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Ni金属诱导晶化非晶硅(a-Si:H)薄膜 总被引:1,自引:1,他引:0
对在氢化非晶硅薄膜(a-Si:H)上溅射金属Ni的样品进行金属诱导晶化(MIC)/金属诱导横向晶化(MILC),制备多晶硅薄膜(p-Si)的上艺及薄膜特性进行了研究。XRD测最结果表明非晶硅在500℃退火1h后就已经全部晶化。金属诱导晶化的优选晶向为(220).而且晶粒随退火时间的延长而长大。非晶硅薄膜样品500℃下退火6h后的扫描电镜照片显示,原金属镍覆盖区非晶硅全部晶化.晶粒均匀.平均晶粒大小约为0.3μm,而且已经发生横向晶化。EDS测试Ni在晶化的非晶硅薄膜中的原子百分含量分析表明,金属Ni在MILC过程中的作用只是催化晶化.除了少量残留在MILC多晶硅中外.其余的Ni原子都迁移至晶化的前沿。500℃下退火20h后样品的Raman测试结果也表明.金属离子向周边薄膜扩散.横向晶化了非晶硅薄膜。 相似文献
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利用Kr准分子激光器晶化非晶硅薄膜, 研究了不同的激光能量密度和脉冲次数对非晶硅薄膜晶化效果的影响.利用X 射线衍射(XRD)和扫描电子显微镜(SEM)对晶化前后的样品的物相结构和表面形貌进行了表征和分析.实验结果表明, 在激光频率为1 Hz 的条件下, 能量密度约为180 mJ/cm2时,准分子激光退火处理实现了薄膜由非晶结构向多晶结构的转变;当大于晶化阈值180 mJ/cm2小于能量密度230 mJ/cm2时, 随着激光能量密度增大, 薄膜晶化效果越来越好;激光能量密度为230 mJ/cm2时, 晶化效果最好、晶粒尺寸最大, 约60 nm, 并且此时薄膜沿Si(111)面择优生长;脉冲次数50 次以后对晶化的影响不大. 相似文献
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首先阐述了MIC薄膜多晶硅材料动态镍吸杂技术的基本机理和主要工艺过程,然后以多晶硅薄膜晶体管(poly-Si TFT)为例研究了动态吸杂技术的应用.在研究金属诱导晶化多晶硅材料(MIC poly-Si)和以之为有源层的poly-Si TFT的过程中,发现在MIC多晶硅薄膜中含有部分残余的镍成份.而大部分存在于对撞晶界的残余镍成份会造成大量的缺陷,这将导致TFT器件性能乃至整个系统的稳定性和可靠性的降低.为了改善MIC薄膜及器件质量,我们采用磷硅玻璃(PSG)动态镍吸杂技术,有效地吸除镍,降低多晶硅中镍的残留量,改善对撞晶界的缺陷密度,降低用之制备TFT的漏电流.该技术工艺过程简单,处理成本低,适合于大批量的工业化生产,有望成为制备高稳定性微电子器件与电路系统的必需工艺技术. 相似文献
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首先阐述了MIC薄膜多晶硅材料动态镍吸杂技术的基本机理和主要工艺过程,然后以多晶硅薄膜晶体管(poly-Si TFT)为例研究了动态吸杂技术的应用.在研究金属诱导晶化多晶硅材料(MIC poly-Si)和以之为有源层的poly-Si TFT的过程中,发现在MIC多晶硅薄膜中含有部分残余的镍成份.而大部分存在于对撞晶界的残余镍成份会造成大量的缺陷,这将导致TFT器件性能乃至整个系统的稳定性和可靠性的降低.为了改善MIC薄膜及器件质量,我们采用磷硅玻璃(PSG)动态镍吸杂技术,有效地吸除镍,降低多晶硅中镍的残留量,改善对撞晶界的缺陷密度,降低用之制备TFT的漏电流.该技术工艺过程简单,处理成本低,适合于大批量的工业化生产,有望成为制备高稳定性微电子器件与电路系统的必需工艺技术. 相似文献
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Maruf Hossain Husam H. Abu-Safe Hameed Naseem William D. Brown 《Journal of Electronic Materials》2006,35(1):113-117
The effects of hydrogen on aluminum-induced crystallization (AIC) of sputtered hydrogenated amorphous silicon (a-Si:H) were
investigated by controlling the hydrogen content of a-SiH films. Nonhydrogenated (a-Si) and hydrogenated (a-Si:H) samples
were deposited by sputtering and plasma-enhanced chemical vapor deposition (PECVD). All aluminum films were deposited by sputtering.
Hydrogen was introduced into the sputter-deposited a-Si films during the deposition. After deposition, the samples were annealed
at temperatures from 200°C to 400°C for different periods of time. X-ray diffraction (XRD) patterns were used to confirm the
presence and degree of crystallization in the a-Si:H films. For nonhydrogenated films, crystallization initiates at a temperature
of 350°C. The crystallization of sputter-deposited a-Si:H initiates at 225°C when 14% hydrogen is present in the film. As
the hydrogen content is decreased, the crystallization temperature increases. On the other hand, the crystallization initiation
temperature for PECVD a-Si:H containing 11at.%H is 200°C. Further study revealed that the crystallization initiation temperature
is a function, not only of the total atomic percent hydrogen in the film, but also a function of the way in which the hydrogen
is bonded in the film. Models are developed for crystallization initiation temperature dependence on hydrogen concentration
in a-Si:H thin films. 相似文献
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Ge诱导晶化多晶Si薄膜的制备及结构表征 总被引:1,自引:1,他引:0
采用测控溅射,通过Ge诱导晶化法在Si衬底上制备多晶Si薄膜.采用Raman光谱、X射线衍射(XRD)、原子力显微镜(AFM)及场发射扫描电镜(FESEM)等对所制备的薄膜进行表征.结果表明,当生长温度为800℃时,Ge有诱导非晶Si(a-Si)薄膜晶化的作用,所制备的多晶Si薄膜在(200)方向具有择优取向,且在此方... 相似文献
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Yong Woo Cboi Jeong No Lee Tae Woong Jang Byung Tae Ahn 《Electron Device Letters, IEEE》1999,20(1):2-4
Solid phase crystallization of amorphous silicon films for poly-Si thin film transistors (TFTs) has advantages of low cost and excellent uniformity, but the crystallization temperature is too high. Using a microwave annealing method, we lowered the crystallization temperature and shortened the crystallization time. The complete crystallization time at 550°C was within 2 h. The device parameters of TFTs with the poly-Si films crystallized by microwave annealing were similar to those of TFTs with the poly-Si films crystallized by conventional furnace annealing. The new crystallization method seems attractive because of low crystallization temperature, short crystallization time, and comparable film properties 相似文献
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The substrate effects on solid-phase crystallization of amorphous silicon (a-Si) films deposited by low-pressure chemical vapor deposition (LPCVD) using Si2H6 gas have been extensively investigated. The a-Si films were prepared on various substrates, such as thermally oxidized Si wafer (SiO2/Si), quartz and LPCVD-oxide, and annealed at 600 °C in an N2 ambient for crystallization. The crystallization behavior was found to be strongly dependent on the substrate even though all the silicon films were deposited in amorphous phase. It was first observed that crystallization in a-Si films deposited on the SiO2/Si starts from the interface between the a-Si and the substrate, so called interface-induced crystallization, while random nucleation process dominates on the other substrates. The different kinetics and mechanism of solid-phase crystallization is attributed to the structural disorderness of a-Si films, which is strongly affected by the surface roughness of the substrates. 相似文献
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I. D. Calder K. L. Kavanagh H. M. Naguib C. Brassard J. F. Currie P. Depelsenaire R. Groleau 《Journal of Electronic Materials》1982,11(2):303-320
Glow discharge hydrogenated amorphous Si films were crystallized using a cw Ar laser. The properties of the crystallized films
were studied by optical and electron microscopy, electrical measurements and elastic recoil detection (ERD) analysis. In addition,
a preferential plasma etching technique was used to determine the degree of crystallization. Large (>3 μm) high quality crystallites
were induced above a threshold laser power of 100 W/cm by an explosive crystallization process. This was accompanied by the
formation of bubbles and ejection of material from the crystallization centers. The sheet resistivity decreased by five to
six orders of magnitude. Some 50–90% of the hydrogen remained in the films after laser annealing. A simple model shows that
solid state diffusion accounts for the final hydrogen distribution in the laser annealed films. The use of this material for
the fabrication of devices on glass substrates is discussed. 相似文献
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激光制备多层薄膜及铁电性能的研究 总被引:3,自引:2,他引:1
利用脉冲准分子激光淀积(PLD)方法,在Si基片上制备了BIT/Si〔100〕、PZT/BIT/Si〔100〕和BIT/PZT/BIT/Si〔100〕铁电薄膜。用XRD分析了多层铁电薄膜的晶相结构;用Sawyer-Tower电路研究了这些单层和多层铁电薄膜的铁电性能。结果表明,单层BIT的矫顽场Ec为4kV/cm,剩余极化强度为3.4μC/cm2;PZT/BIT的矫顽场Ec为82kV/cm,剩余极化强度Pr为36μC/cm2;BIT/PZT/BIT夹层铁电薄膜的矫顽场Ec为57kV/cm,剩余极化强度Pr为29μC/cm2。最后讨论了薄膜的铁电性能与多层结构的关系 相似文献
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对Si(111)和Si(100)衬底上用化学气相沉积法制成的TiO2薄膜进行了不同温度的热处理,并用原子力显微镜对处理后薄膜的形貌变化进行了观察。X-射线衍射分析表明形貌变化过程即晶化过程。晶化物相为金红石。晶化程度(或形貌变化程度)与热处理的温度有次数(或热处理时间)有关。Si(111)衬底上TiO2晶化形貌为杂乱分布的柱状、板状,定向不好;而Si(100)衬底上TiO2晶化形貌为定向较好的四方柱状或板状,这是因为Si(100)与金红石(001)都属四方对称结构,两相结构在此方向上容易匹配的结果。在相同热处理条件下,Si(111)衬底比Si(100)衬底上TiO2晶化程度高,说明非定向附生的晶化作用比定向附生的晶化作用容易实现。 相似文献