共查询到20条相似文献，搜索用时 93 毫秒
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带有复合掺杂层集电区的InP/InGaAs/InP DHBT直流特性分析 总被引：1，自引：0，他引：1
设计了一种新结构InP/InGaAs/InP双异质结双极晶体管(DHBT),在集电区与基区之间插入n -InP层,以降低集电结的导带势垒尖峰,克服电流阻挡效应.采用基于热场发射和连续性方程的发射透射模型,计算了n -InP插入层掺杂浓度和厚度对InP/InGaAs/InP DHBT集电结导带有效势垒高度和I-V特性的影响.结果表明,当n -InP插入层掺杂浓度为3×1019cm-3、厚度为3nm时,可以获得较好的器件特性.采用气态源分子束外延(GSMBE)技术成功地生长出InP/InGaAs/InP DHBT结构材料.器件研制结果表明,所设计的DHBT材料结构能有效降低集电结的导带势垒尖峰,显著改善器件的输出特性. 相似文献
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设计了一种新结构InP/InGaAs/InP双异质结双极晶体管(DHBT),在集电区与基区之间插入n+-InP层,以降低集电结的导带势垒尖峰,克服电流阻挡效应.采用基于热场发射和连续性方程的发射透射模型,计算了n+-InP插入层掺杂浓度和厚度对InP/InGaAs/InP DHBT集电结导带有效势垒高度和I-V特性的影响.结果表明,当n+-InP插入层掺杂浓度为3×1019cm-3、厚度为3nm时,可以获得较好的器件特性.采用气态源分子束外延(GSMBE)技术成功地生长出InP/InGaAs/InP DHBT结构材料.器件研制结果表明,所设计的DHBT材料结构能有效降低集电结的导带势垒尖峰,显著改善器件的输出特性. 相似文献
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Yang K. Gutierrez-Aitken A.L. Zhang X. Bhattacharya P. Haddad G.I. 《Electron Devices, IEEE Transactions on》1996,43(9):1470-1472
An HBT model for InP-based single HBTs (SHBTs) was developed based on the conventional Gummel-Poon large-signal BJT model available in HSPICE. Several typical characteristics observed from InP-based SHBTs, such as soft breakdown and collector transit-time delay effects, were modeled through a macro modeling approach. Excellent agreement has been achieved between the experimental and calculated results based on the model 相似文献
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Daekyu Yu Kyungho Lee Bumman Kim Ontiveros D. Vargason K. Kuo J.M. Kao Y.C. 《Electron Device Letters, IEEE》2003,24(6):384-386
InP-based single heterojunction bipolar transistors (SHBTs) for high-speed circuit applications were developed. Typical common emitter DC current gain (/spl beta/) and BV/sub CEO/ were about 17 and 10 V, respectively. Maximum extrapolated f/sub max/ of 478 GHz with f/sub T/ of 154 GHz was achieved for 0.5 /spl times/ 10 /spl mu/m/sup 2/ emitter size devices at 300 kA/cm/sup 2/ collector current density and 1.5 V collector bias. This is the highest f/sub max/ ever reported for any nontransferred substrate HBTs, as far as the authors know. This paper highlights the optimized conventional process, and the authors have great hopes for the process that offers inherent advantages for the direct implementation to high-speed electronic circuit fabrication. 相似文献
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The breakdown and speed characteristics of InP/InGaAs single and double HBTs are presented. Temperature-dependent two- and three-terminal measurements suggest that avalanche impact ionization is the dominant breakdown mechanism in InGaAs collector HBTs. Monte Carlo techniques and 1D drift-diffusion modeling are used for speed and breakdown simulation, respectively. Special doping profiles are evaluated for improving the breakdown-speed characteristics of single HBTs (SHBTs) with conventional uniformly doped InGaAs collectors. Double HBTs (DHBTs) outperform all SHBTs in terms of speed-breakdown tradeoffs as long as they use graded base-collector junctions or they operate under sufficiently high collector-emitter voltage conditions. A cutoff frequency of 200 GHz was found to be feasible with graded DHBTs, and breakdown voltages up to 4.6 V were evaluated with a 3000-Å-thick collector. Nongraded DHBTs can be optimized to perform better in terms of speed-breakdown tradeoffs provided that a high collector doping is used 相似文献
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研制成功了一种无微空气桥的亚微米InP基异质结双极晶体管(HBT).发展了小于100nm的发射极侧向腐蚀工艺,实现了亚微米的InP基HBT.发射极宽度的减小有效提高了频率特性,发射极面积为0.8μm×15μm的HBT的电流增益截止频率达到了238GHz.发展了基极-集电极的侧向过腐蚀工艺,有效减小了结面积,提高了最大振荡频率.Kirk电流密度达到了3.1mA/μm2.据我们所知,电流增益截止频率是目前国内三端器件中最高的,Kirk电流密度是国内报道的HBT中最高的.这对于HBT器件在超高速电路中的应用具有十分重要的意义. 相似文献
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Jie Lin Andreas Leven N. G. Weimann Y. Yang R. F. Kopf R. Reyes Y. K. Chen 《Photonics Technology Letters, IEEE》2007,19(5):270-272
An InP-based high-speed optical modulator is presented. The Schottky-i-n waveguide structure on InP-based material was used to reduce the switching voltage Vpi and the excess loss, while maintaining high-modulation efficiencies. To minimize residual amplitude modulation and to improve power handling capability, the bulk electrooptic effect in InGaAlAs was utilized for phase shifting. As a result, a simple structure InAlAs-InGaAlAs Mach-Zehnder optical modulator with traveling-wave electrodes was fabricated and characterized. This device achieved a switching voltage Vpi of 3.6 V, extinction ratio (>23 dB) and high-speed operation at 1.55-mum wavelength 相似文献
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Hong Wang Hong Yang Wah-Peng Neo Radhakrishnan K. Chee Leong Tan 《Electron Devices, IEEE Transactions on》2003,50(12):2335-2343
Recent efforts are being focused on improving the breakdown of InP-based heterojunction bipolar transistors (HBTs) towards high-power applications. A fundamental understanding of the temperature dependence of breakdown and its physics mechanism in these devices is important. In this work, a detailed characterization of temperature-dependent collector breakdown behavior in InP DHBTs (DHBTs) with an InGaAs/InP composite collector is carried out. A physics model for the prediction of temperature-dependent breakdown in lnP/InGaAs composite collector is developed. We found that, although the variation of impact ionization coefficient due to the change of temperature may affect the device breakdown, the temperature-dependence of breakdown in the lnGaAs/InP composite collector could be significantly affected by the carrier transport in the InGaAs region. As temperature is increased, the increase in the contribution of InGaAs layer to the junction breakdown due to the reduction of electron energy relaxation length could be the root cause of the reduction of junction breakdown voltage. Good agreement between the physics model and experimental data demonstrate the validities of the proposed physics model to predict the temperature dependent breakdown characteristics for InP DHBTs. 相似文献
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《Lightwave Technology, Journal of》2009,27(3):343-355
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