树脂传递模塑充填过程的数值模拟

树脂传递模塑成型（RTM）工艺是在一定温度及压力下把低黏度的树脂注入预先置有增强纤维的模具中,然后固化成型的一种复合材料液体成型方法。本文建立了RTM工艺充模过程的数学模型,并采用有限元/控制体积法实现了对复杂薄壁构件的充填模式、压力场和速度场的模拟。     

深亚微米抗辐照PDSOI nMOSFET的热载流子效应

基于中国科学院微电子研究所开发的0.35 μm SOI工艺,制备了深亚微米抗辐照PDSOI H型栅nMOSFET.选取不同沟道宽度进行加速应力实验.实验结果表明,热载流子效应使最大跨导变化最大,饱和电流变化最小,阈值电压变化居中.以饱和电流退化10%为失效判据,采用衬底/漏极电流比率模型,对器件热载流子寿命进行估计,发现同等沟道长度下,沟道越宽的器件,载流子寿命越短.     

A total dose radiation model for deep submicron PDSOI NMOS

In most of the total dose radiation models,the drift of the threshold voltage and the degradation of the carrier mobility were only studied when the bulk potential is zero.However,the measured data indicate that the total dose effect is closely related to the bulk potential.In order to model the influence of the bulk potential on the total dose effect,we proposed a macro model.The change of the threshold voltage,carrier mobility and leakage current with different bulk potentials were all modeled in this model,and the model is well verified by the measured data based on the 0.35μm PDSOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences,especially the part of the leakage current.     

2.5″80MB硬盘MD2080故障维修

MD2080硬盘驱动器主轴马达起动速度不正常。 故障现象:MD2080硬盘驱动器主轴马达不能起动,或者能起动但速度不正常。 维修过程如下: 1、加电,检测JP1的41脚的电压是否为5V,如果无5V电压,则检查电源。 2、检测Q9的1脚、U19的15脚的电压是否为5V,如果无5V,则进行下列步骤:     

90 nm PDSOI MOSFET热阻研究

对90 nm PDSOI MOSFET的热阻进行了提取与研究。以H型栅MOSFET为研究对象,将源体二极管作为温度敏感器,通过测量源体结电流与器件温度的关系以及源体结电流与器件功率的关系,获得MOS器件功率与器件温度的关系,从而获取MOS器件热阻值。实验结果表明,该工艺下PMOS器件的热阻比NMOS器件大,其原因是PMOS体区掺杂浓度比NMOS高,而掺杂浓度越高,导热性越差,热阻就越大;H型栅器件的归一化热阻随沟道宽度的增加而增大,其原因是随着沟道宽度的增加,体引出区域对器件导热的贡献变小;热阻随环境温度的上升而减小,其原因是二氧化硅埋氧层的导热率随温度的升高而增大。     

SOI器件的增强短沟道效应模型

为了探索SOI器件总剂量辐照后阈值电压漂移量和沟道长度的关系,利用器件模拟软件ISE TCAD,对不同沟道长度的PDSOI NMOS管进行了总剂量辐照模拟.模拟结果表明,随着沟道长度的减小,背沟道MOS管阈值电压漂移越来越大,并且漂移量和辐照偏置密切相关,称此效应为SOI器件的增强短沟道效应.以短沟道效应理论为基础对此效应的机理进行了解释,并以短沟道效应模型为基础对此效应提出了一个简洁的阈值电压漂移模型,通过对ISE模拟结果进行曲线拟合对所提出的模型进行了验证.     

一种新型隧穿场效应晶体管

提出了一种新型隧穿场效应晶体管(TFET)结构,该结构通过在常规TFET靠近器件栅氧化层一侧的漏-体结界面引入一薄层二氧化硅(隔离区),从而减小甚至阻断反向栅压情况下漏端到体端的带带隧穿(BTBT),减弱TFET的双极效应,实现大幅度降低器件泄漏电流的目的。利用TCAD仿真工具对基于部分耗尽绝缘体上硅(PDSOI)和全耗尽绝缘体上硅(FDSOI)的TFET和新型TFET结构进行了仿真与对比。仿真结果表明,当隔离区宽度为2 nm,高度大于10 nm时,可阻断PDSOI TFET的BTBT,其泄漏电流下降了4个数量级;而基于FDSOI的TFET无法彻底消除BTBT和双极效应,其泄漏电流下降了2个数量级。因此新型结构更适合于PDSOI TFET。     

深亚微米PDSOI的热阻提取

Deep submicron partially depleted silicon on insulator (PDSOI) MOSFETs with H-gate were fabricated based on the 0.35 μm SOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences. Because the self-heating effect (SHE) has a great influence on SOI, extractions of thermal resistance were done for accurate circuit simulation by using the body-source diode as a thermometer. The results show that the thermal resistance in an SOI NMOSFET is lower than that in an SOI PMOSFET; and the thermal resistance in an SOI NMOSFET with a long channel is lower than that with a short channel. This offers a great help to SHE modeling and parameter extraction.     

基于Monte-Carlo的EV-DO规划仿真算法

cdma2000等3G无线通信网络具有相当的复杂性,为了在节约运营商成本的前提下使新建3G网络的覆盖和容量等性能最优,需要专门的软件来进行无线网络规划仿真。本文指出无线网络规划仿真属于静态系统级仿真,介绍了如何利用Monte-Carlo仿真方法实现cdma20001xEV-DO系统的规划仿真,并给出了规划仿真算法的具体流程。通过对算法仿真结果的分析证明了规划仿真算法的正确性和实用性。该算法便于计算机实现,能够用于实际的无线网络规划仿真。     

深亚微米部分耗尽SOI MOSFETs STI应力效应研究

The STI stress effect is investigated based on the 0.13 m SOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences（IMECAS）. It shows that the threshold voltage and mobility are all affected by the STI stress. The absolute value of the threshold voltage of NMOS and PMOS increased by about 10%, the saturation current of NMOS decreases by about 20%, while the saturation current of PMOS increases by about 20%. It is also found that the lower temperature enhances the STI stress and then influences the device performance further. Then a macro model for this effect is proposed and is well verified.