金属有机物化学气相淀积法生长的Si掺杂GaN薄膜的应力，结构与电学特性研究

The stresses, structural and electrical properties of n-type Si-doped GaN films grown by metaiorganic chemical vapor deposition （MOCVD） are systemically studied. It is suggested that the main stress relaxation is induced by bending dislocations in low doping samples. But for higher doping samples, as the Si doping concentration increases, the in-plane stresses in the grown films are quickly relaxed due to the rapid increase of the edge dislocation densities. Hall effect measurements reveal that the carrier mobility first increases rapidly and then decreases with increasing Si doping concentration. This phenomenon is attributed to the interaction between various scattering process. It is suggested that the dominant scattering process is defect scattering for low doping samples and ionized impurity scattering for high doping samples.     

RF-MBE Grown AlGaN/GaN HEMT Structure with High Al Content

A Si doped AlGaN/GaN HEMT structure with high Al content (x=43%) in the barrier layer is grown on sapphire substrate by RF-MBE.The structural and electrical properties of the heterostructure are investigated by the triple axis Xray diffraction and Van der PauwHall measurement,respectively.The observed prominent Bragg peaks of the GaN and AlGaN and the Hall results show that the structure is of high quality with smooth interface.The high 2DEG mobility in excess of 1260cm2／（V·s） is achieved with an electron density of 1.429e13cm－2 at 297K,corresponding to a sheet-densitymobility product of 1.8e16V－1·s－1.Devices based on the structure are fabricated and characterized.Better DC characteristics,maximum drain current of 1.0A/mm and extrinsic transconductance of 218mS/mm are obtained when compared with HEMTs fabricated using structures with lower Al mole fraction in the AlGaN barrier layer.The results suggest that the high Al content in the AlGaN barrier layer is promising in improving material electrical properties and device performance.     

欧姆接触金属退火对应力AlGaN/GaN异质结构中电子迁移率的影响

The influence of annealed ohmic contact metals on the electron mobility of a two dimensional electron gas （2DEG） is investigated on ungated AlGaN/GaN heterostructures and AlGaN/GaN heterostructure field effect transistors （AlGaN/GaN HFETs）. Current-voltage （I-V） characteristics for ungated AlGaN/GaN heterostructures and capacitance-voltage （C-V） characteristics for AlGaN/GaN HFETs are obtained, and the electron mobility for the ungated AlGaN/GaN heterostructure is calculated. It is found that the electron mobility of the 2DEG for the ungated AlGaN/GaN heterostructure is decreased by more than 50% compared with the electron mobility of Hall measurements. We propose that defects are introduced into the AlGaN barrier layer and the strain of the AlGaN barrier layer is changed during the annealing process of the source and drain, causing the decrease in the electron mobility.     

Effects of the ZnO buffer layer and Al proportion on AZO film properties

To evaluate the influence of the ZnO buffer layer and Al proportion on the properties of ZnO: Al (AZO)/ZnO bi-layer films, a series of AZO/ZnO films are deposited on the quartz substrates by electron beam evaporation. The X-ray diffraction measurement shows that the crystal quality of the films is improved with the increase of the film thickness. The electrical properties of the films are investigated. The carrier concentration and Hall mobility both increase with the increase of buffer layer thickness. However, the resistivity reaches the lowest at about 50 nm-thick buffer layer. The lowest resistivity and the maximum Hall mobility are both obtained at 1 wt% Al concentration. But the optical transmittance of all the films is greater than 80% regardless of the buffer layer thickness with Al concentration lower than 5 wt% in the visible region.     

有源层溅射温度对非晶铟镓锌氧薄膜晶体管电学特性的影响

The effect of active layer deposition temperature on the electrical performance of amorphous InGaZnO （a-IGZO） thin film transistors （TFTs） is investigated. With increasing annealing temperature, TFT performance is firstly improved and then degraded generally. Here TFTs with best performance defined as ＂optimized-annealed＂ are selected to study the effect of active layer deposition temperature. The field effect mobility reaches maximum at deposition temperature of 150℃ while the room-temperature fabricated device shows the best subthreshold swing and off-current. From Hall measurement results, the carrier concentration is much higher for intentional heated a-IGZO films, which may account for the high off-current in the corresponding TFT devices. XPS characterization results also reveal that deposition temperature affects the atomic ratio and Ols spectra apparently. Importantly, the variation of field effect mobility of a-IGZO TFTs with deposition temperature does not coincide with the tendencies in Hall mobility of a-IGZO thin films, Based on the further analysis of the experimental results on a-IGZO thin films and the corresponding TFT devices, the trap states at front channel interface rather than IGZO bulk layer properties may be mainly responsible for the variations of field effect mobility and subthreshold swing with IGZO deposition temperature.     

厚度对柔性衬底上制备的ZnO:Zr透明导电薄膜性能的影响

Transparent conducting zirconium-doped zinc oxide （ZnO：Zr） thin films with high transparency, low resistivity and good adhesion were successfully prepared on water-cooled flexible substrates （polyethylene glycol terephthalate, PET） by RF magnetron sputtering. The structural, electrical and optical properties of the films were studied for different thicknesses in detail. X-ray diffraction （XRD） and scanning electron microscopy （SEM） revealed that all the deposited films are polycrystalline with a hexagonal structure and a preferred orientation perpendicular to the substrate. The lowest resistivity achieved is 1.55 × 10-3 Ω·cm for a thickness of 189 nm with a Hall mobility of 17.6 cm2/（V·s） and a carrier concentration of 2.15×1020 cm-3. All the films present a high transmittance of above 90% in the wavelength range of the visible spectrum.     

硼掺杂硅薄膜及其在叠层电池隧道结中的应用

Boron-doped hydrogenated silicon films with different gaseous doping ratios（B2H6/SiH4） were deposited in a plasma-enhanced chemical vapor deposition（PECVD） system.The microstructure of the films was investigated by atomic force microscopy（AFM） and Raman scattering spectroscopy.The electrical properties of the films were characterized by their room temperature electrical conductivity（σ） and the activation energy（Ea）.The results show that with an increasing gaseous doping ratio,the silicon films transfer from a microcrystalline to an amorphous phase,and corresponding changes in the electrical properties were observed.The thin boron-doped silicon layers were fabricated as recombination layers in tunnel junctions.The measurements of the I-V characteristics and the transparency spectra of the junctions indicate that the best gaseous doping ratio of the recombination layer is 0.04,and the film deposited under that condition is amorphous silicon with a small amount of crystallites embedded in it.The junction with such a recombination layer has a small resistance,a nearly ohmic contact,and a negligible optical absorption.     

Uniformity of Electrical Parameters on MCT Epitaxy Film

For Hall measurement under different magnetic fields at LN2 temperature, Hg1-xCdxTe (MCT) film (radius 1 cm) grown on CdTe substrate by LPE is photoengraved into many small Van Der Pauw squares, then their Hall coefficients and mobilities are measured and analyzed, respectively. Two films were Hall-tested during the temperature range from LHe 4. 2K to about 200K. An actual impression on the uniformity of electrical parameters for MCT film can obtained by means of the methods presented in this paper.     

共蒸发方法制备GaSb多晶薄膜

We report optical and electrical properties of polycrystalline GaSb thin films which were successfully grown by co-evaporation on soda-lime glass substrates. The thin films have preferential orientation of the （111） direction. SEM results indicate that the average grain size of GaSb thin film is 500 nm with the substrate temperature of 560 ℃. The average reflectance of GaSb thin film is about 30% and the absorption coefficient is of the order of 10^4 cm^-1. The optical bandgap of GaSb thin film is 0.726 eV. The hole concentration shows a clear increasing trend as the Ga-evaporation-temperature/Sb-evaporation-temperature （TGa/Tsb） ratio increases. When the Ga crucible temperature is 810 ℃ and the antinomy crucible temperature is 415 ℃, the hole concentration of polycrystalline GaSb is 2 × 10^17 cm^-3 and the hole mobility is 130 cm^2/（V·s）. These results suggest that polycrystalline GaSb thin film is a good candidate for the use as a cheap material in TPV cells.     

Laser lift-off technique and the re-utilization of GaN-based LED films grown on sapphire substrate

A thin GaN LED film, grown on 2-inch-diameter sapphire substrates, is separated by laser lift-off. Atom force microscopy （AFM） and the double-crystal X-ray diffraction （XRD） have been employed to characterize the performance of Gan before and after the lift-off process. It is demonstrated that the separation and transfer processes do not alter the crystal quality of the GaN films obviously. InGaN/GaN multi-quantum-wells （MQW＇s） structure is grown on the separated sapphire substrate later and is compared with that grown on the conventional substmte under the same condition by using PL and XRD spectrum.     

Particular electrical quality of a-plane GaN films grown on r-plane sapphire by metal-organic chemical vapor deposition

Nonpolar (11(2)0) a-plane GaN films have been grown by low-pressure metal-organic vapor deposition on r-plane (1(1)02) sapphire substrate. The structural and electrical properties of the a-plane GaN films are investigated by high-resolution X-ray diffraction (HRXRD), atomic force microscopy (AFM) and van der Pauw Hall measurement.It is found that the Hall voltage shows more anisotropy than that of the c-plane samples; furthermore, the mobility changes with the degree of the van der Pauw square diagonal to the c direction, which shows significant electrical anisotropy. Further research indicates that electron mobility is strongly influenced by edge dislocations.     

MOCVD生长AlGaN/GaN/Si(111)异质结材料

利用MOCVD在Si(111)衬底上生长了无裂纹的GaN外延薄膜和AlGaN/GaN异质结构。通过优化Si衬底的浸润处理时间、AlN层厚度等参数获得了无裂纹的GaN外延薄膜,研究了SiN缓冲层和插入层厚度对AlGaN/GaN异质结电学性质的影响,2DEG的迁移率和面密度分别达到1410cm2/V.s和1.16×1013cm-2。     

A new buffer layer for MOCVD growth of GaN on sapphire

High quality GaN films have been grown on sapphire substrates (C face and A face) by atmospheric pressure metalorganic chemical vapor deposition (MOCVD) using a new buffer layer. With our reactor configuration and growth parameters, a GaN film grown on a single GaN buffer layer appears opaque with high density of hexagonal pits. Using a single A1N buffer layer results in extremely nonuniform morphology with mirror-like areas near the edge of the substrates and opaque areas in the center. The double buffer layer we report here, with GaN as the first layer and A1N as the second, each with an optimized thickness, leads to mirror-like films across the entire substrate. Scanning electron microscopy, photoluminescence, x-ray diffraction, and van der Pauw geometry Hall measurement data are presented to establish the quality of our films. The mechanism for this new buffer layer is also discussed.     

Anisotropy in the quantum lifetime in AlGaN/GaN heterostructures

Magnetoresistance measurements were performed on van der Pauw shaped AlGaN/GaN heterostructures grown on either sapphire or silicon carbide. These measurements revealed the presence of Shubnikov-de Haas oscillations. However, the amplitude of the oscillations originating from perpendicular van der Pauw positions were not isotropic. This anisotropy varied from sample to sample and within a sample its magnitude changed with the carrier density which was modulated by illumination as it induced a persistent photocurrent. The results of this study suggest the anisotropy is either a manifestation of electron density inhomogeneities and/or an indication of a nonuniform scattering mechanism arising from nonuniform interface roughness.     

Size dependence of hall mobility and dislocation density in Ge heteroepitaxial layers grown by MBE on a SiO2 patterned Si template

We have investigated the size dependent properties of the Hall mobility and etch pit dislocations (EPDs) in germanium (Ge) heteroepitaxial layers. Pure Ge thin films were grown by molecular beam epitaxy (MBE) using pattern guided growth at 650 °C and compared with homoepitaxially grown films. The results show enhanced Hall mobility and lower dislocation density as the pattern size decreases. The number of EPDs was decreased by one order of magnitude and the Hall mobility measured with different sizes of van der Pauw patterns was enhanced by two times as the pattern size was decreased from 200×200 μm² to 3×3 μm². Raman spectroscopy was also employed to characterize residual strain and crystalline quality of the epitaxial films with respect to the pattern size. We conclude that nano-scale pattern guided heteroepitaxial growth of Ge may be a plausible method for monolithic integration of Ge optoelectronic or electronic devices onto a Si substrate.     

Substrate temperature effect on the photophysical and microstructural properties of fluorine-doped tin oxide nanoparticles

Transparent conducting oxide of fluorine-doped tin oxide (FTO) thin films was deposited from chemical solutions of tin chloride and ammonium fluoride using streaming process for electroless and electrochemical deposition (SPEED) at substrate temperature 450, 500, and 530 ℃ respectively. The effect of substrate temperatures on the microstructural properties such as crystallite size, dislocation density, micro strain, volume of the unit cell, volume of the nanoparticles, number of the unit cell, bond length and the lattice constants were examined using XRD technique. Only reflections from (110) and (200) planes of tetragonal SnO₂ crystal structure were obvious. The peaks are relatively weak indicating that the deposited materials constitute grains in the nano dimension. Hall measurements, which were done using van der Pauw technique, showed that the FTO films are n-type semiconductors. The most favorable electrical values were achieved for the film grown at 530 ℃ with low resistivity of 7.64×10^-4Ω·cm and Hall mobility of -9.92 cm²/(V·s).     

GaAs PHEMT材料中2DEG浓度的控制与测试研究

设计并使用分子束外延(MBE)方法制备了不同帽层厚度、不同掺杂浓度的双平面掺杂GaAs PHEMT外延材料,采用不同工艺手段控制InGaAs沟道异质结界面的平滑程度。采用非接触霍尔方法对样品二维电子气(2DEG)浓度及迁移率进行测试,并用范得堡法对实验结果加以验证。结果表明,平整异质结界面生长技术能有效控制高迁移率2DEG浓度分布;与范德堡法相比,非接触霍尔方法无破坏性、测试结果可靠,该结果可以用来分析多层结构的PHEMT外延材料中InGaAs沟道界面的生长情况。     

Preparation and characterization of aluminum-incorporated cadmium oxide films

Opto-electronic and photovoltaic solar cell technologies which are developing day by day need novel and alternative materials. Also, economic cost is the other important parameter when producing and using these materials. With this purpose, we have prepared aluminum-incorporated CdO films by ultrasonic spray pyrolysis (USP) technique. Firstly, elemental analyses were performed to observe the distribution rate of Al in the structure. We have attempted to explain the structural and electrical properties of these films in detail. The crystalline structure was studied by X-ray diffraction (XRD). Besides, some structural parameters such as texture coefficient, grain size and dislocation density were calculated. Van der Pauw and Hall measurements were used to investigate the electrical properties. Electrical conductivity, carrier concentration and mobility values were determined for all films. Finally, we conclude that Al-incorporated CdO films with low Al concentrations will be promising materials for future works because of their high conductivity and mobility values as compared to others.     

常压MOCVD生长的ZnO薄膜的电学性能

利用常压MOCVD法在蓝宝石(0001)衬底上沉积了非故意掺杂ZnO单晶薄膜．用Van der Pauw法测量了其从15K到室温的载流子浓度和霍耳迁移率，并用双层结构单施主模型对载流子浓度和迁移率进行了拟合分析．研究表明：ZnO薄膜浅施主能级为20.4meV，温度较低时，以电离杂质散射为主，温度较高时，以极性光学波散射为主．     

The effect of GaN and ain buffer layers on GaN film properties grown on both C-plane and A-plane sapphire

This paper presents a comparative study of the properties of GaN grown by organometallic vapor phase epitaxy, using both a GaN and A1N buffer layer, as a function of sapphire orientation (c-plane vs a-plane). Results are presented for varying the thickness of the buffer layer, varying the growth temperature of the GaN film, and also varying the ammonia/trimethylgallium mass flow ratio. The electron Hall mobilities of GaN films grown on an A1N buffer layer were, in general, higher compared to films grown using a GaN buffer layer. In addition, growth on a-plane sapphire resulted in higher quality films (over a wider range of buffer thicknesses) than growth on c-plane sapphire. The room temperature electron mobilities were also found to be dependent on, not only the growth temperature, but also the ammonia/trimethylgallium mass flow ratio.