一种超低功耗5 GHz双模预置分频器

介绍了一种改进型的超高速、低功耗双模预置分频器(÷64/65、÷128/129)。该预置分频器采用0.35μm BiCMOS工艺制作,在3.5 V电源电压下最高工作频率达5 GHz,电源电流为4mA,电源电压3.3 V时最高工作频率达4.8 GHz。预置分频器工作在0.5~5 GHz频率范围内输入灵敏度小于-20 dBm,工作在-55~125℃温度范围,最高频率达4.5 GHz。     

基于90nm CMOS工艺的12GHz二分频器

采用90 nm CMOS工艺,实现了一个基于电流模式逻辑的12 GHz二分频器.该分频器具有很宽的锁定频率范围(1～12 GHz),在输入信号频率为8 GHz时,输入灵敏度达到-30 dBm.分频器工作在1.2 V电源电压下,消耗的电流大约为1.5 mA.给出了该设计的后仿真结果.     

16 GHz CMOS 4:1分频器

采用TSMC 1.18 μm标准CMOS工艺实现了一种4:1分频器.测试结果表明,电源电压1.8 V,核心功耗18 mW.该分频器最高工作频率达到16 GHz.当单端输入信号为-10 dBm时,具有5.8 GHz的工作范围.该分频器可以应用于超高速光纤通信以及其它高速数据传输系统.     

5 GHz 0.18-μm CMOS 可编程分频器

提出了一种2.4GHz ZigBee 应用的可编程分频器,其分频模值在2403-2480之间变化。该分频器基于双模分频器和吞咽计数器架构,功耗和面积得到了有效降低。芯片采用0.18-μm CMOS混合信号工艺实现,当输入信号达到7.5dBm时,分频器可正常工作的频率范围覆盖1-7.4 GHz,在100KHz频偏处的输出相位噪声为-125.3dBc/Hz。分频器核心电路消耗电流4.3mA（1.8V电源电压）,核心面积0.015mm2。测试结果表明该可编程分频器能很好的应用在所需的频率综合器中.     

新型双模前置32/33分频器设计

提出了一种新颖的分频器设计方案,在高频段采用改进的CMOS源耦合逻辑(SCL)结构的主从D-Latch进行分频;在低频段采用自锁存的D触发器进行分频,从而实现高速、低功耗、低噪声双模前置32/33分频器。基于TSMC的0.18!mCMOS工艺,利用CadenceSpectre工具进行仿真。该分频器最高工作频率可达到5GHz,在27℃、电源电压为1.8V、工作频率为5GHz时,电路的功耗仅4.32mW(1.8V×2.4mA)。     

WSN射频芯片中6GHz RF CMOS低功耗双模前置分频器的设计

介绍了一种可以应用在无线传感网射频芯片中的超高速、低功耗32/33双模前置分频器的内部结构、电路设计原理以及版图设计.该前置分频器采用0.18 μm RF CMOS工艺制作,工作频率范围为1～6 GHz,工作温度范围为-20～+80℃,在I.8 V电压下正常工作频率为4.8 GHz,最高工作频率达到6 GHz,电源电流为2.5 mA,满足系统指标要求.     

面向100GHz+数模混合电路的0.5μm InP DHBT工艺

本文报道了一种高性能的3英寸磷化铟双异质结双极型晶体管工艺。发射极尺寸为0.5×5μm2的磷化铟双异质结双极型晶体管,电流增益截止频率以及最高振荡频率分别达到350GHz以及532GHz,击穿电压4.8V。基于该工艺研制了114GHz静态分频器以及170GHz动态分频器两款工艺验证电路,这两款电路的工作频率处于国内领先水平。     

2.4GHz动态CMOS分频器的设计

对现阶段的主流高速CMOS分频器进行分析和比较,在此基础上设计一种采用TSPC(truesingle phase clock)和E-TSPC(extended TSPC)技术的前置双模分频器电路.该分频器大大提高了工作频率,采用0.6μm CMOS工艺参数进行仿真的结果表明,在5V电源电压下,最高频率达到3GHz,功耗仅为8mW.     

1V,19GHz CMOS分频器设计

对传统分频器电路工作在低电压(1V)时存在的问题进行了分析,在此基础上提出了一种新的分频器电路结构,将NMOS和PMOS管的直流偏置电压分开,有效地解决了分频器在低电压下工作所存在的问题.采用0.18μm CMOS工艺参数进行仿真的结果表明,该分频器在1V的电源电压下,能够工作的最高输入频率为19GHz,功耗仅为2.5mW.     

面向100 GHz+数模混合电路的0.5 μm InP DHBT工艺（英文）

报道了一种高性能的3英寸磷化铟双异质结双极型晶体管工艺.发射极尺寸为0.5μm×5μm的磷化铟双异质结双极型晶体管,电流增益截止频率以及最高振荡频率分别达到350 GHz以及532 GHz,击穿电压4.8 V.基于该工艺研制了114 GHz静态分频器以及170 GHz动态分频器两款工艺验证电路,这两款电路的工作频率均处于国内领先水平.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.