Sn-2.5Ag-0.7Cu-XGe钎料显微组织与熔化特性

应用扫描电子显微镜和差式扫描量热仪研究了Sn-2.5Ag-0.7Cu-XGe系三个成分的无铅钎料.结果表明,该合金系的显微组织为鹅卵石状的初晶晶粒加上分散微细条状和小颗粒状的共晶组织.在钎料中添加0.5%或1.0%的Ge元素,显微组织的形貌没有改变,但其中的金属间化合物Ag3Sn和Cu6Sn5趋于细化,分布趋于均匀,Ag3 Sn相从长条状向细小针状转变.加入Ge元素后合金的熔化开始、熔化峰值和熔化结束温度都有所降低.同时Ge元素的加入使熔化曲线的吸热峰宽度变窄,熔化结束部分变长,但对熔化温度区间的影响较小.     

合金元素对无铅钎料超电势的影响

针对目前国内外对无铅钎料的研究,提出了以Sn为基体,添加Cu、Ag、Bi、Sb和RE形成多元合金的无铅钎料,分析了上述五种合金元素对其超电势的影响。Bi对于降低钎料超电势起显著作用,而Ag的加入在小范围内使超电势提高。     

Sn57Bi（X）多元钎料与Sn58Bi钎料的微观组织及钎焊性能对比研究

文中主要研究了Sn57Bi0.5Cu0.5SbNiTi, Sn57Bi1Ag和Sn58Bi在金相组织、熔化特性、铺展率、界面反应、抗剪强度和蠕变特性上的差异,分析造成3种不同合金成分的无铅钎料性能差异的成因,寻求一种更好的多元合金来提升Sn58Bi共晶钎料的性能,实现对高成本Sn57Bi1Ag无铅钎料的有效替代。     

Ag和Ni元素对Sn-Sb-Cu无铅钎料熔化温度和铺展性能的影响

在Sn-Sb-Cu三元钎料合金中添加微量元素Ag和Ni,通过合金化形成Sn-Sb-Cu-Ag和Sn-Sb-Cu-Ni两种新型四元无铅钎料合金,以改善基体钎料性能.结果表明,在Sn-Sb-Cu钎料合金中添加微量元素Ag,合金熔化温度较基体钎料下降,铺展面积增大,这与钎料过热度增大,形成弥散低熔点相SnAg和液态钎料表面张力减小有关;添加微量元素Ni,合金熔化温度较基体钎料下降,铺展性能稍稍变差,这是因为添加微量元素Ni后,Sn-Sb-Cu-Ni液态钎料粘度提高,表面张力增大.且在钎料与铜基板处形成了多面体形状(Cu,Ni)6Sn5,且该相覆盖在Cu6Sn5表面,不利于液态钎料的润湿铺展.     

Sn-Ce-Me无铅钎料合金活度相互作用系数的计算及应用

采用周模型计算分析了Sn-Ce-Me(Me=Pb、Bi、zn、Sb、Ag、Cu、Cd)三元合金系中，Ce与Sn以及Ce与Me之间的活度相互作用系数。计算结果表明，不仅在Sn-Pb-Ce中，Ce存在“亲Sn”现象，在其它6个三元无铅钎料合金体系中，如Sn-Bi-Ce、Sn-Sb-Ce、Sn-zn-Ce、Sn-Cd-Ce、Sn-Ag-Ce、Sn-Cu-Ce，Ce也同样存在着“亲Sn”现象。其研究结果可为新型无铅钎料的研究提供理论分析依据。     

Sn-Cu基多组元无铅钎料组织、性能及界面反应研究

研究了多组元无铅钎料Sn-2Cu-0.5Ni和Sn-2Cu-0.5Ni-0.5Au的熔化行为、微观组织、力学性能及与Ni基板的钎焊反应。结果表明:Au的引入降低了钎料合金的熔化温度;2种钎料基体中的金属间化合物(IMC)均基于Cu6Sn5结构,且在260℃下与Ni基板钎焊60s后在接头界面处均生成棒状的(Cu,Ni)6Sn5;通过拉伸试验得到了2种钎料的抗拉强度和延伸率。     

添加微量稀土对SnBi基无铅钎料显微组织和性能的影响

研究了添加微量稀土对Sn58Bi基无铅钎料熔化温度、润湿性能、钎焊接头强度、高温时效前后IMC厚度的变化和显微组织的影响,并与添加一定量Ag对Sn58Bi钎料的试验结果做了比较.试验所用钎料为Sn58Bi,Sn58Bi0.5Ag,Sn58Bi0.1RE和Sn58Bi0.5Ag0.1RE,添加稀土为Ce基混合稀土.试验结果表明,添加微量稀土不仅抑制了Sn58Bi钎料高温时效引起的IMC的生长,而且细化了显微组织;微量稀土添加对钎料熔化温度没有明显影响,但能显著改善Sn58Bi钎料的润湿性能和接头强度,而且改善的程度优于添加微量Ag对Sn58Bi钎料的作用.     

稀土元素Er对Bi5Sb8Sn钎料力学性能的影响

通过向Bi5Sb8Sn钎料合金中添加适量的稀土元素铒(Er),研究了不同含量的稀土Er对Bi5Sb8Sn无铅钎料合金力学性能的影响。结果表明,微量稀土Er的添加能显著细化该钎料组织,改善合金的组织分布情况,提高钎料的力学性能;稀土w(Er)0.5%时,Bi5Sb8SnRE合金抗拉强度和钎焊接头的抗剪强度较基体钎料Bi5Sb8Sn分别提高了41.8%和83.0%.;但当稀土w(Er)0.5%时,则组织粗化,钎料力学性能下降。     

SnAgCuEr系稀土无铅钎料的显微组织

系统研究了添加微量稀土Er对Sn3.8Ag0.7Cu无铅钎料合金显微组织和性能的影响.试验发现,微量Er的添加,使Sn3.8Ag0.7Cu钎料合金的熔化温度稍有降低,铺展面积有所增加,抗剪强度有所提高.通过显微组织观察,加Er后网状共晶物体积百分比增大,初晶金属间化合物(IMC)的尺寸变小.微量Er抑制了时效过程钎料与铜基体界面IMC层(IML)的增厚,时效400 h后差别更明显,有利于提高钎料接头的可靠性.指出含微量稀土的SnAgCuEr合金是性能优良的无铅钎料合金.     

快速凝固对Sn2．5Ag0．7Cu钎料合金熔化与铺展特性的影响

采用单辊法制备了快速凝固态Sn2.5Ag0.7Cu钎料合金薄带.通过DSC检测和铺展试验研究了快速凝固对Sn2.5Ag0.7Cu钎料合金熔化与铺展特性的影响.结果表明:快速凝固态钎料熔化区间为6℃.较常态钎料小9℃;与常态钎料相比,快速凝固态钎料能够在较低温度(260℃)、较短时间(3 min)实现速度更快、面积更大的铺展.     

Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys

The melting point, spreading property, mechanical properties and microstructures of Sn-3.0Ag-2.8Cu solder alloys added with micro-variable-Ce were studied by means of optical microscopy, scanning electron microscopy（SEM） and energy dispersive X-ray（EDX）. The results indicate that the melting point of Sn-3.0Ag-2.8Cu solder is enhanced by Ce addition; a small amount of Ce will remarkably prolong the creep-rupture life of Sn-3.0Ag-2.8Cu solder joint at room temperature, especially when the content of Ce is 0.1%, the creep-rupture life will be 9 times or more than that of the solder joint without Ce addition; the elongation of Sn-3.0Ag-2.SCu solder is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1%.     

无铅焊料在NaCl-Na_2SO_4-Na_2CO_3模拟土壤溶液中的腐蚀浸出行为

研究了Sn-3.5Ag-0.75Cu和Sn-0.75Cu焊料合金在NaCl-Na_2SO_4-Na_2CO_3模拟土壤溶液中的腐蚀浸出行为,并与Sn-37Pb焊料合金的腐蚀浸出行为对比分析。研究表明,这3种焊料合金中Sn的浸出量随时间的延长趋于平缓,且Sn-0.75Cu焊料合金中Sn的浸出量最高,添加Ag元素后明显抑制了Sn-3·5Ag-0·75Cu焊料合金中Sn的浸出;Ag,Cu,Pb的浸出量随时间的延长呈线性增加,且Ag,Cu的浸出量较少。3种焊料合金浸出后表面产物层较厚,主要由Sn_4(OH)_6Cl_2和SnO组成,其中Sn-0.75Cu焊料合金的表面产物层有裂纹和孔洞,Sn-3.5Ag-0.75Cu焊料合金的表面产物相对致密,而Sn-37Pb焊料合金的表面产物局部出现剥落现象。这3种焊料合金浸出动力学行为存在差异,主要与表面产物的相组成和形貌有关。     

Ag元素含量对Sn-Ag-Cu钎料焊接性的影响

以Sn-xAg-0.5Cu为基体制备了低银无铅钎料,其中Ag元素的质量分数分别为0.3%,0.5%,0.7%,0.9%.借助钎料合金的DSC熔化曲线,分析了Ag元素含量对合金熔点的影响规律.通过比较各组钎料合金在Cu基板上的铺展面积和铺展率,分析了Ag元素含量的变化对各组钎料润湿性的影响规律.结果表明,随着Ag元素含量...     

Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and In

Nowadays, a major concern of Sn-Cu based solder alloys is focused on continuously improving the comprehensive properties of solder joints formed between the solders and substrates. In this study, the influence of Ag and/or In doping on the microstructures and tensile properties of eutectic Sn-0.7Cu lead free solder alloy have been investigated. Also, the effects of temperature and strain rate on the mechanical performance of Sn-0.7Cu, Sn-0.7Cu-2Ag, Sn-0.7Cu-2In and Sn-0.7Cu-2Ag-2In solders were investigated. The tensile tests showed that while the ultimate tensile strength (UTS) and yield stress (YS) increased with increasing strain rate, they decreased with increasing temperature, showing strong strain rate and temperature dependence. The results also revealed that with the addition of Ag and In into Sn-0.7Cu, significant improvement in YS (∼255%) and UTS (∼215%) is realized when compared with the other commercially available Sn-0.7 wt. % Cu solder alloys. Furthermore, the Sn-0.7Cu-2Ag-2In solder material developed here also exhibits higher ductility and well-behaved mechanical performance than that of eutectic Sn-0.7Cu commercial solder. Microstructural analysis revealed that the origin of change in mechanical properties is attributed to smaller β-Sn dendrite grain dimensions and formation of new inter-metallic compounds (IMCs) in the ternary and quaternary alloys.     

Sn-Ag-Cu-In无铅钎料润湿性能及显微组织

在Sn-1.2Ag-0.6Cu合金中添加0～1.0%的In元素,研究了Sn-Ag-Cu-In无铅钎料的熔化温度、润湿性能及显微组织.结果表明,添加In元素对钎料的熔化温度有一定的降低作用,在相同的试验温度下,含铟钎料粘度更低,流动性更强,钎料的润湿性能随之改善.低银Sn-Ag-Cu钎料在空气中的润湿时间在260℃才达到...     

D-KH法制备AgCuSn合金钎料的性能研究

分别采用熔铸法和D-KH法(叠轧复合-扩散合金化工艺)制备了Ag-22.4Cu-20Sn钎料合金,采用XRD、SEM、DSC及万能力学试验机等测试技术,对合金相组成、显微组织、熔化特性、钎焊接头的剪切强度和钎焊界面形貌等进行了对比研究。结果表明,D-KH法制备的钎料相组成为(Ag)、Cu3Sn、Ag5Sn相,而熔铸法制备的钎料相组成为(Ag)、Cu3Sn、Ag5Sn以及Cu41Sn11相;D-KH法制备的钎料合金液固相线均降低,熔程减小。与熔铸法相比,用D-KH法制备得到的厚度0.1 mm的钎料薄带,润湿铺展性更优、接头剪切强度更高、接头强度稳定性更好。     

Progress in the design of new lead-free solder alloys

Various alloy design approaches have been employed to develop new lead-free solder alloys that can not only substitute for the lead-tin solders, but also offer significantly improved mechanical properties. Three new alloys are described in this article. In Sn-3.5Ag-1Zn (melting point ~217°C), the solidification structure and the eutectic precipitate morphology are6 refined by the addition of zinc. As a result, a high-strength, high-ductility solder with significantly improved creep resistance is obtained. In Bi-43Sn+2.5Fe, a eutectic alloy (melting point ~137°C), dispersion hardening by magnetically distributed iron particles retards both high-temperature deformation and microstructural coarsening, thus widening the useful service range of Bi-Sn eutectic alloys to much higher homologous temperatures than are typical for the Sn-Pb eutectic alloy. Lastly, Sn-Zn-In based alloys (melting point ~185°C) have been developed for consideration as a drop-in replacement for the neareutectic Sn-Pb alloy(melting point ~183°C).     

Microstructural evolution and tensile properties of Sn-5Sb solder alloy containing small amount of Ag and Cu

The near peritectic Sn-5Sb Pb-free solder alloy has received considerable attention for high temperature electronic applications, especially on step soldering technology, flip-chip connection. In the present study, a separate addition of the same amount of Ag and Cu are added with the near-peritectic Sn-5Sb solder alloy to investigate the effect of a third element addition on the microstructural, thermal and mechanical properties of the newly developed ternary solder alloys. The results indicate that the melting point of Sn-5Sb solder is enhanced by Ag and Cu additions. Besides, the Ag and Cu content refine the microstructure and form new intermetallic compounds (IMCs) with the near-peritectic Sn-5Sb solder alloy. The tensile tests revealed that all alloys exhibit higher mechanical strength with increasing strain rate and/or decreasing testing temperature, suggesting that the tensile behavior of the three alloys is strain rate and temperature dependence. The yield and ultimate tensile strength are higher for Sn-5Sb-0.7Cu alloy compared with Sn-5Sb and Sn-5Sb-0.7Ag alloys. Good mechanical performance of Sn-5Sb-0.7Cu solder is often correlated to a fine β-Sn grain size and more dispersed Cu-Sn IMC particles, which makes the solder exhibit high strength and yield stress.     

Bi对Sn-0.3Ag-0.7Cu无铅钎料熔点及润湿性能的影响

研究了添加适量的Bi元素对低银型Sn-0．3Ag-0．7Cu无铅钎料合金性能的影响,应用差示扫描量热仪和SAT-5100型润湿平衡仪对Sn-0．3Ag-0．7Cu·xBi（x=0.1,3,4．5）钎料的熔点、润湿性能作了对比试验分析。结果表明,一定量Bi元素的加入可以降低Sn-0．3Ag-0．7Cu钎料合金的熔点,并改善其润湿性能。但过多的Bi元素会导致钎料的液固相线温度差增大,塑性下降,造成焊点剥离缺陷。综合考虑得到Sn-0．3Ag-0．7Cu-3．0Bi无铅钎料具有最佳的综合性能。     

Effects of Zn,Zn-Al and Zn-P Additions on the Tensile Properties of Sn-Bi Solder

Effects of Zn, Zn-Al and Zn-P additions on melting points, microstructures, tensile properties, and oxidation behaviors of Sn-40 Bi lead-free solder were investigated. The experimental results show that the addition of these three types of elements can refine the microstructures and improve the ultimate tensile strength（UTS） of solder alloys. The fractographic analysis illustrates that ductile fracture is the dominant failure mode in tensile tests of Sn-40Bi-2Zn（SBZ）and Sn-40Bi-2Zn-0.005Al（SBZA） specimens, while brittle fracture is the controlled manner in Sn-40Bi-2Zn-0.005P（SBZP） and Sn-58 Bi solders. XPS analysis indicates that trace amounts of both Al and P additives in solder can improve the antioxidant capacity, whereas only the additive of Al in solder can reduce the thickness of oxidation film.