO通常给高性能模拟电路供电,因此其输出电压精度至关重要； 而该补偿方法能满足高环路增益、高单位增益带宽的设计要求,从而大幅提高LDO的精度，该LDO基于0.5μm CMOS工艺实现，后仿结果表明,即使在低压满负载条件下,其开环DC增益仍高于70dB,满载时单位增益带宽可达3MHz,线性调整率和负载调整率分别为27μV/V和3.78μV/mA,过冲和欠冲电压均小于30mV,负载电流为150mA时的漏失电压（dropout电压）仅为120mV。     

一种高稳定性高精度低压差线性稳压器的分析与设计

提出了LDO,其基于缓慢滚降式频率补偿方法,通过在电路中引入三个极零对(极零对的产生没有增加静态功耗),不仅克服了常规LDO不能使用低等效串联电阻、低成本陶瓷输出电容的缺点,而且确保了系统在整个负载和输入电压变化范围内稳定工作.由于LDO通常给高性能模拟电路供电,因此其输出电压精度至关重要;而该补偿方法能满足高环路增益、高单位增益带宽的设计要求,从而大幅提高LDO的精度.该LDO基于0.5μm CMOS工艺实现.后仿结果表明,即使在低压满负载条件下,其开环DC增益仍高于70dB,满载时单位增益带宽可达3MHz,线性调整率和负载调整率分别为27μV/V和3.78μV/mA,过冲和欠冲电压均小于30mV,负载电流为150mA时的漏失电压(dropout电压)仅为120mV.     

一种1.2V,80mA,5μF快速瞬态响应、高稳定性LDO的设计

基于上华0.5μm工艺,设计了输入电压为1.5V,输出电压为1.2V,最大输出电流为80mA,用于DC/DC里的CMOS低压差线性稳压器(Low-dropout regulator),作为带隙基准输出端的后续模块,以达到滤波和提高参考电压精度的目的。提出了一种补偿网络,可以保证负载电流发生变化时,相位裕量不发生变化;在补偿网络的基础上添加一个感应电容能够快速跟踪极点的变化,从而保证在负载电流跳变瞬间稳定性保持不变,防止了输出电压发生振荡的情形。此外,设计了一种瞬态响应提高电路结构来改善负载瞬态响应。仿真结果表明,在tt corner下该LDO线性稳压器在负载电流为1mA和80mA时的相位裕度均为83°,环路增益为80dB,流片测试结果显示过冲电压和欠冲电压均不超过100mV。     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.     

GaAsSb/InAlAs PA DHBTs Grown by Production MBE

The epi material growth of GaAsSb based DHBTs with InAlAs emitters are investigated using a 4 × 100mm multi-wafer production Riber 49 MBE reactor fully equipped with real-time in-situ sensors including an absorption band edge spectroscope and an optical-based flux monitor. The state-of-the-art hole mobilities are obtained from 100nm thick carbon-doped GaAsSb. A Sb composition variation of less than ± 0.1 atomic percent across a 4 × 100mm platen configuration has been achieved. The large area InAlAs/GaAsSb/InP DHBT device demonstrates excellent DC characteristics,such as BVCEO＞6V and a DC current gain of 45 at 1kA/cm2 for an emitter size of 50μm × 50μm. The devices have a 40nm thick GaAsSb base with p-doping of 4. 5 × 1019cm-3 . Devices with an emitter size of 4μm × 30μm have a current gain variation less than 2% across the fully processed 100mm wafer. ft and fmax are over 50GHz,with a power efficiency of 50% ,which are comparable to standard power GaAs HBT results. These results demonstrate the potential application of GaAsSb/InP DHBT for power amplifiers and the feasibility of multi-wafer MBE for mass production of GaAsSb-based HBTs.     

Technology innovation and process integrations for sub-100nm gate patterning

This paper presents a brief overview of the Applied Centura(R)DPS(R)system,configured with silicon etch DPS Ⅱ chamber, with emphasis on discussing tuning capability for CD uniformity control. It also presents the studies of etch process chemistry and film integration impact for an overall successful gate patterning development. Discussions will focus on resolutions to key issues, such as CD uniformity, line-edge roughness, and multilayer film etching integration.     

White organic light-emitting devices based on fac tris（2- phenylpyridine） iridium sensitized 5,6,11,12-tetraphenylnap -hthacene

We have fabricated the white organic light-emitting devices （WOLEDs） based on 4,4＇ -bis（2,2 -diphenyl vinyl）-1,1＇ - biphenyl （DPVBi） and phosphorescence sensitized 5,6,11,12,-tetraphenylnaphthacene （rubrene）. The device structure is ITO/2T-NATA （20 nm）/NPBX （20 nm）/CBP： x%Ir（ppy）3：0.5% rubrene （8 nm）/NPBX （5 nm）/DPVBi （30 nm）/Alq（30 nm）/LiF（0.5 nm）/A1. In the devices, DPVBi acts as a blue light-emitting layer, the rubrene is sensitized by a phosphorescent material, fac tris （2-phenylpyridine） iridium [Ir（ppy）3], acts as a yellow light-emitting layer, and N,N＇ -bis- （1-naphthyl）- N,N＇ -diphenyl -1, 1＇ -biphenyl-4,4＇ -diamine （NPBX） acts as a hole transporting and exciton blocker layer, respectively. When the concentration of Ir （PPY）3 is 6wt%, the maximum luminance is 24960 cd/m^2 at an applied voltage of 15 V, and the maximum luminous efficiency is 5.17 cd/A at an applied voltage of 8 V.     

Complete approach to automatic identification and subpixel center location for ellipse feature

To meet the need of automatic image features extraction with high precision in visual inspection, a complete approach to automatic identification and sub-pixel center location for similar-ellipse feature is proposed. In the method, the feature area is identified automatically based on the edge attribute, and the sub-pixel center location is accomplished with the leastsquare algorithm. It shows that the method is valid, practical, and has high precision by experiment. Meanwhile this method can meet the need of instrumentation of visual inspection because of easy realization and without man-machine interaction.     

小角度扩展相关性近似算法分析

本论文提出一种在多天线MIMO信道相关性建模中小角度扩展近似理论算法,并应用于分析MIMO系统性能。分析中分别对三种不同角能量分布情况下的空间相关性研发快速近似计算法,并同时提出双模(Bi-Modal)角能量分布情况下的近似运算。通过分析这些新方法的近似效率,可以得到计算简单、复杂度低、而且符合实际的MIMO相关信道矩阵,对系统级的快速高效计算法的研究和系统级的评估以及误差分析具有重要的意义。     

Noise character analysis and the restraint of self-pulsation laser diodes

We calculate the Langevin noise sources of self-pulsation laser diodes, analyze the effects of active region noise and saturable-absorption region noise on the power fluctuation as well as period fluctuation, and propose a novel method to restrain the noise effects. A visible SIMULINK model is established to simulate the system, The results indicate that the effects of noise in absorption region can be ignored; that with the increase of DC injecting current, the noise effects enhance power jitter, and nevertheless, the period jitter is decreased; and that with external sinusoidal current modulating the self-pulsation laser diode, the noise-induced power jitter and period jitter can be suppressed greatly. This work is valuable for clock recovery in all-optical network.