有机硅改性环氧树脂增韧研究进展

综述了有机硅改性环氧树脂增韧研究的方法、机理；主要从两个方面介绍了有机硅改性环氧树脂增韧的研究现状：硅橡胶改性环氧树脂增韧研究、聚硅氧烷改性环氧树脂增韧研究，并介绍了近期进展。     

环氧树脂增韧技术研究进展及发展方向

本文回顾了环氧树脂增韧改性的常用方法，详细介绍了橡胶类弹性体、热塑性树脂、热致性液晶聚合物、刚性粒子等环氧树脂的增韧改性方法及其增韧机理，并列举了最新研究情况。还对环氧树脂改性的发展方向进行了展望。     

环氧树脂的弹性体增韧改性研究

综述了环氧树脂的增韧改性技术、着重讨论了弹性体增韧环氧树脂的增韧机理和发腱现状，并简要介绍了热致液晶聚合物、柔性链段固化剂和互穿网络结构等环氧树脂增韧改性新技术。     

有机硅改性环氧树脂

有机硅改性环氧树脂是近年来发展起来的既能降低环氧树脂内应力,又能增加环氧树脂韧性、耐高温性等性能的有效途径。二者相容性是有机硅改性环氧树脂的关键。本文综述了有机硅改性环氧树脂的各种改性方法、机理及研究进展。     

环氧树脂体系阻燃改性研究进展

介绍了阻燃改性环氧树脂常用方法，讨论了各阻燃体系的阻燃机理，并对环氧树脂阻燃技术作了展望。     

碳纤维/环氧树脂复合材料的改性及改性机理

介绍了碳纤维/环氧树脂复合材料中碳纤维的增强机理.综述了纳米材料、聚合物对碳纤维/环氧树脂复合材料的改性进展,并总结了相应的改性机理.探索新型柔和的碳纤维表面处理技术以及对碳纤维表面接枝将是碳纤维/环氧树脂复合材料改性的发展方向.     

氰酸酯树脂在高性能印刷电路板中的应用概况

综述了氰酸酯树脂及氰酸酯改性环氧树脂在高性能印刷电路板中的应用。论述了氰酸酯改性环氧树脂的机理与性能。以改性树脂基体制备的覆铜板介电性能明显得到提高，能满足高频使用的条件。     

有机硅改性环氧树脂的研究进展

综述了有机硅改性环氧树脂的主要方法及增韧机理,并展望了有机硅改性环氧树脂的发展趋势。     

2,6-萘二羧酸改性双酚A环氧树脂的性能

用2,6-萘二羧酸(NDCA)对双酚A环氧树脂进行改性,研究了NDCA加入量对双酚A环氧树脂黏度、耐热性和力学性能的影响。结果表明,NDCA能提高环氧树脂的储能模量和玻璃化转变温度,玻璃化转变温度最高达到113℃。NDCA的质量分数小于0.5%时,改性环氧树脂的断裂伸长率随着NDCA加入量的增加逐渐提高,最高达12%。结合傅立叶变换红外光谱测试,提出了NDCA改性双酚A环氧树脂的机理,并对改性环氧树脂性能增强的机理进行了探讨。     

纳米材料增韧改性环氧树脂研究进展

综述了近年来几种主要的纳米材料增韧改性环氧树脂的研究现状,介绍了纳米材料增韧环氧树脂的机理,同时对纳米材料增韧改性环氧树脂发展进行了展望。     

环氧树脂增韧改性的研究进展

系统地介绍了环氧树脂的增韧改性方法,对橡胶增韧、热塑性树脂增韧、互穿网络结构增韧以及树枝形分子增韧环氧树脂等的增韧机理进行了分析,重点介绍了“柔性链段”增韧机理和方法。     

环氧化硅油改性邻甲酚醛环氧树脂的研究

采用侧基环氧化硅油(ES)及其改性物(PSA)改性邻甲酚醛环氧树脂(ECN),制备出一系列可用于电子封装等具有高韧性高耐热性的环氧基料。通过对固化物的冲击强度、拉伸强度、断裂伸长率和玻璃化转变温度(Tg)以及断裂面形态的测定,探讨了改性方法、有机硅组成与含量等对改性材料性能的影响。结果表明,用有机硅改性ECN后,其韧性和耐热性均有不同程度的提高,且环氧值高的ES和PSA的改性效果较好。其中环氧树脂经10份(质量份数,下同)ES-16或10份PSA-16改性后,韧性和耐热性均提高,符合电子封装等材料的改性要求,后者的耐热效果更为显著,Tg达183.46℃,比未改性环氧树脂提高了近20℃。     

基体种类对CTBN改性环氧树脂结构和性能的影响

研究了ＣＴＢＮ对不同种类的环氧树脂（Ｅ－５１、Ｆ－５１）力学性能的影响,通过扫描电镜观察了２种增韧体系的微观结构形态,并探讨了２种增韧体系的微观结构形态与力学性能间的关系。     

一种新型改性胺固化剂的研制

用多元胺和缩水甘油醚、丙烯腈等进行改性反应,获得一种高性能改性胺固化剂。     

环氧树脂体系阻燃技术的发展

阐述了改善热固性环氧树脂体系阻燃性能的目的和意义，介绍了环氧树脂体系的阻燃方法。以气相机理和凝聚相机理为基础，讨论了几种常用阻燃剂的阻燃机理。分析了环氧树脂体系阻燃技术的研究现状，指出环氧树脂阻燃技术将向着安全化、复合功能化、新技术化和研究系统化的趋势发展。     

注射环氧树脂的成型工艺性能研究

本文用环己烷衍生物作改性剂合成了一种改性的ＢＰＡ型环氧树脂,讨论了该改性组分对树脂应用性能的影响,由于环己烷衍生物结构的引入,使得树脂粘度和固化物线膨胀系数降低,树脂胶化时间缩短。     

Silyl-Crosslinked Urethane Elastomer Modifying Epoxy Resin: I. Morphological Studies

Silyl-crosslinked urethane elastomer modifying epoxy resin has drawn much interest. Here triethoxysilyl-terminated polycaprolactone elastomer (PCL-TESi) modifying diglycidylether of bisphenol A epoxy resins (DGEBA) system was chosen; then the effect of the type of curing agent on the phase structure of the studied system was investigated. The modified systems with different phase structures were obtained by varying the formulations of the curing agents. It was experimentally shown that the crosslinked density was greatly increased by the addition of an aminosilane curing agent (KBE-9103). And the SEM and TEM analysis of the cured system showed that the addition of KBE-9103 increased the compatibility between the PCL-TESi and DGEBA, but decreased the ductility of the systems. The TEM results indicated that the addition of too much of the KBE-9103 made the resulting silicone particles coagulate with each other. The state of phase separation from the TEM in the cured system was explained theoretically. These considerations would serve the deeper studies of the mechanism of silyl-crosslinked urethane elastomer modifying epoxy resin in the future.     

高性能环氧树脂基体的发展

综述了高性能环氧树脂的制备方法和性能。介绍了几种高性能的环氧树脂固化体系 ,新型的耐湿热性的环氧树脂 ,氰酸酯改性环氧树脂 ,液晶环氧树脂 ,双马来酰亚胺改性环氧树脂等     

电子聚合物用重芳烃环氧树脂的研究进展

综述了近年来电子聚合物用重芳烃环氧树脂(包括萘基环氧树脂、含有蒽环的环氧树脂及含有芘环的环氧树脂)的结构、性能、合成路线以及改性研究进展。重芳烃环氧树脂具有良好的耐热、耐湿性,极具发展潜力。     

Morphology of epoxy resin modified with silyl‐crosslinked urethane elastomer

Silyl‐crosslinked urethane elastomer modifying epoxy resin has drawn much interest. Here the triethoxysilyl‐terminated polycaprolactone elastomer (PCL‐TESi) modifying diglycidylether of bisphenol A epoxy resins (DGEBA) system was chosen, and then the effect of the type of curing agent on the phase structure of the studied epoxy resin system was investigated. The modified systems were obtained with different phase structures by varying the formulations of the curing agent. It was experimentally shown that with the addition of aminosilane (KBE‐9103), the crosslinked density was greatly increased. The cured system also showed from SEM and TEM analysis that addition of KBE‐9103 increased the compatibility between the PCL‐TESi and DGEBA, which made the ductility of the system decrease, but also indicated from TEM that addition of much KBE‐9103 made the reacted silicone particles coagulate each other. The state of phase separation from TEM in the cured system was theoretically explained. These would serve the deeper studies of the mechanism of silyl‐crosslinked urethane elastomer modifying epoxy resin in the future. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 611–619, 2005