一种用于采保电路的宽带高增益放大器的设计

分析了跨导运算放大器的电路结构,采用两级放大电路,考虑到全差分结构中要使用共模反馈,用共源共基和共源共栅电路来实现电路的设计.同时对部分性能指标进行了优化,其中包括增益非线性引入的误差和不完全建立误差.设计了一种宽带高增益跨导放大器,利用0.35 μm Bi CMOS工艺条件下,Spectre仿真得到运算放大器的开环增益大于60 dB,单位增益带宽可达2.1 GHz,输出摆幅能达到1.5 V.     

一种高增益带宽CMOS全差分运算放大器的设计

介绍了一种采用折叠式共源共栅结构的高增益带宽全差分运算放大器的设计和实现,详细讨论了折叠式共源共栅放大器的电路结构、共源共栅偏置电路,以及开关电容共模反馈电路(SCCMFB).电路的设计基于CSMC 0.5μm DPTM 5V混合信号工艺.仿真结果表明,该电路在5V电源电压下具有64 dB直流开环增益、155 MHz单位增益带宽.通过在一款ADC电路中流片验证,该放大器达到设计指标要求.     

一种高增益带宽积高摆率运算跨导放大器

运算放大器(OTA)是模拟和混合信号集成电路中重要的构成模块，在各类电路中有着广泛的应用，人们希望运算放大器能以低电源电压运行的同时保持高增益带宽积，这就对运算放大器的性能提出了一定的要求，对此，基于折叠式共源共栅结构提出了一种高增益带宽积高摆率的运算跨导放大器。该OTA基于0.18μm CMOS工艺设计，电路主要包含自适应偏置电路、反馈回路、折叠式共源共栅运算放大器等模块，利用自适应偏置电路代替差分输入对的尾电流源，提升动态电流和增益带宽积，通过反馈回路进一步提升电路性能。利用Cadence软件对电路进行仿真，仿真结果表明，在其他指标变化不大的前提下，该运放的增益带宽积和摆率相较于传统的折叠式共源共栅结构分别约提升了9倍和10倍。     

高性能CMOS运算放大器的设计

基于0.5μm标准CMOS工艺,利用折叠式共源共栅电路和简单放大器级联结构,设计了一种增益高、建立时间短、稳定性好和电源抑制比高的低压CMOS运算放大器.用Cadence Spectre对电路进行优化设计,整个电路在3.3V工作电压下进行仿真,其直流开环增益100.1dB,相位裕度59°,单位增益带宽10.1MHz,建立时间1.06μs.版图面积为410μm×360μm.测试结果验证了该运算放大器电路适用于电源管理芯片.     

一种高单位增益带宽CMOS全差分运算放大器

设计并讨论了一种高单位增益带宽CMOS全差分运算放大器。由于折叠共源共栅结构电路具有相对高的单位增益带宽以及开关电容共模反馈电路稳定性好、对运放频率特性影响小等优点,故设计的放大器采用了折叠共源共栅结构以及开关电容共模反馈电路技术,并达到了高单位增益带宽的设计目的。基于TSMC0·25μmCMOS工艺,仿真结果表明,在2·5V的单电源电压下,运算放大器的直流开环增益为70dB,单位增益带宽为500MHz。     

一种高增益三级运算放大器

提出了一种高增益三级运算放大器。采用五管全差分、套筒式共源共栅、典型共源级结构作为运算放大器的放大级,采用共模抑制电路、频率补偿电路、高摆幅偏置电路,提高了运算放大器的性能。结果表明,在3 V电源电压、4 pF负载电容的条件下,该运算放大器的开环直流增益为155 dB,单位增益带宽为112 MHz,相位裕度为84.1°,电源抑制比为151 dB,共模抑制比为-168 dB。该运算放大器的补偿电容较小,节省了面积。     

一款适用于高速读出电路的输出级运算放大器设计

〖JP+1〗CMOS运算放大器是红外探测器系统读出电路的重要模块,其性能直接影响红外读出电路性能。本文设计了一款适用于高速读出电路的输出级运算放大器,在负载电阻100 kΩ,负载电容25 pF的条件下,使读出电路的工作频率大于20 MHz。输出级运算放大器由折叠共源共栅差分运放和甲乙类推挽反相运放级联构成。折叠共源共栅差分运放可以实现电路高增益、大输出电压范围和高输出阻抗,同时可以有效减小放大器输入端的米勒电容效应。甲乙类推挽反相运放具有高电压电流转换效率,可以灵活地从负载得到电流或者向负载提供电流,实现高电流增益,驱动大负载。两级运放之间通过米勒电容实现频率补偿,保证运放的稳定性。本文设计的高速输出级运算放大器基于SMIC 018μm工艺设计,最终实现指标:功耗不大于10mW,运放增益>84dB,相位裕度79°,单位增益带宽>100 MHz,噪声78 μV(1～500 MHz),输出电压范围1～5 V,建立时间<15ns。通过设计高速输出级运算放大器,红外读出电路的读出速率和帧频得到有效提高。     

低电压高增益带宽CMOS折叠式共源共栅运算放大器设计

本文基于SIMC 0．18μm CMOS工艺模型参数,设计了一种低电压高单位增益带宽CMOS折叠式共源共栅运算放大器。该电路具有相对高的单位增益带宽,并具有开关电容共模反馈电路（CMFB）稳定性好、对运放频率特性影响小的优点,Hspice仿真结果表明,在1．8V电压下,运算放大器的直流开环增益为62．1dB,单位增益带宽达到920MHz。     

一种高性能共模反馈CMOS运算放大器

介绍了一种具有高增益,高电源抑制比(CMRR)和大带宽的两级共源共栅运算放大器。此电路在两级共源共栅运算放大器的基础上增加共模反馈电路,以提高共模抑制比和增加电路的稳定性。电路采用0.35μm标准CMOS工艺库,在Cadence环境下进行仿真。结果显示,该放大器增益可达到101 dB,负载电容为10 pF时,单位增益带宽大约为163 MHz,共模抑制比可达101dB,电路功耗仅为0.5 mW。     

一种低噪声高共模抑制比运算放大器的分析与设计

低噪声高共模抑制比的运算放大器是将套筒式共源共栅结构、差分输出和共模负反馈相结合,设计出的一种新型运算放大器.基于SMIC0.18 μm工艺模型对电路进行设计,仿真结果表明该电路的开环增益为82.3 dB,相位裕度为66°,共模抑制比为122 dB,增益平坦带宽为15 MHz,噪声为7.781 nV/sqrt （Hz）,达到设计要求.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.