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基于 CPU 和 DDR 芯片的 SiP 封装可靠性研究 总被引:1,自引:1,他引:0
利用 Abaqus 有限元分析方法分析了温度循环条件下 CPU 和 DDR 双芯片 SiP 封装体的应力和应变分布。比较了相同的热载荷下模块尺寸以及粘结层和塑封体的材料属性对 SiP 封装体应力应变的影响。结果表明,底层芯片、粘结层和塑封体相接触的四个边角承受最大的应力应变。芯片越薄,SiP 封装体所承受的应力越大;粘结层越薄,SiP 封装体所承受的应力越小。塑封体的材料属性比粘结层的材料属性更显著影响 SiP 封装体应力应变,当塑封体的热膨胀系数或杨氏模量越大时,SiP 封装体所受应力也越大。 相似文献
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在真空封装的MEMS传感器中,真空腔内部材料的释气是引起微腔体真空度变化的关键因素,而封装中使用较为普遍的环氧粘结材料因其易吸水的特性成为材料释气的最主要来源。真空封装内部材料释放出水汽,造成内部真空度的变化,从而直接影响产品的质量,为了探究影响MEMS传感器微腔体真空度的变化因素,以环氧粘结材料为例,研究其在不同温度下的扩散释气特性,结合菲克扩散模型,建立了环氧粘结材料的释气速率随时间变化的理论模型。通过对实验数据进行仿真验证,利用MATLAB软件对实验数据进行拟合,对比模型的拟合结果与实验数据的计算结果,相对误差<5%。研究结果表明,115℃下建立的理论模型与真实的释气模型吻合度较高,当温度不变时,环氧粘结材料的释气速率随时间的变化不断减小;同时,随着温度的升高,释气速率随时间的变化呈指数衰减趋势。 相似文献
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混合电路的热耗散受散热结构、封装结构、基片材料、环境和其他因素的影响,也与电路耗散的功率值有关。用不同尺寸的电阻器和电路基片的面积比值来联系功率密度和温升,可预测电阻和基片能承受的温度极限。 相似文献
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电子封装技术和封装材料 总被引:17,自引:0,他引:17
本文介绍了电子封装的各种类型,综述了电子封装技术与封装材料的现状及发展趋势,重点讨论了高热导AlN基片金属化及AlN-W多层共烧工艺。 相似文献
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陶瓷材料具有优良的综合特性,被广泛应用于高可靠微电子封装.陶瓷倒装焊封装的特殊结构使得对其进行失效分析相较其他传统封装形式更为困难.针对一款在可靠性试验中发生开路的高密度陶瓷倒装焊封装器件,制定了一套从非破坏性到破坏性的试验方案对其进行分析.通过时域反射计(TDR)测试排除了基板内部失效的可能性,通过X射线(X-ray)检测、超声扫描显微镜(SAM)和光学显微分析初步断定失效位置,并最终通过扫描电子显微镜和X射线能谱仪实现了对该器件的准确的失效定位,确定失效位置为基板端镀Ni层.该失效分析方法对其他陶瓷倒装焊封装的失效检测及分析有一定的借鉴意义. 相似文献
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Itagaki M. Amami K. Tomura Y. Yuhaku S. Ishimaru Y. Bessho Y. Eda K. Ishida T. 《Advanced Packaging, IEEE Transactions on》1999,22(3):366-371
A new chip scale package (CSP) using an organic laminated substrate called μCSP was developed, which was fabricated using ALIVH substrate as a interposer and stud-bump-bonding (SBB) flip-chip technology. The ALIVH substrate is a multilayered organic substrate with inner via holes in any layer. The newly developed CSP-L using ALIVH substrate realized a miniaturization of its package size to the same as a CSP using a ceramic substrate (CSP-C). In order to perform the SBB flip-chip bonding onto the ALIVH substrate, an excellent coplanarity of the substrate surface was required. The required coplanarity was obtained using a fixture during the SBB flip-chip bonding process. The first-level packaging reliability and the second-level packaging reliability onto ALIVH mother board were evaluated. The resulting reliabilities were good enough to apply to practical use 相似文献
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Royter Y. Furuta T. Ksdama S. Sahri N. Nagatsuma T. Ishibashi T. 《Electron Device Letters, IEEE》2000,21(4):158-160
Hybrid packaging techniques, in which the device substrate is different from the package substrate, and wire bonding or solder interconnections are used, are inadequate for ultrahigh-speed (>100 GHz) wideband applications. By employing wafer-bonding techniques, an integrated packaging (IP) technology was developed, in which devices are fabricated directly on the package substrate, and the interconnections are made as a part of the device fabrication process. This IP process was used to fabricate uni-traveling-carrier photodiodes (UTC-PD's) integrated with millimeter-wave coplanar waveguides (CPW) on package compatible sapphire with high yield. The performance of wafer-bonded UTC-PD's with 3-dB bandwidth of 102 GHz was similar to that of conventional devices, and the CPW's exhibited low dispersion 相似文献
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高压(HX)倒装LED是一种新型的光源器件,在小尺寸、高功率密度发光光源领域有广泛的应用前景.设计了4种不同工作电压的高压倒装LED芯片,进行了流片验证,并对其进行了免封装芯片(PFC)结构的封装实验,在其基础上研制出一种基于高压倒装芯片的PFC-LED照明组件.建立了9V高压倒装LED芯片、PFC封装器件及照明组件的模型,利用流体力学分析软件进行了热学模拟和优化设计;利用T3Ster热阻测试分析仪进行了热阻测试,验证了设计的可行性.结果表明,基于9V高压倒装LED芯片的PFC封装器件的热阻约为0.342 K/W,远小于普通正装LED器件的热阻.实验结果为基于高压倒装LED芯片的封装及应用提供了热学设计依据. 相似文献
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High frequency microelectronic and optoelectronic device packaging requires the use of substrate and encapsulation materials having a low dielectric constant, low dielectric loss and high volume resistivity. Most packaging materials are polymer-ceramic composites. A clear understanding of the broadband dielectric properties of composite materials is thus of great current importance for the effective development of high frequency packaging materials and optimized package design. Toward this goal, a general framework for understanding the dielectric properties of packaging materials was recently developed in which the dielectric constant of polymer-ceramic composite materials is characterized by the electrical properties of the polymer phase, the filler phase and an interphase region within the composite system. However, for this framework to be a viable tool for tailoring the dielectric properties of packaging materials, one must understand the dielectric properties of the polymer-filler interphase region, which represents a region of polymer surrounding and bonded to the surface of each filler particle having unique dielectric and physical characteristics. This work presents a model to explain and predict the dielectric properties of the composite interphase region based on dipole polarization theory. 相似文献
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Xue-ren Zhang Tong Yan Tee Jing-en Luan 《电子与封装》2006,6(2):10-15,4
<正>Packaging of MEMS ( micro-electro-mechanical system ) devices poses more challenges than conventional IC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A Land Grid Array ( LGA ) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure, the packaging effect on accelerometer signal performance is well controlled. 相似文献
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The development of high-power light-emitting diode (LED) devices has been bedeviled by the reliability problems. And most reliability issues are caused by the packaging materials rather than the chips. However, which packaging material is the most influential remains unrevealed. To answer this question, a statistical method was introduced in this paper. Optical simulations were conducted to calculate the optical output power of LED package according to the orthogonal experimental design. Range and variance analyses were carried out to determine the significance of the relevant factors on the LED's light output. The results showed that the dome lens among the non-luminescent packaging materials had the most significance in affecting the light output. It is concluded that this method is useful in detecting the most significant part of LED packaging materials during the development of new packaging structures and is beneficial for enhancing the whole reliability of LED package effectively. 相似文献