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热超声倒装焊在制作大功率GaN基LED中的应用 总被引:2,自引:0,他引:2
设计了适合于倒装的大功率GaN基LED芯片结构,在倒装基板硅片上制作了金凸点,采用热超声倒装焊接(FCB)技术将芯片倒装在基板上.测试结果表明获得的大面积金凸点连接的剪切力最高达53.93 g/bump,焊接后的GaN基绿光LED在350 mA工作电流下正向电压为3.0 V.将热超声倒装焊接技术用于制作大功率GaN基LED器件,能起到良好的机械互连和电气互连. 相似文献
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胶粘引丝无法实现硅压力敏感芯片的小型化封装,无引线封装可以解决该问题。倒装焊接具有高密度、无引线和可靠的优点,通过对传统倒装焊接工艺进行适当的更改,倒装焊接可应用于压力敏感芯片的小型化封装。采用静电封接工艺在普通硅压力敏感芯片上制作保护支撑硅基片,在硅压力敏感芯片的焊盘上制作金凸点,调整倒装焊接的工艺顺序和工艺参数,实现了绝压型硅压力敏感芯片的无引线封装,为压力传感器小型化开辟了一条新路。试验结果表明该封装方式可靠性高,寿命长,具有耐恶劣环境的特点。 相似文献
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Jitesh Shah 《中国集成电路》2013,(12):48-50
与传统的引线键合应用相比,晶片倒装焊接在需要高信号密度和优异电气性能领域的器件』二得到了广泛应用。由于不再采用有电感效应的键合线,这使得晶片倒装焊接成为理想的连接方式,但是,如果没有很好的规划芯片I/O基底,并针对具体应用进行优化,那么.其性能优势会大打折扣。 相似文献
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Das N.C. Taysing-Lara M. Olver K.A. Kiamilev F. Prineas J.P. Olesberg J.T. Koerperick E.J. Murray L.M. Boggess T.F. 《Electronics Packaging Manufacturing, IEEE Transactions on》2009,32(1):9-13
The flip chip bonding process is optimized by varying the bonding pressure, temperature, and time. The 68times68 mid wave infrared (MWIR) LED array was hybridized onto Si-CMOS driver array with same number of pixels. Each pixel has two indium bumps, one for cathode and another for anode. Both LED array and CMOS drivers have 15-mum-square Indium bump contact pads. We used Karl Suss FC150 flip chip machine for bonding of CMOS driver array onto LED array. From the LED current-voltage characteristics, it is concluded that the optimized flip chip bonding process results in uniform contact and very low contact resistance. Both electrical and optical characteristics of LED array after flip chip bonding are presented. 相似文献
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红外焦平面探测器互连中的In缩球工艺 总被引:1,自引:0,他引:1
铟缩球工艺对红外焦平面探测器的互连很有帮助.依据所做的实验叙述了铟缩球工艺的过程,论述了铟缩球工艺能提高铟柱高度,减小高度差,及减低焊接压力等优点. 相似文献
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微电子封装中芯片焊接技术及其设备的发展 总被引:12,自引:2,他引:10
葛劢冲 《电子工业专用设备》2000,29(4):5-10
概述了微电子封装中引线键合、载带自动键合、倒装芯片焊料焊凸键合、倒装芯片微型焊凸键合等芯片焊接技术及其设备的发展 ,同时报告了世界著名封装设备制造公司芯片焊接设备的现状及发展趋势。 相似文献
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Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies 总被引:1,自引:0,他引:1
Gold to gold interconnection (GGI) flip chip bonding technology has been developed to bond the drive IC chip on the integrated circuit suspension used in hard disk drives. GGI is a lead free process where the Au bumps and Au bond pads are joined together by heat and ultrasonic power under a pressure head. The use of GGI flip chip assembly process will help to eliminate equipment parts and processing steps of the traditional flip chip C4 process and hence shortens the overall cycle time. With the integrated circuit suspension design, it becomes possible to assemble the drive IC chip close next to the magneto-resistive head slider on the suspension.This paper describes a flip chip bonding method joining the drive IC chip on integrated circuit suspension with GGI bonding. The reliability evaluations are concentrated on thermo-mechanical analysis, robustness and functional performance of the final assembly. GGI bonding for chip on suspension application is still relatively new and has not been achieved for volume use. Work is still being done to establish and extend the limits of the technology with regard to long term reliability. 相似文献