nMOSFET中衬底偏压对衬底电流的影响研究

研究了基于90 nm CMOS工艺的nMOSFET中正负衬底偏压VB对衬底电流IB的影响.衬底电流IB在0 V＜VG＜1 V时变化比较明显,IB随VB正偏压的增加而增大,随VB负偏压的增加而减小.这是因为在这一区间内对IB起主导作用的漏电流ID主要为亚阈值电流,而VB对与亚阈值电流紧密相关的阈值电压VTH会产生较大影响.进一步研究发现,衬底电流峰值IBMAX与VB在半对数坐标下呈线性关系.实验结果验证了VB对IB的这一影响机制在不同VD下的普适性.给出了相关的物理机制.     

不同频率下介电材料偏压温度特性测试

在分析加偏方法、所用元件、线路残量、加偏电压与相关元件功率的关系与保护方式的基础上,构置了可用于偏压下介电材料的电容量 Ｃｘ 及损耗 ｔａｎ δ不同频率下温度特性测试装置。实验证明,该套装置可对样品不同偏压下的电容量和损耗的温度特性直接显示,并具有偏压范围宽,对不同偏压下介质材料可以在 ０．５ Ｈｚ～１ Ｍ Ｈｚ 的频率范围进行温度特性测试。     

体缺陷性质对晶硅电池暗 I-V 特性的影响

采用有限差分法等方法研究了晶硅材料体内不同类型缺陷对晶硅电池暗I-V特性的影响。研究表明:晶硅电池暗I-V特性的自然对数曲线可分为三个基本区域;随受主型、施主型和复合中心型缺陷密度的增加,电池的开路电压、短路电流、填充因子和效率等参数均发生退化;在反向偏压下,受主型缺陷的密度增加,不会引起不同偏压下晶硅电池暗电流的明显变化,但施主型和复合中心型缺陷密度大于某阈值时,会引起各偏压下晶硅电池暗电流出现明显变化;在正向偏压下,受主型缺陷可很好地保持晶硅电池暗I-V特性曲线基本性质,但施主型和复合中心型缺陷密度大于某阈值时,会导致晶硅电池暗I-V特性曲线的性质发生明显变化。     

流体静压力下Hg_(1-x)Cd_xTe p-n结的伏安特性

在77K和室温下,研究了Hg_(1-x)Cd_xTe(x=0.5)p—n结伏安特性随流体静压力的变化,从中得到了禁带宽度E_g的压力系数。结果表明,在低压范围(01.4GPa),E_g～P关系明显偏离线性。实验还观察到,在正、反向小偏压区域,I—V特性随压力的变化呈现“反常”行为。     

衬底负偏压对Ni-Mn-Ga形状记忆薄膜成分及形貌的影响

采用能谱仪(EDS)和原子力显微镜(AFM)对不同衬底负偏压下射频磁控溅射法制备的Ni-Mn-Ga形状记忆薄膜进行了成分和形貌的分析.研究发现:当衬底负偏压在5～30V范围变化时,薄膜中的Ni含量随偏压的增加呈先减少后增加的趋势,在偏压为10V时,达到最小值52.84％(摩尔分数,下同).Ga含量的变化趋势恰好与Ni相...     

选区外延生长半极性GaN材料上的肖特基接触特性

半极性GaN材料的研究在光电器件和电子器件领域有重要意义.采用选区外延生长技术在Si衬底上生长半极性GaN材料,并制备肖特基势垒二极管(SBD).通过测量SBD在不同温度下的Ⅰ-Ⅴ特性曲线,观察到电流的大小随着温度的增加而增加,且受反向偏压影响,证明半极性GaN基SBD的电流传输机制为热电子场发射模型.光致发光光谱和X射线光电子能谱测试进一步表明,相比极性c面GaN材料,半极性GaN材料表面存在较高的氧杂质原子浓度和氮空位,此为半极性GaN肖特基特性偏离热电子发射模型的主要因素.     

Te掺杂的GaSb材料载流子特性研究

非故意掺杂的GaSb材料呈现p型导电,限制了GaSb材料在InAs/GaSb超晶格红外探测器等领域的应用。探究N型GaSb薄膜电学特性对估算超晶格载流子浓度以及制备超晶格衬底、缓冲层、电极接触层等提供了一定的理论依据。Te掺杂能够以抑制GaSb本征缺陷的方式实现N型GaSb薄膜的制备,利用分子束外延(Molecular Beam Epitaxy,MBE)技术,设置GaTe源温分别为420℃、450℃、480℃,分别在GaSb衬底与GaAs衬底上生长不同GaTe源温度下掺杂的GaSb薄膜,通过霍尔测试探究GaSb薄膜的电学特性。在77 K的霍尔测试中,发现在GaAs衬底上生长的GaSb薄膜均显示为N型半导体,载流子浓度随源温升高而增加。与非故意掺杂的GaSb相比,源温为420℃、450℃时由于载流子浓度增加而导致的杂质散射,迁移率大幅提高,且随温度升高而增加,但在480℃时,由于缺陷密度减小,迁移率大大减小。在GaSb衬底上生长7000  Be掺杂的GaSb缓冲层,再生长5000  Te掺杂的GaSb薄膜。结果发现,由于P型缓冲层的存在,当源温为420℃时,薄膜显示为P型半导体,空穴载流子的存在导致薄膜整体载流子浓度增加,且空穴和电子的补偿作用使迁移率大幅降低。源温为450℃、480℃时,薄膜仍为N型半导体,载流子浓度随温度增加,且为GaAs衬底上生长的GaSb薄膜载流子浓度的2～3倍;迁移率在450℃时最高,480℃时减小。设置GaTe源温为450℃时GaSb薄膜的载流子浓度较高且迁移率较高,参与超晶格材料的制备能够使整个材料的效果最佳。     

温度对高速微晶硅薄膜沉积速率及其特性的影响

采用超高频(VHF)结合高压(HP)的技术路线,在较高SiH4浓度(SC)下实现了微晶硅(μc-Si:H)薄膜的高速沉积,考察了衬底温度在化学气相沉积(CVD)过程中对薄膜的生长速率以及光电特性的影响.结果表明:薄膜微结构特性随衬底温度变化是导致薄膜电学特性随衬底温度变化的根本原因;HP与低压条件下沉积的μc-Si:H薄膜的特性随温度变化的规律不同,在试验温度范围内,HP高速沉积的μc-Si:H薄膜生长速率不同于低压时随温度升高而下降的趋势,而是先增大后趋于平稳,晶化率随温度升高也不是单调增加,而是先增加后减小.     

有机衬底和玻璃衬底ZnO:Al透明导电膜的结构及光电特性对比研究

讨论了在低温条件下制备的ZnO∶Al薄膜的结构、表面形貌和光电特性,对聚酰亚胺(Polyimide,PI)和玻璃两种不同衬底的薄膜进行了比较研究。两种不同衬底的薄膜均为多晶膜,具有六角纤锌矿结构,最佳取向均为(002)方向,衬底温度从室温到210℃时,制备的薄膜密度变化范围为4.6～5.16g/cm3。在柔性衬底和玻璃衬底上制备的薄膜最低电阻率分别为5.3×10-4Ω·cm和5.1×10-4Ω·cm,薄膜在可见光区的平均透过率分别达到了72%和85%,讨论了两种衬底薄膜电学特性的稳定性。     

pMOSFET中栅控产生电流的衬底偏压影响研究

研究了pMOSFET中栅控产生电流(GD)的衬底偏压特性。衬底施加负偏压后,GD电流峰值变小;衬底加正向偏压后,GD电流峰值增大。这归因于衬底偏压VB调制了MOSFET的栅控产生电流中最大产生率,并求出了衬底偏压作用系数为0.3。考虑VB对漏PN结的作用,建立了包含衬底偏压的产生电流模型。基于该模型的深入分析,很好地解释了衬底负偏压比衬底正偏压对产生电流的影响大的实验结果。     

Estimation of Electrical Parameters of OD Organic Semiconductor Diode from Measured I‐V Characteristics

In this paper the effect of temperature on the electrical properties of organic semiconductor disperse orange dye 25 (OD) have been examined. Thin films of OD have been deposited on In₂O₃ substrates using a centrifugal machine. DC current‐voltage (I‐V) characteristics of the fabricated devices (Al/OD/In2O3) have been evaluated at varying temperatures ranging from 40 to 60°C. A rectification behavior in these devices has been observed such that the rectifying ratio increases as a function of temperature. I‐V characteristics observed in Al/OD/In2O3 devices have been classified as low temperature (≤ 50°C) and high temperature characteristics (approximately 60°C). Low temperature characteristics have been explained on the basis of the charge transport mechanism associated with free carriers available in OD, whereas high temperature characteristics have been explained on the basis of the trapped space‐charge‐limited current. Different electrical parameters such as traps factor, free carrier density, trapped carrier density, trap density of states, and effective mobility have been determined from the observed temperature dependent I‐V characteristics. It has been shown that the traps factor, effective mobility, and free carrier density increase with increasing values of temperature, whilst no significant change has been observed in the trap density of states.     

Measurement of the temperature dependence of the I/SUB C/(V/SUB be/) characteristics of integrated bipolar transistors

The temperature dependence of the I/SUB C/(V/SUB be/) relationship of bipolar transistors can be characterized by two parameters /spl eta/ and V/SUB go/. The authors discuss a new method for the determination of these parameters. With this method there is no need for accurate temperature measurements. It is shown that the results fit very well with bandgap-reference temperature characteristics. An analytical method for the calculation of V/SUB g0/ and /spl eta/ from values of the base emitter voltage or the bandgap reference voltage at different temperatures is presented.     

甚长波碲镉汞光伏探测器伏安特性分析

分析了注入同质结N on P和液相外延异质结P on N碲镉汞甚长波红外探测器在不同工作温度下的I V特性,并对R V特性进行了仿真计算,对比了扩散电流、产生-复合电流、表面漏电流、带间隧穿电流和缺陷辅助隧穿电流等暗电流对两种器件R V特性的不同影响。     

SnO_2压敏材料势垒电压的测量

依照缺陷势垒模型 ,将压敏电阻器视为双向导通的二极管 ,应用半导体理论对低电压情况下的电流 -电压关系数据进行了处理 ,得到了 Sn O2 - Zn O- Nb2 O5压敏材料的势垒电压。选取的 4个测量温度得到的结果是相同的 ,保证了实验结果的正确性。     

硅单电子晶体管的制造及特性

报道了采用电子束光刻、反应离子刻蚀及热氧化等工艺,在p型SIMOX(separation by implanted oxygen)硅片上成功制造的一种单电子晶体管.特别是,提供了一种制造量子线和量子点的工艺方法,在器件的电流-电压特性上观测到明显的库仑阻塞效应和单电子隧穿效应.器件的总电容约为9.16aF.在77K工作温度下,也观测到明显的电流-电压振荡特性.     

The BER theoretical model and properties of SiPM‐based receiver for OOK optical communication

The bit error rate (BER) theory of silicon photomultiplier (SiPM) based on‐off keying optical communication receiver, which introduces photon equivalent threshold is established. The optical crosstalk effect, the dark counts, the amplitude fluctuations of output pulses of SiPM, the baseline fluctuation, the shape of the incident light pulse, the adjacent symbol interference as well as the photon detection efficiency (PDE) are considered in the theory model. The numerical result shows that the average minimum optical power required is much smaller than that of the avalanche photodiode‐based receivers under the same conditions. The BER of SiPM‐based optical communication receiver is very sensitive to the PDE and optical crosstalk (OC) probability of SiPM. For the application of digital optical communication, a SiPM with high PDE but low OC probability and low dark count rate is a preference, under the premise that the output pulse is fast enough. For the state‐of‐the‐art SiPMs, the dark count rate is small enough to obtain adequate BER, and the OC effect is not a big limitation of the performance of SiPM‐based receiver. Moreover, the amplitude fluctuation and the baseline fluctuation of the SiPM‐based receiver are not bottlenecks of the performance in practice.     

Investigation on the mechanism of charge generation in organic heterojunctions: Analysis of I–V and C–V characteristics

The charge generation mechanism of organic heterojunction (OHJ) consisted of 1,4,5,8,9,11-hexaazatriphenylene-hexacarbonitrile (HAT-CN) and different hole transporting materials (HTMs) are studied systematically by current-voltage (I–V) and capacitance-voltage measurements. The analysis of I–V characteristics of the devices based on OHJs at forward and reverse voltages by comparing the thickness of HTM layers finds that a forward and reverse symmetrical I–V curve is observed at thin HTM layers and the forward current becomes larger than the reverse current with the increase of HTM thickness, fully illustrating the effectiveness of OHJ charge generation. Moreover, the I–V characteristics at different temperatures indicate that the efficient charge generation is originated from electron tunneling rather than diffusion. And the C–V and capacitance-frequency (C–F)characteristics further illustrate the highly efficient charge generation ability of OHJs so that the charge density is as high as 4.5 × 10¹⁷ cm⁻³, guaranteeing the high conductivity of OHJs, which is very beneficial to developing highly efficient OLEDs using OHJs as charge injector and generator.     

1800 V NPN bipolar junction transistors in 4H-SiC

The first high voltage npn bipolar junction transistors (BJTs) in 4H-SiC have been demonstrated. The BJTs were able to block 1800 V in common emitter mode and showed a peak current gain of 20 and an on-resistance of 10.8 mΩ·cm² at room temperature (I_C=2.7 A @ V_CE=2 V for a 1 mm×1.4 mm active area), which outperforms all SiC power switching devices reported to date. Temperature-stable current gain was observed for these devices. This is due to the higher percent ionization of the deep level acceptor atoms in the base region at elevated temperatures, which offsets the effects of increased minority carrier lifetime at high temperatures. These transistors show a positive temperature coefficient in the on-resistance characteristics, which will enable easy paralleling of the devices     

Temperature dependence of DC and RF characteristics ofAlInAs/GaInAs HBT's

Device characteristics of compositionally graded AlInAs/GaInAs heterojunction bipolar transistors (HBTs) measured and analyzed from cryogenic temperatures up to 250°C are discussed. Excellent stability in DC and RF performance is observed at elevated temperatures, which is desirable for high-speed and high-density integrated circuit applications. DC current gain exhibits about 10% variation over the entire measured temperature range. F_T and f _max at 125°C decreased by approximately 10% from their room-temperature values while improving steadily when the device was cooled down to near-liquid-helium temperature, the common-emitter breakdown voltage is 8.0 V at room temperature and reduces to 7.5 V at 125°C. Likewise, the collector-base breakdown voltage and the base-emitter breakdown voltage reduce by about 0.5 V over the same temperature range. The breakdown voltages increase significantly at cryogenic temperatures. The low turn-on voltage and excellent low-temperature characteristics make the AlInAs/GaInAs HBT attractive for cryogenic applications     

3C-SiC/Si异质结二极管的高温特性

研究了低压化学气相淀积方法制备的n-3C-SiC/p-Si(100)异质结二极管(HJD)在300～480K高温下的电流密度-电压(J-V)特性.室温下HJD的正反向整流比(通常定义为±1V外加偏压下)最高可达1.8×104,在480K时仍存在较小整流特性,整流比减小至3.1.在300K温度下反向击穿电压最高可达220V.电容-电压特性表明该SiC/Si异质结为突变结,内建电势Vbi为0.75V.采用了一个含多个参数的方程式对不同温度下异质结二极管的正向J-V实验曲线进行了很好的拟和与说明,并讨论了电流输运机制.该异质结构可用于制备高质量异质结器件,如宽带隙发射极SiC/Si HBT等.