一种外部可调折返式LDO过流保护电路

基于0.18 μm BCD工艺,提出了一种外部可调、带限流的折返式LDO过流保护电路。该电路同时具有限流和折返功能。限流部分通过电流镜构成的环路箝位最大输出电流,折返部分通过误差放大器构成的负反馈环路产生与输出电压成比例的电流折返输出电流。与传统过流限结构相比,新结构可降低功耗,保护功率管不被烧毁;与传统折返式结构相比,新结构可通过调节外部电阻方便地调节过流限与折返点电压,避免了稳压器的闩锁现象。在1.2 V典型输出下,LDO电路的仿真验证结果表明,在调节四组不同的外部电阻值条件下,过流限范围为215~350 mA,折返电压范围为450~900 mV,输出短路时,功率管的功耗降至230 mW。     

一种具有折返电流限保护的低噪声LDO

针对传统片外电容型LDO噪声较差的问题,基于180 nm BCD工艺,设计了一款具有折返电流限保护功能的低噪声LDO电路。基准与误差放大器间插入一阶RC低通滤波器,可滤除基准输出高频噪声,并取消传统LDO电路中的反馈电阻,从而降低噪声。通过折返电流限保护电路实现限流和折返功能。合理设置短路电流,有效避免LDO在启动或恢复过程中进入锁定状态。仿真结果表明,LDO在输入电压为4~5 V时可稳定输出2 V电压,最大带载电流为70 mA,过流限为120 mA。典型情况下的噪声功率谱在1 kHz处为12.7 nV/Hz,RMS噪声为3.6 μV。     

一种带过温过流过压保护的LDO设计

本文设计了一种带过温、过流和过压保护的低压差线性调整器,并采用增加零点方式进行补偿.电路设计采用2μm Bipolar工艺,用Hspice进行仿真验证.仿真结果表明,过温保护电路可以实现对电路的保护.当温度高于140℃时,过温保护电路将调整管关断,温度下降到105℃时,LDO恢复正常工作.最大输出电流为5A,超过最大输出电流时,过流保护电路将调整管关断.负载调整率不超过1％;电源调整率不超过0.1％..     

一种低功耗无电容型LDO的设计

提出了一种片上集成的低功耗无电容型LDO(low drop out)电路。该电路采用折叠型cascode运放作为误差放大器,通过消除零点的密勒补偿技术提高了环路稳定性;并在电路中加入了一种新的限流保护结构以保证输出电流过大时对LDO的输出进行保护。此外,在电路中加入了省电模式,可在保持LDO输出1.8 V情况下节省大于70%的功耗。该设计采用HHNEC 0.13μmCMOS工艺,仿真结果显示:在2.5~5.5 V电源供电、各个工艺角及温度变化条件下,LDO输出的线性调整率小于2.3 mV/V,负载调整率小于14μV/mA,温度系数小于27×10-6/℃;在正常工作模式下,整个LDO消耗85μA电流;在省电模式下仅消耗23μA电流。     

基于动态频率补偿的LDO电路设计

文中提出了一种基于动态频率补偿技术的LDO电路。通过添加电压缓冲器,提高了LDO的环路增益和瞬态响应特性。该电路通过电流镜采样调整管电流,使主极点频率与第三极点频率随负载电流的改变而产生相同倍数的变化,克服了LDO零极点随负载变化而导致环路稳定性变差的问题。文中设计采用中电二十四所HC12.BJT工艺,利用Spectre仿真工具进行仿真,研究了不同负载电流下该LDO的频率特性及其稳定性问题。仿真结果表明,该电路在10 μA~100 mA负载电流的变化范围内,LDO环路的相位裕度保持在50°~70°之间,证明提出的LDO调整器具有良好的稳定性。     

大电流，微功耗，小体积单片LDO的设计与实现

以设计输出电流为700 mA,静态电流为50μA,芯片面积为1.5 mm×2.0 mm的LDO线性稳压器为目标,提出的LDO电路利用基准电路的输出直接作为芯片的输出,用基准电路所固有的跨导放大器对输出进行检测并反馈至单级放大器,放大后输出至功率管的基极,控制功率管输出额定的电压和电流。无需冗余的误差放大器,使得环路补偿极为简单,不存在传统LDO的补偿难题。在电路上把传统LDO电路所需各个模块的功能糅合到了一个较为简单的电路中,大大减小了芯片面积,并且减小了静态电流。对电路进行了仿真分析并采用2μm 36 V Bipolar工艺生产实现,流片后的测试结果表明该芯片实现了大电流,微功耗,小体积的特性。     

具有边界限制的线性折返式电流限产生电路

提出了一种随温度折返式变化的电流限产生电路。该电路能起到系统级过温保护的作用。采用NTC热敏电阻来采样温度的变化信息,再放大后转换成电流,以便动态并线性地控制电流限。利用内嵌的多环路控制策略,动态引入边界限制调整环路,实现电流限的上限和下限箝位。基于标准0.35 μm CMOS工艺,对折返式电流限电路进行了实现与验证。仿真结果表明,当NTC热敏电阻上的电压大于500 mV或小于350 mV时,电流限设置电压分别维持在500 mV(上限)和250 mV(下限);当NTC热敏电阻上的电压在350~500 mV之间变化时,电流限电压会在上限与下限值之间随温度线性变化,变化率为1.67 mV/mV。     

一种高性能无片外电容型LDO设计北大核心CSCD

设计了一种高性能无片外电容型LDO线性稳压器.其中,EA采用推挽输出放大器设计,在静态时保持低功耗,瞬态响应时提供大的输出电流,提高LDO的响应速率.高环路增益使LDO电路具有很高的稳压精度;采用零点补偿技术,保证了LDO环路稳定性.LDO采用0.13μm CMOS工艺设计,仿真结果表明,在1.2V^2.0V输入电压下,LDO输出稳定的1.0V电压,输出负载电流为50μA^100mA,最大负载电容可达到100pF,低频PSR为-67.5dB@100mA^-85.5dB@50μA,负载调整率0.8μV/mA,LDO的静态电流为50μA,整体版图面积为0.016 3mm2.     

一种超低静态电流LDO线性稳压器的设计

为了延长便携式、可穿戴医疗设备的待机时间,设计了一种具有超低静态电流的低压差(LDO)线性稳压器。采用误差放大器与基准电路相结合的结构,在降低静态电流的同时减小芯片面积;其次,利用负载检测模块,降低了空载及轻载时过温保护和过流保护等模块的静态电流。采用自适应偏置电流技术来动态调整稳压环路各支路的工作电流以及零点频率补偿方式,解决了静态功耗与瞬态响应和环路带宽间的矛盾。该LDO线性稳压器采用0.35μm CMOS工艺进行流片加工,测试结果表明,该LDO线性稳压器静态电流为700 nA,最大负载电流为150 mA,轻载与满载跳变时上过冲电压为63 mV,下过冲电压为55 mV。     

基于CMOS工艺的低噪声高稳定性LDO的设计

介绍了一种LDO线性稳压器电路,给出了基本结构及其工作原理.重点分析了产生噪声的原因以及用旁路滤噪电路实现低噪声、用内部动态补偿电路实现高稳定性的电路结构和性能特点,针对输出短路或者负载电流过大设计了过流保护电路.整个电路采用HYNIX 0.5μm CMOS工艺实现,基于HSPICE进行仿真验证,输出噪声为1 μV(rms),典型环路增益为60 dB,相位裕度65°,证明了稳压器的低噪声和高稳定性.     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.     

GaAsSb/InAlAs PA DHBTs Grown by Production MBE

The epi material growth of GaAsSb based DHBTs with InAlAs emitters are investigated using a 4 × 100mm multi-wafer production Riber 49 MBE reactor fully equipped with real-time in-situ sensors including an absorption band edge spectroscope and an optical-based flux monitor. The state-of-the-art hole mobilities are obtained from 100nm thick carbon-doped GaAsSb. A Sb composition variation of less than ± 0.1 atomic percent across a 4 × 100mm platen configuration has been achieved. The large area InAlAs/GaAsSb/InP DHBT device demonstrates excellent DC characteristics,such as BVCEO＞6V and a DC current gain of 45 at 1kA/cm2 for an emitter size of 50μm × 50μm. The devices have a 40nm thick GaAsSb base with p-doping of 4. 5 × 1019cm-3 . Devices with an emitter size of 4μm × 30μm have a current gain variation less than 2% across the fully processed 100mm wafer. ft and fmax are over 50GHz,with a power efficiency of 50% ,which are comparable to standard power GaAs HBT results. These results demonstrate the potential application of GaAsSb/InP DHBT for power amplifiers and the feasibility of multi-wafer MBE for mass production of GaAsSb-based HBTs.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.