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ULSI中铜互连线通孔电热性能的数值模拟 总被引:2,自引:0,他引:2
利用三维有限元模型对Cu互连线通孔进行了电流密度、温度和温度梯度的分布进行了模拟,比较了具有不同阻挡层材料的通孔内的电流密度、温度和温度梯度的分布.对于同一阻挡层材料,进行了不同通孔倾斜角的模拟.模拟结果指出,通过优化通孔倾斜角和优选阻挡层材料可有效地改善通孔内的电流密度和温度的分布,提高ULSI通孔互连的可靠性,这对通孔的设计提供了有益的参考. 相似文献
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通过化学气相沉积法,采用不同生长工艺在4°偏角4H-SiC衬底上制备p型4H-SiC同质外延片。提出了p型4H-SiC同质外延中有效层厚度的概念,研究发现导致外延有效层厚度减少的直接原因是自掺杂效应的存在。采用傅里叶红外光谱仪(FT-IR)、汞探针电容电压(Hg-CV)和表面缺陷测试仪对p型4H-SiC同质外延片进行表征,讨论了不同工艺对外延有效层厚度的影响。结果表明,采用隔离法和阻挡层法均能提高外延有效层厚度,且掺杂浓度随距表面深度变化斜率值由1.323减小到0.073。然而,阻挡层法斜率值能进一步优化至0.050,是由于有效抑制了外延中固相和气相自掺杂。对比于优化前工艺,采用阻挡层法制备的p型4H-SiC同质外延片厚度不均匀性和表面总缺陷数量处于同一水平,掺杂浓度不均匀性由2.95%改善到2.67%。综上,采用阻挡层法能够制备出高有效层厚度、高一致性和高质量的p型4H-SiC同质外延片。 相似文献
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集成电路中金属连线的逆流电迁移(EM)的双峰失效现象在45 nm双大马士革低k材料铜布线工艺中变得尤为突出,介绍了由于空洞存在于连接电路导致电迁移的早期失效,总结出两个早期失效的主要原理:分别是空洞形成在通孔以及浅槽与通孔的斜面,这是由于淀积扩散阻挡层和铜工艺在上述两个地方存在弱点,越薄的扩散阻挡层厚度对EM越不利。因为偏薄的扩散阻挡层不利于阻挡铜扩散,尤其在通孔的侧壁和边角斜面,这样在测试电迁移的高温大电流下,铜在通孔侧壁和边角斜面处易扩散而形成空洞,最终导致芯片失效。实验表明可以通过优化双大马士革结构通孔以及浅槽与通孔的斜面的长宽比(AR)减少消除这些弱点。介质层(ILD)的厚度,浅槽的深度以及通孔的关键尺寸可以作为调节AR的主要方法。 相似文献
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软刻蚀技术运用聚二甲基硅氧烷(Poly dimethylsiloxane,PDMS)等聚合物材料制备弹性图章,并用制备好的图章转印图形结构至特定基底。在很多情况下需对模板和弹性图章、图章与转印图形同一位置的形貌进行表征。基于原子力显微镜观测的反向重定位技术提供了一种微观区域内对二雏平面互为镜像关系的两种样品的原位对比观测方法。本文利用坐标实时显示的程控高精度样品台系统,联合使用非对称表面标记及坐标镜像复制的定位法,实现了对样品的精确反向重定位成像。 相似文献
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硅通孔(Through silicon via)的互连技术是3D IC集成中的一种重要工艺。报道了一种高深宽比的垂直互连穿透硅通孔工艺,其通孔的深宽比达到50以上;研究了利用钨填充硅通孔的一些关键工艺,包括阻挡层淀积工艺和钨填充工艺,分析了不同填充工艺所造成的应力的变化。最后获得了一种深宽比达到58∶1的深硅通孔无缝填充。 相似文献
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采用磁控反应共溅射方法制备了纳米Ta-Al-N薄膜,并原位制备了Cu/Ta-Al-N薄膜,对薄膜进行了热处理。用四探针测试仪、X射线衍射仪(XRD)、扫描电镜(SEM)、原子力显微镜(AFM)以及台阶仪等研究了退火对薄膜结构及阻挡性能的影响。结果表明,Ta-Al-N薄膜具有优良的热稳定性,保持非晶态且能对Cu有效阻挡的温度可达800°C;同时发现在900°C退火5 min后,薄膜开始晶化,在Cu/Ta-Al-N/Si界面处生成了Cu3Si等相,表明此时Ta-Al-N薄膜阻挡层开始失效。 相似文献
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SiC衬底AlGaN/GaN HEMT的ICP通孔刻蚀 总被引:1,自引:0,他引:1
利用ICP对研制的SiC衬底上AlGaN/GaN HEMT刻蚀获得了深度为50μm的接地通孔. 器件通孔制作前首先用机械研磨的方法将衬底减薄至50μm,在背面蒸发Ti/Ni并电镀Ni至3μm作为刻蚀阻挡层;之后利用SF6/O2混合气体的电感耦合等离子体对SiC衬底进行了刻蚀;最后将Cl2和BCl3混合气体的ICP刻蚀技术运用于AlGaN/GaN外延材料的刻蚀,完成了深度为50μm的AlGaN/GaN HEMT通孔制作,通孔侧壁具有一定的斜率,适合良好的金属覆盖以形成器件正面和背面的连接. 这一技术非常适合AlGaN/GaN HEMT及其单片集成电路的研制. 相似文献
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利用ICP对研制的SiC衬底上AlGaN/GaN HEMT刻蚀获得了深度为50μm的接地通孔.器件通孔制作前首先用机械研磨的方法将衬底减薄至50μm,在背面蒸发Ti/Ni并电镀Ni至3μm作为刻蚀阻挡层;之后利用SF6/O2混合气体的电感耦合等离子体对SiC衬底进行了刻蚀;最后将Cl2和BCl3混合气体的ICP刻蚀技术运用于AlGaN/GaN外延材料的刻蚀,完成了深度为50μm的AlGaN/GaN HEMT通孔制作,通孔侧壁具有一定的斜率,适合良好的金属覆盖以形成器件正面和背面的连接.这一技术非常适合AlGaN/GaN HEMT及其单片集成电路的研制. 相似文献
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InAs-based heterostructure barrier varactor diodes with In0.3Al0.7As0.4Sb0.6 as the barrier material
James G. Champlain Richard Magno Mario Ancona Harvey S. Newman J. Brad Boos 《Solid-state electronics》2008,52(11):1829-1832
InAs-based heterostructure barrier varactor (HBV) diodes with In0.3Al0.7As0.4Sb0.6 as the barrier material are demonstrated. Current–voltage and capacitance–voltage characteristics, as well as S-parameters, of HBV diodes with varying barrier thicknesses are examined. Maximum capacitance values and maximum-to-minimum capacitance ratios greater than those predicted by traditional HBV models were measured. The HBVs’ unconventional behavior in terms of charge accumulation layers adjacent to the wide bandgap barrier is discussed. 相似文献
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提出了一种新型隐埋缓冲掺杂层(IBBD)高压SBD器件,对其工作特性进行了理论分析和模拟仿真验证。与常规高压SBD相比,该IBBD-SBD在衬底上方引入隐埋缓冲掺杂层,将反向击穿点从常规结构的PN结保护环区域转移到肖特基势垒区域,提升了反向静电释放(ESD)能力和抗反向浪涌能力,提高了器件的可靠性。与现有表面缓冲掺杂层(ISBD)高压SBD相比,该IBBD-SBD重新优化了漂移区的纵向电场分布形状,在保持反向击穿点发生在肖特基势垒区域的前提下,进一步降低反向漏电流、减小正向导通压降,从而降低了器件功耗。仿真结果表明,新器件的击穿电压为118 V。反向偏置电压为60 V时,与ISBD-SBD相比,该IBBD-SBD的漏电流降低了52.2%,正向导通电压更低。 相似文献
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M. Brendel A. Knigge F. Brunner S. Einfeldt A. Knauer V. Kueller U. Zeimer M. Weyers 《Journal of Electronic Materials》2014,43(4):833-837
Al0.4Ga0.6N metal–semiconductor–metal photodetectors on epitaxial laterally overgrown (ELO) AlN/sapphire templates show anisotropic device characteristics depending on the orientation of the electrode stripes with respect to the stripe pattern onto which the underlying ELO AlN buffer layers have been grown. With electrodes perpendicular to the stripes, a quantum efficiency (QE) of ~140 was found for 20-V bias at room-temperature. This gain is explained by carrier transport along channels with increased Ga content resulting from faceted growth at the steps of the ELO template. The resulting potential barrier is confirmed by the activation energy found for the temperature dependence of the QE. In contrast, photodetectors with electrodes running parallel to these channels do not show gain but have an enhanced QE at elevated bias voltage compared to devices on planar AlN buffer layers. This effect is attributed to different densities of threading dislocations in the absorber layer. 相似文献
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Wu L.W. Chang S.J. Wen T.C. Su Y.K. Chen J.F. Lai W.C. Kuo C.H. Chen C.H. Sheu J.K. 《Quantum Electronics, IEEE Journal of》2002,38(5):446-450
A detailed study on the effects of Si-doping in the GaN barrier layers of InGaN-GaN multiquantum well (MQW) light-emitting diodes (LEDs) has been performed. Compared with unintentionally doped samples, X-ray diffraction results indicate that Si-doping in barrier layers can improve the crystal and interfacial qualities of the InGaN-GaN MQW LEDs. It was also found that the forward voltage is 3.5 and 4.52 V, the 20-mA luminous intensity is 36.1 and 25.1 mcd for LEDs with a Si-doped barrier and an unintentionally doped barrier, respectively. These results suggests that one can significantly improve the performance of InGaN-GaN MQW LEDs by introducing Si doping in the GaN barrier layers 相似文献
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本文介绍了高压功率VDMOS器件对外延层的要求;讨论了n~-/n~+高阻厚层外延的工艺难点及解决办法。研制的n~-/n~+高阻厚层外延片已成功地运用于产品开发中,并取得了可喜的结果。 相似文献
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Tsung-Han Yang Houqiang Fu Hong Chen Xuanqi Huang Jossue Montes Izak Baranowski Kai Fu Yuji Zhao 《半导体学报》2019,40(1):63-69
Beta-phase gallium oxide(β-Ga_2O_3) Schottky barrier diodes were fabricated on highly doped single-crystal substrates,where their temperature-dependent electrical properties were comprehensively investigated by forward and reverse current density – voltage and capacitance – voltage characterization. Both the Schottky barrier height and the ideality factor showed a temperature-dependence behavior, revealing the inhomogeneous nature of the Schottky barrier interface caused by the interfacial defects. With a voltage-dependent Schottky barrier incorporated into thermionic emission theory, the inhomogeneous barrier model can be further examined. Furthermore, the reverse leakage current was found to be dominated by the bulk leakage currents due to the good material and surface quality. Leakage current per distance was also obtained. These results can serve as important references for designing efficient β-Ga_2O_3 electronic and optoelectronic devices on highly doped substrates or epitaxial layers. 相似文献