用于SDH-64光发射机的低功耗CMOS 4∶1复接器

介绍了可用于SDH STM-64光纤传输系统的4∶1复接器.整个电路采用树型结构,低速的复接单元采用动态双相伪NMOS逻辑实现,高速的复接单元采用SCL逻辑实现,提出了一种新型采用正反馈对的单端转双端电路,实现由低速单元到高速单元的逻辑变换.基于此结构的全定制单片集成电路采用0.18 μm CMOS工艺设计并实现.测试结果表明,在供电电压1.8 V,50 Ω负载条件下,复接输出数据速率超过10 Gbit/s,在标准速率10 Gbit/s,输出电压峰-峰值180 mV时,功耗仅为180mW,抖动4.9/s(rms),芯片面积为0.89 mm2×0.7 mm2.     

低功耗0.35μm3.125 Gbit/s CMOS 4:1复接器

采用CSM0.35μm CMOS工艺,设计了3.125 Gbit/s4:1复接器.系统采用树型结构,由两个并行的低速2:1复接单元和一个高速2:1复接单元级联而成.低速单元采用带有电平恢复的传输管逻辑实现,高速单元采用动态传输门逻辑实现.具体电路由锁存器、选择器、分频器以及输入输出缓冲组成.复接器芯片面积为0.675mm×0.6mm.3.3V电源电压下,芯片整体功耗小于130mW,核心功耗是25mW.最高工作速率可达4Gbit/s.     

低功耗0.35μm 3.125Gbit/s CMOS4∶1复接器

采用CSM0.35μm CMOS工艺,设计了3.125Gbit/s4∶1复接器.系统采用树型结构,由两个并行的低速2∶1复接单元和一个高速2:1复接单元级联而成.低速单元采用带有电平恢复的传输管逻辑实现,高速单元采用动态传输门逻辑实现.具体电路由锁存器、选择器、分频器以及输入输出缓冲组成.复接器芯片面积为0.675mm×0.6mm.3.3V电源电压下,芯片整体功耗小于130mW,核心功耗是25mW.最高工作速率可达4Gbit/s.     

低功耗0．35um CMOS 2．5Gb／s16：1复接器设计

采用0．35um CMOS工艺设计了用于光纤传输系统的低功耗16：1复接器，实现了将16路155．52Mb／s数据复接成路2．5Gb／s的数据输出的功能。该复接器以混合结构形式实现：低速部分采用串行结构，高速部分采用树型结构。具体电路由锁存器、选择器及分频器组成，以CMOS逻辑和源极耦合逻辑（SCL）实现。用Smart SPICE软件进行仿真的结果显示：在3．3V供电时，整体电路的复接输出最高工作速度可达3．5Gb／s，功耗小于300mW。     

基于0.25μm CMOS工艺的1.25Gb/s1:10分接器设计

介绍一种用于千兆以太网的1．25Gb／s分接器电路。该电路实现了1路1．25Gb／s高速差分数据到10路125Mb／s低速并行单端数据的分接功能。电路采用树型分接器结构进行设计，包含一个高速1：2分接器电路和两个低速1：5分接器电路。芯片采用台湾TSMC的0．25μm混合信号标准CMOS工艺进行设计，后仿真结果表明，所设计电路完全达到了千兆以太网的系统要求。可以工作在1．25Gb／s的数据速率上。     

10 Gbit/s GaAs 跨阻前置放大器

GaAs基pHEMT工艺适合于制作10Gbit／s速率的高速前置放大器电路。完成了工作于10Gbit／s速率的跨阻前置放大器电路的器件设计、电路设计,电路采用了串联电感L技术,有效地提高了工作带宽。模拟工作带宽达到9．0GHz,跨阻增益达到58dBt2。电路采用0．2pmGaAs基pHEMT电子束直写T型栅工艺制作。对制作的电路进行了电测试,可工作于10Gbit／s的速率。     

低功耗10Gb/s CMOS 1:4分接器

采用TSMC0．18μmCMOS工艺实现了一个应用于光纤通信系统SDHSTM-64的10Gb／s 1：4分接器,整个系统采用树型结构,由一个高速1：2分接单元,两个低速1：2分接单元。分频器,数据及时钟输入输出缓冲组成,其中高速分接单元采用共栅结构,单时钟输入的触发器实现;而低速分接单元则由动态CMOS逻辑实现,两个基本结构的使用都有利于降低功耗。该芯片工作速度最高达12．5Gb／s。功耗仅为120mW。     

一种25Gbit/s CMOS判决反馈均衡器设计

为满足高速光通信系统的应用，基于标准40 nm CMOS工艺设计了一款25 Gbit/s判决反馈均衡器(DFE)电路，采用半速率结构以降低反馈路径的时序要求。主体电路由加法器、D触发器、多路复用器和缓冲器组成，为了满足25 Gbit/s高速信号的工作需求，采用电流模逻辑(CML)进行设计。经过版图设计和工艺角后仿验证，该DFE实现了在25 Gbit/s的速率下可靠工作，能提供10 dB的均衡增益，峰-峰差分输出电压摆幅约为950 mV,眼图的垂直和水平张开度均大于0.9 UI,输出抖动小于3 ps,在1.1 V的电源电压下功耗为12.5 mW,芯片版图的面积为0.633 mm×0.449 mm。     

低功耗0.35μm CMOS 2.5Gb/s 16:1复接器设计

采用0.35μm CMOS工艺设计了用于光纤传输系统的低功耗16:1复接器,实现了将16路155.52Mb/s数据复接成一路2.5Gb/s的数据输出的功能.该复接器以混合结构形式实现:低速部分采用串行结构,高速部分采用树型结构.具体电路由锁存器、选择器及分频器组成,以CMOS逻辑和源极耦合逻辑(SCL)实现.用Smart SPICE软件进行仿真的结果显示:在3.3V供电时,整体电路的复接输出最高工作速度可达3.5Gb/s,功耗小于300mW.     

用于光纤传输系统的10Gbit/s CMOS 1:8分接器

采用TSMC 0.25μm RF CMOS工艺设计了一个应用于光纤传输系统的10Gbit/s CMOS 1:8分接器.整个系统采用树型结构,由3级1:2分接器、2级1:2分频器、级间缓冲器和输入、输出接口电路构成.为了适应高速度的要求,所有电路全都采用源极耦合场效应管逻辑来实现.使用SmartSpice进行了仿真,结果表明:在电源电压为3.3V时,电路的最高工作速率可以达到10Gbit/s,电路功耗约为800mW.     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.     

GaAsSb/InAlAs PA DHBTs Grown by Production MBE

The epi material growth of GaAsSb based DHBTs with InAlAs emitters are investigated using a 4 × 100mm multi-wafer production Riber 49 MBE reactor fully equipped with real-time in-situ sensors including an absorption band edge spectroscope and an optical-based flux monitor. The state-of-the-art hole mobilities are obtained from 100nm thick carbon-doped GaAsSb. A Sb composition variation of less than ± 0.1 atomic percent across a 4 × 100mm platen configuration has been achieved. The large area InAlAs/GaAsSb/InP DHBT device demonstrates excellent DC characteristics,such as BVCEO＞6V and a DC current gain of 45 at 1kA/cm2 for an emitter size of 50μm × 50μm. The devices have a 40nm thick GaAsSb base with p-doping of 4. 5 × 1019cm-3 . Devices with an emitter size of 4μm × 30μm have a current gain variation less than 2% across the fully processed 100mm wafer. ft and fmax are over 50GHz,with a power efficiency of 50% ,which are comparable to standard power GaAs HBT results. These results demonstrate the potential application of GaAsSb/InP DHBT for power amplifiers and the feasibility of multi-wafer MBE for mass production of GaAsSb-based HBTs.     

Technology innovation and process integrations for sub-100nm gate patterning

This paper presents a brief overview of the Applied Centura(R)DPS(R)system,configured with silicon etch DPS Ⅱ chamber, with emphasis on discussing tuning capability for CD uniformity control. It also presents the studies of etch process chemistry and film integration impact for an overall successful gate patterning development. Discussions will focus on resolutions to key issues, such as CD uniformity, line-edge roughness, and multilayer film etching integration.     

White organic light-emitting devices based on fac tris（2- phenylpyridine） iridium sensitized 5,6,11,12-tetraphenylnap -hthacene

We have fabricated the white organic light-emitting devices （WOLEDs） based on 4,4＇ -bis（2,2 -diphenyl vinyl）-1,1＇ - biphenyl （DPVBi） and phosphorescence sensitized 5,6,11,12,-tetraphenylnaphthacene （rubrene）. The device structure is ITO/2T-NATA （20 nm）/NPBX （20 nm）/CBP： x%Ir（ppy）3：0.5% rubrene （8 nm）/NPBX （5 nm）/DPVBi （30 nm）/Alq（30 nm）/LiF（0.5 nm）/A1. In the devices, DPVBi acts as a blue light-emitting layer, the rubrene is sensitized by a phosphorescent material, fac tris （2-phenylpyridine） iridium [Ir（ppy）3], acts as a yellow light-emitting layer, and N,N＇ -bis- （1-naphthyl）- N,N＇ -diphenyl -1, 1＇ -biphenyl-4,4＇ -diamine （NPBX） acts as a hole transporting and exciton blocker layer, respectively. When the concentration of Ir （PPY）3 is 6wt%, the maximum luminance is 24960 cd/m^2 at an applied voltage of 15 V, and the maximum luminous efficiency is 5.17 cd/A at an applied voltage of 8 V.     

Complete approach to automatic identification and subpixel center location for ellipse feature

To meet the need of automatic image features extraction with high precision in visual inspection, a complete approach to automatic identification and sub-pixel center location for similar-ellipse feature is proposed. In the method, the feature area is identified automatically based on the edge attribute, and the sub-pixel center location is accomplished with the leastsquare algorithm. It shows that the method is valid, practical, and has high precision by experiment. Meanwhile this method can meet the need of instrumentation of visual inspection because of easy realization and without man-machine interaction.     

小角度扩展相关性近似算法分析

本论文提出一种在多天线MIMO信道相关性建模中小角度扩展近似理论算法,并应用于分析MIMO系统性能。分析中分别对三种不同角能量分布情况下的空间相关性研发快速近似计算法,并同时提出双模(Bi-Modal)角能量分布情况下的近似运算。通过分析这些新方法的近似效率,可以得到计算简单、复杂度低、而且符合实际的MIMO相关信道矩阵,对系统级的快速高效计算法的研究和系统级的评估以及误差分析具有重要的意义。     

Noise character analysis and the restraint of self-pulsation laser diodes

We calculate the Langevin noise sources of self-pulsation laser diodes, analyze the effects of active region noise and saturable-absorption region noise on the power fluctuation as well as period fluctuation, and propose a novel method to restrain the noise effects. A visible SIMULINK model is established to simulate the system, The results indicate that the effects of noise in absorption region can be ignored; that with the increase of DC injecting current, the noise effects enhance power jitter, and nevertheless, the period jitter is decreased; and that with external sinusoidal current modulating the self-pulsation laser diode, the noise-induced power jitter and period jitter can be suppressed greatly. This work is valuable for clock recovery in all-optical network.