CMOS毫米波低功耗超宽带共栅低噪声放大器

陈述了一个基于单端共栅与共源共栅级联结构的超宽带低噪声放大器(LNA).该LNA用标准90-nm RFCMOS工艺实现并具有如下特征:在28.5～39 GHz频段内测得的平坦增益大于10 dB;-3 dB带宽从27～42 GHz达到了15 GHz,这几乎覆盖了整个Ka带;最小噪声系数(NF)为4.2dB,平均NF在27 ～ 42 GHz频段内为5.1 dB;S11在整个测试频段内小于-11 dB.40 GHz处输入三阶交调点(IIP3)的测试值为+2 dBm.整个电路的直流功耗为5.3 mW.包括焊盘在内的芯片面积为0.58 mm×0.48 mm.     

CMOS毫米波低功耗超宽带共栅低噪声放大器（英文）

陈述了一个基于单端共栅与共源共栅级联结构的超宽带低噪声放大器(LNA).该LNA用标准90-nm RF CMOS工艺实现并具有如下特征:在28.5~39 GHz频段内测得的平坦增益大于10 d B;-3 d B带宽从27~42 GHz达到了15 GHz,这几乎覆盖了整个Ka带;最小噪声系数(NF)为4.2 d B,平均NF在27~42 GHz频段内为5.1 d B;S11在整个测试频段内小于-11 d B.40 GHz处输入三阶交调点(IIP3)的测试值为+2 d Bm.整个电路的直流功耗为5.3 m W.包括焊盘在内的芯片面积为0.58 mm×0.48 mm.     

一种0.13 μm SOI CMOS 2.4/5.5 GHz双频段LNA

基于Tower Jazz 0.13 μm SOI CMOS工艺,提出了一种应用于无线局域网的2.4/5.5 GHz双频段低噪声放大器(LNA)。该双频段LNA基于带源极电感的共源共栅结构,在放大管栅极与共源共栅管漏极之间增加负反馈电容,以改善5.5 GHz频段的阻抗匹配。工作频段的切换通过开关控制的电感电容匹配网络实现。SOI射频开关通过增加MOS管尺寸来减小导通时的插入损耗,并且保持较低的关断电容,使开关的引入对LNA性能的影响最小化。Cadence后仿真结果表明,在2.4 GHz频段范围内,S₂₁为10.3~10.7 dB,NF为2.1 ~2.2 dB,IIP3为5 dBm;在5.5 GHz频段范围内,S₂₁为9.7 ~11.8 dB,NF为2.4~2.9 dB,IIP3为14 dBm。     

3~10 GHz平坦增益超宽带CMOS LNA设计

提出了一种基于共源共栅及电阻并联反馈结构的超宽带低噪声放大器(LNA)。在3～10 GHz的工作频段范围内,采用电阻并联反馈和π型匹配网络结构,实现宽带输入匹配,并有效减小整个电路的噪声系数。利用共源共栅输出漏极的并联峰化技术,实现平坦的高频增益及噪声的有效抑制。采用源极电感(L_s)负反馈及晶体管M₃构成的源极跟随器,提高电路的线性度和输出匹配。基于TSMC 0.18 μm RFCMOS工艺库,采用Cadence Spectre RF,对LNA原理图和版图进行仿真。仿真结果显示,该LNA的S₁₁和S₂₂均小于-10 dB,S₁₂小于-32 dB,S₂₁为11.38±0.36 dB,噪声系数为3.37±0.2 dB,P1dB和IIP3分别为-9.41 dBm和-2.7 dBm。设计的LNA在带宽内具有良好的输入输出匹配、较好的反向隔离度及线性度、高且平坦的增益和低且平坦的噪声系数。     

有源电感复用型2.4 GHz/5.2 GHz双频段LNA

采用可调谐有源电感复用结构,设计了一款用于3G TD-SCDMA和WLAN的2.4 GHz/5.2 GHz双频段低噪声放大器(DB-LNA)。2.4 GHz频段电路采用折叠共源共栅(FC)结构,5.2 GHz频段电路采用共栅(CG)结构。FC和CG结构均采用可调谐有源电感,通过调谐有源电感的等效阻抗,优化匹配到源阻抗。基于TSMC 0.18 μm CMOS工艺,实现了有源电感复用型DB-LNA。ADS仿真结果表明,频率为2.4 GHz时,S₂₁=35 dB,NF=4.42～4.59 dB,IIP3=0 dBm,P-1dB=-14 dBm;频率为5.2 GHz时,S₂₁=34 dB,NF=2.74～2.75 dB,IIP3=-5 dBm,P-1dB=-9 dBm。     

一种2.2~4 GHz高增益低噪声放大器

采用0.25 μm GaAs赝配高电子迁移率晶体管(pHEMT)工艺,设计并实现了一种应用于5G通信2.2~4 GHz频段的高增益共源共栅低噪声放大器(LNA)。通过将并联RC负反馈与共栅接地电容结合,不使用源极电感,实现了宽带高增益的LNA设计。测试结果表明,2.2~4 GHz频段增益大于24 dB,输出3阶互调(OIP3)为28 dBm,噪声系数(NF)小于0.78 dB,功耗为190 mW,芯片面积为(810×710) μm²。综合指标(FOM)为14.4 dB,与同类LNA相比具有一定的优势。     

一种电流舵结构大范围连续可变增益LNA

设计了一款应用于4G(TD-LTE)的可变增益低噪声放大器(VGLNA)。输入级采用共栅极跨导增强结构,实现了电路的输入阻抗匹配,并且加入共栅极噪声抵消电路,降低了电路的噪声系数;第2级采用改进型电流舵结构,实现了电路的增益大范围连续可变;输出级采用源跟随器,实现了良好的输出阻抗匹配。基于TSMC 0.18 μm CMOS工艺,利用安捷伦射频集成电路设计工具ADS2009进行仿真验证。结果表明:在1.88~2.65 GHz频段内,该LNA在2.7~39.3 dB增益范围内连续可变,且输入端口反射系数S₁₁小于－10 dB,输出端口反射系数S₂₂小于－20 dB,最小噪声系数NF为2.6 dB,最大3阶交调点IIP3达到2.7 dBm。     

一个基于65 nm CMOS工艺具有17.3 dB增益的47-67 GHz宽带低噪声放大器

报道了一个基于65 nm CMOS工艺具有17.3 dB增益的47-67 GHz宽带低噪声放大器（LNA）。文中首先阐述了毫米波电路的特征,并讨论了其设计方法。LNA的宽带输入匹配通过源极电感退化获得,这种结构在低GHz频段为窄带匹配,但由于栅漏电容Cgd的存在,在毫米波频段其进化为宽带匹配。为了使噪声系数（NF）最小化,LNA在第一级使用了共源（CS）结构而不是cascode结构,同时文中也探讨了噪声匹配的原理。LNA的后两级使用cascode结构以提高功率增益。对共栅（CG）晶体管中栅极电感的增益提升效应进行了分析。级间T形匹配网络用来提升电路带宽。所有片上电感和传输线都在3维电磁仿真工具中建模和仿真以确保成功的设计。测试结果显示LNA在60 GHz处取得最高的 17.3 dB增益,同时3-dB带宽为20 GHz（47-67 GHz）,涵盖所需要的59-64 GHz频段,并在62 GHz取得最低的4.9 dB噪声系数。整个LNA从1.2 V电源处吸收19 mA电流,芯片包括焊盘占用面积为900×550 μm2。     

1.5-6GHz增益和噪声系数稳定的两级超宽带CMOS低噪声放大器设计与性能模拟

 针对UWB应用设计实现了一个1.5-6GHz的两级CMOS低噪声放大器(LNA). 通过引入共栅(CG)和共源(CS)结构以获得宽范围内的输入匹配,采用电流镜和峰化电感进行电流复用,所提出的LNA实现了非常平坦化的功率增益和噪声系数(NF). 经标准0.18μm CMOS工艺实现后,版图后模拟结果表明在1.5-5GHz频率范围内功率增益(S21)为11.45±0.05dB,在2-6GHz频率范围内噪声系数(NF)为5.15±0.05dB,输入损耗(S11)小于-18dB. 在5GHz时,模拟得到的三阶交调点(IIP3)为-7dBm,1dB压缩点为-5dBm.在1.8V电源电压下,LNA消耗6mA的电流,版图实现面积仅为0.62mm^2.     

一种基于0.18 μm SiGe BiCMOS工艺的X/Ku波段数字有源移相器

提出了一种用于X/Ku波段相控阵天线系统、带数字控制电路的4位有源移相器。该移相器采用两个相位正交的输入信号的相位内插技术来合成所需要的相位。基于JAZZ 0.18 μm SiGe BiCMOS工艺技术,采用Cadence Spectre RF,对电路系统进行仿真分析。仿真结果为:S₁₁小于-10 dB,S₂₂小于-11 dB,S₁₂小于-90 dB,在12 GHz处,所有4位相位状态的电压增益范围都是20.80～23.57 dB,在整个频段内,电压增益误差的RMS小于1.1 dB,噪声系数为2.82～4.45 dB。在7～18 GHz内,相位误差的RMS小于4°。     

SiGe HBT低噪声放大器的设计与制造

该文设计和制作了一款单片集成硅锗异质结双极晶体管(SiGe HBT)低噪声放大器(LNA)。由于放大器采用复合型电阻负反馈结构,所以可灵活调整不同反馈电阻,同时获得合适的偏置、良好的端口匹配和低的噪声系数。基于0.35 m Si CMOS平面工艺制定了放大器单芯片集成的工艺流程。为了进一步降低放大器的噪声系数,在制作放大器中SiGe器件时,采用钛硅合金(TiSi2)来减小晶体管基极电阻。由于没有使用占片面积大的螺旋电感,最终研制出的SiGe HBT LNA芯片面积仅为0.282 mm2。测试结果表明,在工作频带0.2-1.2 GHz内,LNA噪声系数低至2.5 dB,增益高达26.7 dB,输入输出端口反射系数分别小于-7.4 dB和-10 dB。     

Design of a fully differential CMOS LNA for 3.1-10.6 GHz UWB communication systems

A fully differential complementary metal oxide semiconductor （CMOS） low noise amplifier （LNA） for 3.1-10.6 GHz ultra-wideband （UWB） communication systems is presented. The LNA adopts capacitive cross-coupling common-gate （CG） topology to achieve wideband input matching and low noise figure （NF）. Inductive series-peaking is used for the LNA to obtain broadband flat gain in the whole 3.1-10.6 GHz band. Designed in 0.18 um CMOS technology, the LNA achieves an NF of 3.1-4.7 dB, an Sll of less than -10 dB, an S21 of 10.3 dB with ±0.4 dB fluctuation, and an input 3rd interception point （IIP3） of -5.1 dBm, while the current consumption is only 4.8 mA from a 1.8 V power supply. The chip area of the LNA is 1×0.94 mm^2.     

Noise-canceling and IP3 improved CMOS RF front-end for DRM/DAB/DVB-H applications

A CMOS RF (radio frequency) front-end for digital radio broadcasting applications is presented that contains a wideband LNA, I/Q-mixers and VGAs, supporting other various wireless communication standards in the ultra-wide frequency band from 200 kHz to 2 GHz as well. Improvement of the NF (noise figure) and IP3 (third-order intermodulation distortion) is attained without significant degradation of other performances like voltage gain and power consumption. The NF is minimized by noise-canceling technology, and the IP3 is improved by using differential multiple gate transistors (DMGTR). The dB-in-linear VGA (variable gain amplifier) exploits a single PMOS to achieve exponential gain control. The circuit is fabricated in 0.18-μm CMOS technology. The S_(11) of the RF front-end is lower than -11.4 dB over the whole band of 200 kHz-2 GHz. The variable gain range is 12-42 dB at 0.25 GHz and 4-36 dB at 2 GHz. The DSB NF at maximum gain is 3.1-6.1 dB. The IIP3 at middle gain is -4.7 to 0.2 dBm. It consumes a DC power of only 36 mW at 1.8 V supply.     

42GHz 波段接收机前端的设计与研制*

伴随着无线通信技术日新月异的发展,人们对宽频带、高速率、大容量通信系统的需求也日益增大.毫米波由于自身具有波长短、传输容量大等优点,日益受到研究人员的广泛关注和青睐.本文针对42GHz频段点对点高速通信应用,设计研制了该频段的毫米波接收机前端.该前端由三级低噪声放大器(LNA)、一级混频器和一个基片集成波导(siw)镜像抑制滤波器构成.射频(RF)信号工作在40.8GHz～ 42.8GHz频段内,中频(IF)固定在3.5GHz.测试结果显示,在工作频段内其变频增益大于15dB,射频输入功率ldB增益压缩点不低于-30dBm,接收机前端的噪声系数(NF)小于6dB.     

A low-power,low-noise and high linearity 60 GHz wideband CMOS low-noise amplifier for wireless personal area network (WPAN) systems

A low power and low noise figure (NF) 60 GHz wideband low-noise amplifier (LNA) with excellent phase linearity for wireless personal local network (WPAN) systems using standard 90 nm CMOS technology is reported. To achieve sufficient power gain (S₂₁) and reverse isolation (S₁₂), the LNA comprises a common-source (CS) stage followed by a cascode stage and a CS stage. The LNA consumes 14.1 mW, achieving S₁₁ better than ?10 dB for frequencies 55.1–59.5 GHz, S₂₂ better than ?10 dB for frequencies 55.1–59.4 GHz, S₁₂ better than ?42.6 dB for frequencies 50–64 GHz, and group delay variation smaller than ±13.25 ps for frequencies 50.4–63 GHz. Additionally, high and flat S₂₁ of 9.9 ± 1.5 dB is achieved for frequencies 50.4–62.9 GHz, which means the corresponding 3-dB bandwidth is 12.5 GHz. Furthermore, the LNA achieves minimum NF of 3.88 dB at 55.5 GHz and NF of 4.73 ± 0.85 dB for frequencies 50–63.5 GHz, one of the best NF results ever reported for a 60 GHz CMOS LNA.     

2～12 GHz CMOS超宽带低噪声放大器设计

提出了一种基于双反馈电流复用结构的新型CMOS超宽带(UWB)低噪声放大器(LNA),放大器工作在2～12 GHz的超宽带频段,详细分析了输入输出匹配、增益和噪声系数的性能。设计采用TSMC 0.18μm RF CMOS工艺,在1.4 V工作电压下,放大器的直流功耗约为13mW(包括缓冲级)。仿真结果表明,在2～12 GHz频带范围内,功率增益为15.6±1.4 dB,输入、输出回波损耗分别低于-10.4和-11.5 dB,噪声系数(NF)低于3 dB(最小值为1.96 dB),三阶交调点IIP3为-12 dBm,芯片版图面积约为712μm×614μm。     

An ultra-wide-band 3.1-10.6 GHz LNA design in 0.18 μm SiGe BiCMOS

A two-stage monolithic ultra-wide-band (UWB) low-noise-amplifier (LNA) designed for MB-OFDM in 0.18 μm SiGe BiCMOS process is presented. With an optimized configuration combining advantages of RES-feedback and LC-ladder matching structure, the adjustable wide input matching is got and noise figure (NF) is controlled to a relevant low status. The measured S21 is from 7.6 to 14.2 dB over the 3-11 GHz operating band, NF is from 3.2 dB to 4.8 dB. With a 2.5 V power supply, the LNA has an overall power consumption of 14.5 mW.     

A Reconfigurable Low-Noise Amplifier Using a Tunable Active Inductor for Multistandard Receivers

A reconfigurable low-noise amplifier (LNA) based on a high-value active inductor (AI) is presented in this paper. Instead of using a passive on-chip inductor, a high-value on-chip inductor with a wide tuning range is used in this circuit and results in a decrease in the physical silicon area when compared to a passive inductor-based implementation. The LNA is a common source cascade amplifier with RC feedback. A tunable active inductor is used as the amplifier output load, and for input and output impedance matching, a source follower with an RC network is used to provide a 50 Ω impedance. The amplifier circuit has been designed in 0.18 µm CMOS process and simulated using the Cadence Spectra circuit simulator. The simulation results show a reconfigurable frequency from 0.8 to 2.5 GHz, and tuning of the frequency band is achieved by using a CMOS voltage controlled variable resistor. For a selected 1.5 GHz frequency band, simulation results show S ₂₁ (Gain) of 22 dB, S ₁₁ of ?18 dB, S ₂₂ of ?16 dB, NF of 3.02 dB, and a minimum NF (NFmin) of 1.7 dB. Power dissipation is 19.6 mW using a 1.8 V dc power supply. The total LNA physical silicon area is (200×150) µm².     

A 2.5-GHz BiCMOS transceiver for wireless LAN's

A BiCMOS transceiver intended for spread spectrum applications in the 2.4-2.5 GHz band is described. The IC contains a low-noise amplifier (LNA) with 14 dB gain and 2.2 dB NF in its high-gain mode, a downconversion mixer with 8 dB gain and 11 dB NF, and an upconversion mixer with 17 dB gain and P_{-1 dB} of +3 dBm out. An on-chip local oscillator (LO) buffer accepts LO drive of -10 dBm with a half-frequency option allowed by an on-chip frequency doubler. Power consumption from a single 3-V supply is 34 mA in transmit mode, 21 mA in receive mode, and 1 μA in sleep mode