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1.
利用二维器件模拟器MEDICI提取出重掺杂外延型衬底的电阻宏简化模型,所需的6个参数均可通过器件模拟得到,能够精确表征混合信号集成电路中的衬底噪声特性。基于0.25μm CMOS工艺所建立的电阻宏模型,设计了简单的混合信号电路进行应用验证,证明了该模型能够有效表征混合信号集成电路的衬底噪声。  相似文献   

2.
提出了一种基于二维器件模拟的深亚微米工艺外延型衬底的电阻宏模型.该宏模型通过器件模拟与非线性拟合相结合的方法建立,使衬底寄生参数的提取更加方便,同时保障了深亚微米电路特性的模拟精度.此外,该宏模型结构简单,可以得到与器件模拟基本一致的模拟结果,并可以方便地嵌入SPICE中进行一定规模的电路模拟.  相似文献   

3.
吴晓鹏  杨银堂  朱樟明 《半导体技术》2006,31(5):353-356,360
针对SOC中常见的衬底噪声耦合问题,通过将器件模拟与拟合法相结合,基于0.25 μ m CMOS工艺提取衬底结构参数建立了电阻宏模型.该模型被应用于CMOS放大器电路,利用Hspice进行仿真,仿真结果表明,该模型从时、频域角度都能较好地表征出衬底噪声对模拟电路性能的影响,对深亚微米混合信号电路设计具有重要的指导意义.  相似文献   

4.
通过对CMOS的PSP模型中四衬底电阻网络的等效电路进行Y参数分析,得到衬底电阻参数的完整提取方法.应用该方法提取了90nm CMOS工艺中射频nMOS器件的衬底电阻参数,实验数据和仿真比较表明该衬底电阻网络和相应的参数提取方法能精确预测器件的输出性能,模型精度确保使用频率可以达到20GHz以上.  相似文献   

5.
通过对CMOS的PSP模型中四衬底电阻网络的等效电路进行Y参数分析,得到衬底电阻参数的完整提取方法.应用该方法提取了90nm CMOS工艺中射频nMOS器件的衬底电阻参数,实验数据和仿真比较表明该衬底电阻网络和相应的参数提取方法能精确预测器件的输出性能,模型精度确保使用频率可以达到20GHz以上.  相似文献   

6.
衬底寄生网络建模和参数提取,对RF SOI MOSFET器件输出特性的模拟有着非常重要的影响。考虑BOX层引入的体区和Si衬底隔离,将源、体和衬底短接接地,测试栅、漏二端口S参数的传统测试结构,无法准确区分衬底网络影响。文章提出一种改进的测试结构,通过把SOI MOSFET的漏和源短接为信号输出端、栅为信号输入端,测试栅、漏/源短接二端口S参数的方法,把衬底寄生在二端口S参数中直接体现出来,并开发出一种解析提取衬底网络模型参数的方法,支持SOI MOSFET衬底网络模型的精确建立。采用该方法对一组不同栅指数目的SOI MOSFET进行建模,测量和模型仿真所得S参数在20GHz频段范围内得到很好吻合。  相似文献   

7.
射频高损耗硅基双互连线建模   总被引:1,自引:0,他引:1  
针对高损耗硅衬底,采用部分元等效电路法和准静磁积分公式,将衬底涡流等效为衬底镜像电流,建立射频硅基双互连线等效电路模型。该模型考虑了趋肤效应、邻近效应和衬底损耗对互连线串联电感Ls和串联电阻Rs频率特性的制约。通过与全波分析方法对比,验证了在20 GHz范围内由该模型导出的互连线等效电感L、等效电阻R误差均在8%以内。该模型可望应用于硅基射频集成电路设计。  相似文献   

8.
王新胜  喻明艳 《电子学报》2013,41(7):1448-1452
 本文提出了一个考虑衬底耦合效应的门延迟模型.该模型在考虑衬底耦合效应下转换CMOS反相器的延迟为等效电阻和电容(RC)网络延迟.考虑工艺参数扰动和衬底耦合效应对门延时的影响,建立基于工艺扰动的简单开关电容门延迟模型,结合随机配置法和多项式的混沌展开法分析门延时.利用数值计算方法对本模型和分析方法进行验证,结果表明与HSPICE精确模型仿真结果的相对误差小于2%,证明本模型和分析方法的有效性.  相似文献   

9.
数模混合电路衬底耦合模型研究   总被引:3,自引:1,他引:2  
刘庆华  胡俊  吴智  黄均鼐 《微电子学》2000,30(2):88-91,96
提出了数模混合集成电路衬底耦合噪声的一种建模方案将集成电路芯片的衬底划分为多个Voronoi图,计算各区域的R、C值,在将衬底RC网络映射到原电路网表之后,对新网表进行SPICE模拟,分析数模混合集成电路中的衬底噪声.用此模型模拟了两个数模混合集成电路的衬底耦合噪声,指出了在模拟电路关键器件周围加保护环是减少衬底耦合噪声的一种有效途径.  相似文献   

10.
在短沟道MOSFET器件物理的基础上,导出了其衬底电流解析模型,并通过实验进行了模型参数提取。模型输出与短沟MOSFET实测结果比较接近,可应用于VLSI/ULSI可靠性模拟与监测研究和亚微米CMOS电路设计。  相似文献   

11.
DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.  相似文献   

12.
High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET > PDMAT > TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.  相似文献   

13.
In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal (200) (2d = 0.4027 nm) is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line(w), the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line(x), the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines(y), the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line(z) in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line(q) in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution(λ/△ 2) is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.  相似文献   

14.
From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.  相似文献   

15.
The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.  相似文献   

16.
The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.  相似文献   

17.
Today, micro-system technology and the development of new MEMS (Micro-Electro-Mechanical Systems) are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.  相似文献   

18.
This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel's.  相似文献   

19.
This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.  相似文献   

20.
An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.  相似文献   

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